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Friday 14 February 2025
ASE forecasts packaging market growth despite sluggish 1Q25
OSAT ASE Technology Holding (ASE) reported its advanced packaging sales exceeded US$600 million in 2024 and projects reaching nearly US$1 billion in 2025. However, citing seasonal...
Thursday 13 February 2025
Benefiting from urgent AI and PC demand, ASE sees robust start in 1Q25
OSAT leader ASE expects to enjoy a particularly strong first quarter of 2025, thanks to an influx of urgent orders for AI and PC applications. Advanced packaging is expected to drive...
Tuesday 11 February 2025
Taiwan OSAT firms set to benefit from TSMC's enforcement of BIS whitelist
TSMC is reportedly enforcing US chip export restrictions by requiring Chinese IC design houses to use BIS-whitelisted OSAT facilities for back-end processing of sub-16nm chips. The...
Monday 10 February 2025
Apple begins M5 chip mass production with TSMC and key suppliers from Japan, South Korea
Taiwan Semiconductor Manufacturing Company (TSMC) strengthens its dominance in advanced semiconductor manufacturing as Apple begins mass production of the M5 chip for MacBook and...
Saturday 8 February 2025
ASE, a semiconductor powerhouse, faces leadership uncertainty as chairman's heir passes away at 46
On February 7, 2025, Advanced Semiconductor Engineering (ASE) announced the passing of corporate director Rutherford Chang at the age of 46. As the only son of ASE chairman Jason...
Wednesday 15 January 2025
Nvidia CEO visits SPIL as first stop in Taiwan
Nvidia CEO Jensen Huang's first stop in Taiwan is confirmed to be Taichung. According to an announcement from ASE Holdings' subsidiary SPIL, on the afternoon of January 16, Huang...
Wednesday 8 January 2025
Nvidia RTX 50 GPUs to fuel sales growth at Taiwan OSATs in 2025
The launch of Nvidia's GeForce RTX 50 is expected to drive growth at Taiwan's packaging and testing houses in the supply chain of the latest GPU series in 2025, according to industry...
Tuesday 31 December 2024
ASE joins hands with Pegatron, substrate manufacturers for AI packaging substrate inspection
Leading OSAT firm ASE has teamed up with leading substrate makers, major AI server manufacturer Pegatron, and others to develop an AI visual inspection system, aimed at accelerating...
Tuesday 10 December 2024
PGC partners with TSMC and ASE to expand ASIC turnkey services in North America
PGC (Progate Group Corporation) has recently teamed up with North American strategic allies to meet the growing demand for advanced process technologies in AI, high-performance computing...
Monday 11 November 2024
ASE expands to Mexico with first North American packaging facility post-US election
ASE Holdings' North American subsidiary, ISE Labs, has announced a land acquisition in Guadalajara's Axis 2 industrial park, marking its first packaging facility expansion outside...
Friday 1 November 2024
ASEH steps up advanced packaging capacity expansion
OSAT ASE Technology (ASEH) has stepped up its pace of capacity expansion for advanced packaging to meet demand for AI device applications, which it anticipates to be a continual growth...
Wednesday 30 October 2024
Global CoWoS and CoWoS-like packaging capacity demand to surge 113% on year in 2025, says DIGITIMES Research
Global demand for Chip-on-Wafer-on-Substrate (CoWoS) and CoWoS-like packaging capacity will likely grow by 113% annually in 2025, driven by robust demand for cloud AI accelerators,...
Tuesday 29 October 2024
TSMC's go-to partner for AI demand: ASE's SPIL invests US$13 million to boost CoWoS capacity
TSMC is strengthening its partnerships with OSAT providers, outsourcing key stages of its CoWoS packaging technology. ASE's subsidiary Siliconware Precision Industries (SPIL) has...
Tuesday 22 October 2024
Bright future ahead: advanced packaging takes center stage as traditional OSAT providers pivots
AI-driven demand has propelled TSMC's revenue growth in the latter half of 2024. As advanced packaging margins approach those of chip manufacturing, traditional OSAT providers face...
Friday 11 October 2024
ASE to boost advanced packaging capacity with new K28 plant
Advanced Semiconductor Engineering (ASE) is intensifying its development in the advanced packaging sector by establishing the new K28 plant in Kaohsiung, southern Taiwan. A groundbreaking...