When Marvell CEO Matt Murphy asked ASE Group CEO Tien Wu what makes Taiwan's technology ecosystem unique — and why it is so hard to replicate elsewhere — the answer was...
WinWay Technologies, a major test interface provider, followed ASE Holdings in holding a groundbreaking ceremony for its new plant at the Renwu Industrial Park in southern Taiwan....
Advanced Semiconductor Engineering (ASE) has unveiled its industry-first automated panel-level packaging (PLP) system, a development poised to reshape global artificial intelligence...
AMD CEO Lisa Su arrived in Taiwan on May 20, 2026, on a private jet and largely followed the same itinerary as her April 2025 visit, including a meeting with TSMC, a technology forum...
Taiwan's semiconductor ecosystem is getting an unexpected lift from the AI server investment boom. Supply pressure that began in high-bandwidth memory and leading-edge process technology...
Advanced Semiconductor Engineering (ASE) and PCB manufacturer Wus Printed Circuit are teaming up to build a new packaging facility in southern Taiwan, as the world's largest chip assembler...
Siliconware Precision Industries Co., Ltd. (SPIL), a subsidiary of ASE Technology Holding, acquired two Nanke-area plants in 2026 from HannStar Display and its affiliate HannsTouch...
Global outsourced semiconductor assembly and test (OSAT) leader ASE Technology Holding (ASEH) held an earnings call on April 29, reporting a robust first quarter of 2026 that broke...
ASE Technology Holding Co. raised its 2026 capex plan to as much as US$8.5 billion as demand for advanced packaging and testing services exceeded expectations, the company said.
Advanced Semiconductor Engineering (ASE) and the National Institute of Cyber Security signed a memorandum of understanding on April 28 to establish a joint cyber defense, intelligence...
Global outsourced semiconductor assembly and test (OSAT) leader ASE Technology Holding (ASEH) held its 2025 ASE Supplier Award ceremony, inviting more than 100 suppliers of packaging...
The semiconductor packaging equipment sector is experiencing order shifts linked to significant executive changes at a key Taiwanese supplier, raising concerns over TSMC's chip-on-wafer-on-substrate...
AI and high-performance computing (HPC) are driving increasingly stringent chip performance demands, marking a pivotal shift in advanced packaging technology from traditional wafers...
Taiwan's outsourced semiconductor assembly and test industry is expanding rapidly, driven by AI, high-performance computing, and memory demand. Global supply chains may face tighter...
