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Wednesday 9 July 2025
TRI unveils new multi-camera AOI, TR7500 SIII Ultra
Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces the new TR7500 SIII Ultra. The new Multi Camera AOI solution features advanced inspection technology, delivering industry-leading speed and precision for electronics manufacturing
Hardware Security
Hardware security is crucial for providing robust protection for sensitive data in our increasingly interconnected environment. Relying solely on software protection is insufficient to prevent the rising threats of remote cyberattacks.
Thursday 21 August 2025
DEKRA Automotive EMC Laboratory in Taiwan Recognized by Stellantis
DEKRA's Automotive EMC Laboratory in Taiwan has been officially approved by Stellantis, making it the third DEKRA site worldwide alongside Italy and Korea. This milestone underscores DEKRA's pivotal role in the global automotive EMC testing landscape.Stellantis, one of the world's largest automotive groups, operates a rigorous laboratory approval program to ensure partners meet the highest technical standards. With this approval, DEKRA Taiwan is now authorized to provide EMC testing for 16 Stellantis brands, including Chrysler, Citroen, Fiat, Opel, and Peugeot. The recognition allows DEKRA to deliver reliable EMC testing support to the global supply chain, helping OEMs and suppliers accelerate product validation, reduce time-to-market, and benefit from localized expertise in the Asia-Pacific region.The Stellantis approval adds to DEKRA's extensive portfolio of OEM recognitions worldwide. In Taiwan, DEKRA's Automotive EMC Laboratory is also approved to provide testing services for GM, Volkswagen, and Jaguar & Land Rover. Meanwhile, DEKRA Korea's EMC Laboratory is recognized by Ford, GM, and Stellantis. Together, these approvals highlight DEKRA's breadth and depth in serving global automotive manufacturers, and reinforce the group's ability to combine its worldwide laboratory network with regional expertise to provide comprehensive local support."We are honored to receive Stellantis' recognition. This approval is a strong endorsement of our team's expertise and commitment, and it empowers DEKRA Taiwan to better support customers in automotive electronics, intelligent mobility, and electric vehicles. Our focus is on helping supply chain partners speed up validation, shorten time-to-market, and strengthen their global competitiveness," said Aaron Lee, Managing Director of DEKRA Taiwan.DEKRA Taiwan's Automotive EMC laboratory has developed a strong reputation for serving international OEMs, with capabilities spanning intelligent transportation systems, wireless communication, and electric vehicles. The new Stellantis approval further strengthens its strategic role within DEKRA's global laboratory network and ensures full alignment with international technical standards.Beyond individual testing projects, DEKRA delivers comprehensive one-stop EMC services. These include EMC testing, wireless certification, OEM specification verification, and Global Market Access (GMA) support. With combined automotive and military EMC testing capabilities, DEKRA helps clients efficiently meet OEM requirements, streamline validation, and accelerate entry into global markets.DEKRA Taiwan's Automotive EMC Laboratory, approved by Stellantis, supporting EMC testing for global automotive OEMs.
Tuesday 19 August 2025
Hardware Security Risks in the AIoT Era: Ubiquitous Flash Memory, Ubiquitous Threats
With the widespread adoption of AIoT (Artificial Intelligence and Internet of Things) applications—from smart home devices to smart manufacturing, connected vehicles, smart cities, infrastructure and defense systems—the reliance of digital devices on flash memory for code storage has rapidly expanded. Memory is no longer just a medium for data storage; it now serves as the carrier for firmware, the repository for AI models, and the guardian of identity and authorization data. Ensuring security of flash memory directly determines the trustworthiness of the devices themselves.Risks from Real World Applications-A smart doorbell was compromised and used for remote surveillance of households by hackers.-A smart camera product line was infected with malware due to poor memory protection, causing large-scale corporate network breaches.-A battlefield drone was hijacked. Investigation revealed its unprotected flash memory exposed flight parameters and credentials.When memory becomes the convergence point for both data and instructions, a single breach can collapse all layers of defense.The Changing Role of Memory in AI SystemsThe introduction of AI, especially in edge devices, has made the role of memory even more critical. Today, memory not only stores data but also holds AI model parameters and behavioral decision logic. The requirements for memory integrity and non-repudiation have increased significantly. If AI models are tampered with, it can lead to erroneous decisions or even malicious behavior.Moreover, AI-driven real-time responses demand that memory supports lower latency and higher confidentiality. Traditional security designs focused solely on data protection can no longer meet the needs of modern devices.The Challenge of Compliance and the Surge of StandardsGlobal regulations around IoT and industrial device cybersecurity are intensifying. The EU's Cyber Resilience Act, the U.S. IoT Cybersecurity Improvement Act, ISO 21434 for automotive systems, and IEC 62443 for industrial control systems all require strong confidentiality and data integrity—even at the memory level. Flash memory must now address both functional safety and cybersecurity challenges.To learn the latest cybersecurity regulations and trends, download the hardware security whitepaper for free.Rethinking Memory Security AssumptionsHistorically, memory was treated as a peripheral component, with security left to the main controller. But today's attackers use physical access tools, firmware injections, and interface-level attacks to exploit memory. Flash memory must now adopt active defense mechanisms, including:- Hardware-level access control- Data encryption and firmware authentication- Event logging and anomaly detection- Logic-level separation and multi-factor verificationRedefining the Role of Secure Flash MemoryTo truly counter next-generation risks, flash memory should integrate secure logic circuits, providing secure boot, firmware authentication, key management, encryption engines, and access control. Such designs greatly reduce the risk of edge devices being compromised, controlled, or having their data stolen.In product design, special emphasis shall be placed on the concept of 'establishing a root of trust' through Secure Boot and key storage mechanisms. This ensures that every device boot starts from trusted code, preventing malicious firmware implants. Key storage shall be implemented in a pure hardware architecture, isolating sensitive information in inaccessible secure zones, significantly enhancing both physical and logical security.For firmware security, compliance to firmware authentication and resilience design standards such as NIST SP 800-193. This means not only verifying firmware integrity at boot, but also automatically recovering to a safe state in the event of an attack or anomaly, ensuring continuous device operation and protection from malicious software.Furthermore, secure storage solutions shall use a pure hardware architecture, requiring no external software or controller assistance, maintaining high security and performance even in harsh environments.To address supply chain security challenges, advanced digital signature technology is needed, ensuring that every firmware and software update from the manufacturer to the end device can be verified for source and integrity, providing comprehensive secure supply chain support.To meet post-quantum threats, advanced encryption standards such as CNSA 2.0 (Commercial National Security Algorithm Suite 2.0) compliance is necessary, ensuring that the software update architecture complies with the latest international cybersecurity regulations and meets the needs of high-security applications in government, defense, and automotive sectors.Winbond W77Q / W77T Secure Solutions and Industry PracticeAs a provider of secure logic circuit flash memory solutions, our products have been successfully adopted across diverse applications, including computer peripherals, video conferencing equipment, servers, AI edge servers, and automotive modules. Our designs maintain logical compatibility with existing market architectures to ensure smooth integration and low migration cost.Our solutions integrate LMS (Leighton-Micali Signature) advanced digital signature technology for PQC (post-quantum cryptography) needs.Our security architecture is also certified under leading global standards including Common Criteria (CC), FIPS 140-3, SESIP, PSA, IEC 62443, ISO 21434, and ISO 26262—offering customers a reliable and future-ready foundation.Safeguarding Human-Centered Trust at the Technological EdgeIn the AIoT era, memory security is no longer just about storage—it is the foundation of system-wide trust. From household devices to tactical drones, memory holds more than data; it protects privacy, drives enterprises, and underpins societal resilience.As a Secure Flash Memory solution provider with dedicated logic design, we understand the profound responsibility behind technology. Our solutions offer downward compatibility with mainstream architectures, while meeting stringent global security standards.True innovation is not just about what we can do—but what we can trust. We are committed to embedding security into every smart node and collaborating with partners, developers, and standards bodies to ensure technology continues to serve human values.To learn more about Winbond's advanced security solutions, visit Winbond's website or contact Winbond directly, or download the latest Hardware Security White Paper.
Monday 18 August 2025
xMEMS Labs Announces 3rd Annual 'xMEMS Live Asia' Seminar Series in Taipei and Shenzhen
xMEMS Labs, the global leader in solid-state MEMS speakers and micro-scale thermal solutions, today announced the return of its highly anticipated xMEMS Live Asia seminar series, taking place September 16 in Taipei and September 18 in Shenzhen.Now in its third year, xMEMS Live Asia brings together engineers, product designers, system architects and company executives to explore how MEMS-based audio and active thermal management technologies are redefining the design and performance of next-generation AI interface devices – from AI glasses, smartphones, headphones and earbuds to SSDs, optical transceivers and rack servers in the data center.This year's one-day seminars will center on live product demonstrations of Sycamore, xMEMS' revolutionary thin and lightweight full-range MEMS loudspeaker, and cooling, the world's first solid-state air pump-on-a-chip delivering active thermal management in devices where conventional fans can't go.Attendees will experience:1) AI glasses featuring Sycamore speakers and cooling for discreet, high-fidelity sound and heat management in ultra-thin eyewear2) Next-gen headphones featuring full-range Sycamore, paired with cooling to deliver the world's first active earcup ventilation3) SSD thermal management featuring cooling for higher sustained data transfers4) Plus a smartwatch with Sycamore, TWS earbud solutions with Cypress and Lassen, and thermal demos showcasing cooling at both chip and system levelsIn addition to hands-on demos, the seminar features deep-dive technical sessions from xMEMS engineers, covering performance testing, system integration, and product optimization for Sycamore and cooling across a variety of applications. Dedicated sessions on headphone and TWS implementations will offer further insight into how xMEMS solutions deliver superior fidelity, form factor reduction, and system-level benefits for consumer electronics."AI is changing how we interface with devices while also increasing processor and thermal loads," said Joseph Jiang, CEO of xMEMS Labs. "At xMEMS Live Asia, we'll demonstrate how Sycamore and cooling technologies are enabling a new generation of thinner and lighter-weight conversational AI interfaces and active thermal management for improved on-device intelligence and system performance."Registration is now open. Seating is limited. Click here for English, here for Simplified Chinese, or here for Traditional Chinese. Reserve your spot today to experience the future of conversational AI interfaces and AI thermal management!For more information about xMEMS and its solid-state solutions, visit xmems.com.Showcasing Live Demonstrations of AI Interface and Thermal Device Innovation Enabled by Sycamore and cooling on September 16 in Taipei and September 18 in Shenzhen.