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    TM Technology pushes into physical intelligence with its first humanoid robot
    3h 12min ago
    Taiwan's Eris expects order surge after sanctions on Chinese competitor
    3h 12min ago
    Taiwan's screen giants look beyond LCDs for their next act
    3h 13min ago
    Chunghwa Leading Photonics targets SWIR testing demand in advanced packaging
    3h 13min ago
    SpeedTech's shift toward assembly and systems work could reshape 2026 revenue mix
    3h 13min ago
    SAP highlights agentic AI push as enterprises move from demos to daily operations
    3h 14min ago
    NEWS TAGGED BANDWIDTH
    Friday 12 June 2026
    Overcoming the High-Speed Semiconductor Testing Challenge

    As artificial intelligence (AI) becomes increasingly sophisticated, the demand for higher processing power, speed and efficiency in computing has surged. Next-generation...

    Thursday 11 June 2026
    Montage Tech samples 9200 MT/s DDR5 RCD06 chip for AI server memory upgrade
    Montage Technology has begun sampling its sixth-generation DDR5 registering clock driver chip (RCD06) to customers, marking a step forward in the performance upgrade of next-generation...
    Monday 8 June 2026
    Apple M5 Pro teardown points to chiplet strategy shift
    Apple's M5 Pro signals a broader shift in laptop processors, with implications for global device makers, developers, and AI users. A teardown suggests Apple is combining chiplet-style...
    Wednesday 3 June 2026
    Lightmatter joins Nvidia NVLink Fusion ecosystem to expand optical AI connectivity
    Lightmatter has joined Nvidia's NVLink Fusion ecosystem, a move that could accelerate the rollout of high-performance optical links for AI infrastructure worldwide. The collaboration...
    Tuesday 2 June 2026
    Micron unveils AI memory and storage roadmap at COMPUTEX 2026
    Micron outlined a broad AI memory and storage strategy ahead of Computex 2026, saying surging demand across data centers and intelligent edge devices is reshaping the semiconductor...
    Monday 1 June 2026
    AuthenX targets CPO bottlenecks with detachable metalens FAU
    AuthenX is preparing to showcase a detachable 2D fiber-array unit at COMPUTEX 2026, as the Taiwanese optical-communications company seeks to address packaging and alignment challenges...
    Friday 29 May 2026
    Analysis: ASIC market tightens as capacity becomes key battleground for cloud chips
    Cloud service providers' demand for application-specific integrated circuits, or ASICs, is increasingly locked in as advanced process nodes, advanced packaging, and component supply...
    Tuesday 26 May 2026
    The US$16.5 Billion Bet: How Co-Packaged Optics Will Rewire AI's Backbone by 2030
    As AI clusters continue to scale, traditional interconnect architectures are facing new limits in bandwidth, power efficiency, and system integration. Co-Packaged Optics is emerging...
    Tuesday 26 May 2026
    Lightmatter joins TSMC on COUPE for 3D optical engines
    AI computing's massive demand for infrastructure is making interconnect and laser technologies key to overcoming power and bandwidth limits, prompting silicon photonics unicorn Lightmatter...
    Tuesday 26 May 2026
    Powerchip unveils 3D AI Foundry with 3D WoW DRAM stacking at COMPUTEX 2026
    Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices...
    Thursday 21 May 2026
    AMD commits over US$10 billion to Taiwan ecosystem to expand AI packaging and infrastructure capacity
    AMD said on May 21 that it plans to invest more than US$10 billion across Taiwan's semiconductor ecosystem to deepen strategic partnerships and expand advanced packaging capacity for...
    Saturday 16 May 2026
    One-person companies may upend small businesses in AI shift, adviser says

    Lee-Feng Chien, innovation economy adviser to the Executive Yuan's Economic Development Commission, said at an AI forum on May 14 that...

    Friday 15 May 2026
    InP compound semiconductors break AI power and bandwidth barriers
    Indium phosphide (InP) and other compound semiconductors are taking on a bigger role as demand rises for highly efficient light emission and ultra-high-frequency transmission. Their...
    Thursday 14 May 2026
    Taiwan panel industry transforms by riding the AI wave into microLED optical communications

    Introduction

    Monday 11 May 2026
    Memory bottlenecks threaten data-center GPU efficiency as AI inference scales, says Micron SVP
    Micron's senior vice president, Jeremy Werner, told The Circuit Podcast that memory has become a strategic bottleneck for data-center inference, warning that insufficient memory can...
    1/22 pages
    AsiaCPO
    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
    Thursday 28 May 2026
    AGI Debuts DDR5 R-DIMM and Smart Industrial Solutions at COMPUTEX 2026
    CPC
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook