Cloud service providers' demand for application-specific integrated circuits, or ASICs, is increasingly locked in as advanced process nodes, advanced packaging, and component supply...
As AI clusters continue to scale, traditional interconnect architectures are facing new limits in bandwidth, power efficiency, and system integration. Co-Packaged Optics is emerging...
AI computing's massive demand for infrastructure is making interconnect and laser technologies key to overcoming power and bandwidth limits, prompting silicon photonics unicorn Lightmatter...
Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices...
AMD said on May 21 that it plans to invest more than US$10 billion across Taiwan's semiconductor ecosystem to deepen strategic partnerships and expand advanced packaging capacity for...
Indium phosphide (InP) and other compound semiconductors are taking on a bigger role as demand rises for highly efficient light emission and ultra-high-frequency transmission. Their...
Micron's senior vice president, Jeremy Werner, told The Circuit Podcast that memory has become a strategic bottleneck for data-center inference, warning that insufficient memory can...
In the high-stakes world of global security and emergency response, the shift toward "video-centric" operations has created a massive technical bottleneck: the struggle to transmit...
SoftBank's memory unit SAIMEMORY is preparing to present a new 3D DRAM technology developed with Intel, as the AI hardware industry seeks ways to ease the power and heat constraints...
As AI shifts from training to inference and from single-task use to multi-agent collaboration, South Korea's semiconductor industry is seeking to recast the market around memory rather...
Taiwan President Lai Ching-te has pledged to transform Taiwan into an "AI island," with a key focus on developing an all-photonic network (APN). The National Science and Technology...
China-based memory interface chip supplier Montage Technology reported solid first-quarter 2026 results, supported by rising demand for AI servers and accelerating adoption of next-generation...
The CPO market is projected to grow at a 142% CAGR from 2026 to 2030 (excl. ELS). As AI clusters scale and 3.2T data rates push copper to its limits, CPO is emerging as a key solut...
