Largan Precision, a leading smartphone lens manufacturer, is facing challenges due to the increasing influence of AI in the smartphone market and its impact on talent recruitment in the semiconductor industry
Innolux Corporation, a leading display panel manufacturer, is undergoing a significant transformation as it ventures into the semiconductor field with its Fan-Out Panel Level Packaging (FOPLP) technology. The company is closing its generation 5.5 TFT-LCD plant and has garnered attention due to its collaboration with TSMC on FOPLP development and potential interest from Micron Technology in acquiring the aforementioned plant
RISC-V, an open standard instruction set architecture, has garnered global attention due to its royalty-free nature and adaptability for custom hardware development
Nvidia dominates the market for AI chips for training and deploying Large Language Models (LLMs) and its pricing power is reflected in gross margins as high as 78%, compared to competitors Intel and AMD's 41% and 47% gross margins, respectively, in the latest quarter. So how many high-end GPU chips did Nvidia sell
According to a recent Reuters report, Apple's "Apple Intelligence" technology has been rumored to use Google's Tensor Processing Unit (TPU) accelerators for early-stage training, illustrating the close cooperation between Apple and Google in the AI sector. Apple may even be using Google Cloud services
In March, China Resources announced the stunning news of acquiring SMIC's shares of JCET Group, a packaging and testing firm invested by China's National IC Industry Investment Fund (the "Big Fund"). The deal is a delicately calculated move rendering China Resources control over JCET and Sandisk
Intel CEO Pat Gelsinger's keynote at COMPUTEX 2024, specifically mentioned the collaboration with TSMC, which allowed Intel to realize the mass production of Lunar Lake in advancing AI PCs. This move raises questions about whether it is an attempt to repair the relationship with TSMC
Semiconductor foundry companies have started to compete in the 2nm process shortly after their 3nm production lines started humming to mass produce for customers. There is something to learn from Samsung's 6-month lead to producing 3nm wafers with Gate-All-Around (GAA) architecture in June 2022
The long-rumored third phase of China's national semiconductor fund, commonly known as "the Big Fund," has finally been officially announced. The fund scale of CNY344 billion (US$47.5 billion) makes it the largest funding project in China's chip history and far exceeds previous market expectations
Announcing a US$47.5 billion funding for Phase 3 of the National IC Industry Investment Fund (the "Big Fund"), China's next move is under the eye of global chip players