The AI surge is anticipated to substantially boost demand for advanced packaging, which is already in short supply, according to sources at backend houses.
ASE Technology Holding (ASEH) will be stepping up its advanced packaging and testing capabilities in the second half of 2024, when a new cycle begins after the completion of inventory...
According to industry sources, IC material distributors anticipate customer inventory adjustments will end in the first half of 2024, with AI expected to accelerate growth in the...
With TSMC and ASE Holdings (ASEH) gearing up to build additional fab capacities for advanced packaging, relevant supply chain participants are optimistic about growth driven by their...
Long-term prospects are bright for advanced packaging technology, thanks to robust demand for AI and HPC chips, according to sources at backend houses.
Generative AI was behind Nvidia's 240% surge in market cap in 2023, and the effect also trickled down to foundry manufacturers and packaging & testing service providers in the...
Semiconductor demand is improving gradually, with IC packaging and testing houses expressing optimism about market prospects for 2024 and focusing on AI chips and Co-Packaged Optics...
OSAT Advanced Semiconductor Engineering (ASE) will acquire facilities from its fully-owned subsidiary ASE Test to boost packaging capacity, according to the former's parent company,...
OSAT ASE Technology Holdings (ASEH) is on track to increase sales in 2024 as a result of strong demand for advanced packaging and a recovery in demand from consumer device applications,...
Amid the ongoing geopolitical tensions that hit the global chip supply chain, Taiwan-based semiconductor equipment and material suppliers are accelerating their investments in Mala...
OSATs may see inventory adjustments last into the first half of 2024, longer than other semiconductor sectors, but demand for AI chips will fuel their growth next year, according...
