Samsung Electronics has announced the immediate availability of its silicon-proven 3D IC packaging technology, eXtended-Cube (X-Cube), for today's most advanced process nodes.
Taiwan-based Chief Telecom's cloud computing and Internet datacenter (IDC) businesses are expected to see growths thanks to uprising demand from the stay-at-home economy in the wake...
Far EasTone Telecommunications (FET), Delta Electronics and Microsoft Taiwan have teamed up to set up Taiwan's first 5G-enabled pilot smart manufacturing plant at Delta's production...
Taiwan's direct Internet connection with 13 countries (including Hong Kong and Macau) reached total bandwidth of 3,683.153Gbps as of the end of first-quarter 2020, increasing 3.30%...
TSMC has seen utilization of its chip-on-wafer-on-substrate (CoWoS) packaging capacity rise substantially in the second quarter of 2020, and now runs the packaging production lines...
Backend service firms have seen stable orders for processing chips for TVs, set-top boxes (STB), game consoles, cloud servers, and IP network cameras, while demand for packaging smartphone...
Micron Technology has begun sampling what the company claims is the industry's first universal flash storage (UFS) multichip package (uMCP) with low-power DDR5 (LPDDR5) DRAM. The...
Micron Technology has announced mass production of what the company claims is the world's first low-power DDR5 DRAM that will be used in the soon-to-be-released Xiaomi Mi 10 smartp...
To improve 5G spectrum's usage efficiency, 3GPP has brought up several solutions with dynamic spectrum sharing (DSS) being one of the major technologies expected to be used when transitioning...
Taiwan's direct Internet connection with 12 countries/cities reached total bandwidth of 3,565.368Gbps as of the end of fourth-quarter 2019, increasing 4.84% sequentially and 28.61%...
The global market for memory and processing semiconductors used in artificial intelligence (AI) applications will soar to US$128.9 billion in 2025, three times the US$42.8 billion...
Memory design house Etron Technology has teamed up with US-based FGPA chipmaker Lattice Semiconductor on developing new miniaturized AI+DRAM platform for applications to terminal...
Baidu and Samsung Electronics have announced jointly that Baidu's first cloud-to-edge AI accelerator, Baidu Kunlun, has completed its development and will be mass-produced early next...
When planning the rollouts of their 5G networks, Taiwan's telecom operators should not focus on factors such as the extended cost for network coverage, but rather on whether the loading...
