News tagged bandwidth at DIGITIMES

NEWS TAGGED BANDWIDTH

Wednesday 18 February 2026

Samsung advances LPDDR5X-PIM, signaling memory's new role in AI computing

Artificial intelligence is shifting the center of gravity in semiconductors. For decades, processors defined performance. Now memory bandwidth,...

Friday 13 February 2026

Citi flags post-HBM shift as edge memory, HBF advance

A Citi analyst said the next phase of artificial intelligence (AI) memory demand will extend beyond high-bandwidth memory (HBM), pointing to emerging opportunities in physical AI devices...

Friday 13 February 2026

SEMICON Korea: Samsung pushes hybrid bonding HBM, SK Hynix bets on platform AI

SEMICON Korea 2026, held in Seoul from February 11–13, brought senior executives from Samsung Electronics and SK Hynix to outline their AI-era memory R&D strategies. Samsung...

Saturday 7 February 2026

Microsoft's Maia 200 chip targets AI inference cost advantage, not Nvidia rivalry

Microsoft recently unveiled its second-generation custom AI chip, Maia 200, more than two years after its previous generation. The Maia chip's update cycle lags behind the rapid iterations...

Tuesday 3 February 2026

SK Hynix achieves major breakthrough in HBM4 quality tests, eyes stable supply for Nvidia Rubin

SK Hynix has reportedly made significant progress in the quality testing of Nvidia's sixth-generation high-bandwidth memory (HBM4) products, boosting the likelihood that it will become...

Saturday 31 January 2026

Intel signals return to memory with new DRAM bonding research

In early 2026, a research update published by Sandia National Laboratories (SNL), part of the US Department of Energy, sparked industry discussions about whether Intel is poised to...

Wednesday 28 January 2026

Lightmatter leverages Taiwan ecosystem to bridge the gap between photonics prototypes and production

Lightmatter is hosting its Tech Day in Taiwan on January 28, 2026, following the announcement of strategic partnerships with Global Unichip Corp. (GUC), Cadence Design Systems, and...

Wednesday 28 January 2026

Lightmatter and GUC Partner to Produce CPO Solutions for AI Hyperscalers

Collaboration combines GUC's ASIC design leadership with Lightmatter's industry-leading 3D CPO platform to redefine AI infrastructure scalability.Lightmatter, the leader...

Tuesday 27 January 2026

The end of the copper age? Lightmatter builds an alliance to power the optical future

In a major coordinated push to reshape high-performance computing, Lightmatter has announced strategic collaborations with Global Unichip Corp....

Tuesday 27 January 2026

Microsoft launches Maia 200 AI chip, mass production progress draws attention

Microsoft officially introduced its second-generation AI accelerator, Maia 200, on January 27, marking its continued efforts in chip development since 2019. The new chip emphasizes...

Friday 23 January 2026

HBF likely overtaking HBM market by 2038 as commercialization speeds up

High-Bandwidth Flash (HBF) is likely to reach commercialization sooner than previously expected and could become a key technology supporting...

Wednesday 21 January 2026

China races to catch up with memory chip leaders in LPDDR6

China's semiconductor supply chain is accelerating plans to bring sixth-generation low-power DRAM, known as LPDDR6, into commercial use in 2026, seeking to close a long-standing technology...

Monday 19 January 2026

China's Innosilicon launches LPDDR6 IP with commercial shipments

As AI smartphones and AI PCs surge, end devices demand unprecedented memory bandwidth. Recently, Chinese interface IP provider Innosilicon announced that its self-developed LPDDR6/5X...

Thursday 15 January 2026

PlayNitride teams up with Brillink to build optical interconnect platform

As Micro LED moves into non-display application opportunities, PlayNitride Technologies announced a partnership with Brillink Technologies, a leader in two-dimensional array optical...

Thursday 15 January 2026

Samsung reportedly files new HBM trademarks as HBM4 advances

Samsung Electronics has reportedly filed a series of new trademarks related to high bandwidth memory as it advances preparations for its sixth-generation HBM4 products.

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Feb 9, 08:00

iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory

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RESEARCH INSIGHTS

Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook