Nvidia is expected to advance the rollout of a downgraded version of its AI chips, dubbed AI 800, for shipments to Chinese clients in response to restrictions on its China-bound sales...

China's top cloud service provider Alibaba Cloud (AliCloud) has recently announced that its self-developed cloud-native processor Yitian 710 has entered large-scale commercial applications...

SK Hynix has announced its DRAM and CXL solutions have been validated with AMD's just-unveiled EPYC 9004 series processors.

Global NAND flash makers are on track to start a new round of competition in producing 3D NAND chips with over 200 layers after Micron Technology announced commercial production of...

Taiwan's suppliers of optical communications devices including Browave, EZconn, APAC Opto Electronics and Apogee Optocom have all posted impressive revenue and profit gains for the...

Micron Technology has kicked off volume production of what the company claims is the world's first 232-layer NAND flash memory.

The transition to DDR5 memory in the data center sector will be taking place in 2022, and Micron Technology is gearing up for the robust demand, according to Sumit Sadana, executive...

Nvidia has recently completed its performance evaluation of SK Hynix's HBM3 samples, according to the memory chipmaker. SK Hynix will provide HBM3 for Nvidia systems expected to ship...

System integration capability is increasingly needed in packaging HPC chips for AI, networking and other applications that accelerate digital transformation at enterprises and people's...

Samsung Electronics, SK Hynix and Micron Technology held a combined 94% share of the global DRAM market in 2021, with Samsung and SK Hynix collectively taking up 71.3% of the market,...

While their consumer IC packaging business continues to slow down, Taiwan OSATs have received increasing inquiries about chiplet manufacturing solutions from clients in the US, China...

The role of memory chips has become increasingly important in heterogeneous integration, and Winbond Electronics is working with potential customers in multiple related design projects,...

Silicon Labs, a US-based wireless SoC and MCU provider, continues to work closely with its Taiwan-based foundry and OSAT partners to improve its delivery lead times, according to...

TSMC has set a timetable to move its 2nm GAA process to production in 2025 while commercializing its 3nm FinFET process with improved yield rates in the second half of 2022, with...

OSAT ASE Technology with its fan-out chip on substrate (FOCoS) packaging technology is gearing up for a boom in HPC chip demand, eyeing orders from major processor vendors including...