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    YMTC and XMC expansion headlines Wuhan's newly unveiled 2026 projects plan
    6h 48min ago
    Lisuan’s 6nm GPU won Microsoft WHQL certification
    6h 48min ago
    Commentary: What's the deal behind TEL China management shake-up
    6h 48min ago
    China's EV and export surge shakes global auto industry
    6h 48min ago
    Structural risks rise for global auto market as US policy swings and China faces overcapacity
    6h 48min ago
    Nvidia: GPU allocation follows first-come, first-served, not highest bidder
    6h 48min ago
    NEWS TAGGED BANDWIDTH
    Monday 27 April 2026
    The Co-Packaged Optics (CPO) Revolution: Capitalizing on the Paradigm Shift in AI Data Center Connectivity
    The CPO market is projected to grow at a 142% CAGR from 2026 to 2030 (excl. ELS). As AI clusters scale and 3.2T data rates push copper to its limits, CPO is emerging as a key solut...
    Wednesday 22 April 2026
    CXMT HBM3 timeline slips, mass production unlikely in 2026
    China's leading memory chipmaker ChangXin Memory Technologies (CXMT) is facing fresh uncertainty over the commercialization timeline of its fourth-generation high bandwidth memory...
    Monday 20 April 2026
    LEO satellites set to transform in-flight connectivity
    For years, one of the most frustrating aspects of long-haul travel has been expensive, slow, and often unreliable in-flight Wi-Fi. With the rapid rise of low Earth orbit (LEO) satellite...
    Monday 20 April 2026
    SOCAMM2 race intensifies as SK Hynix starts mass production, while Micron and Samsung push competing designs
    SK Hynix has begun mass production of its 192GB SOCAMM2 memory module, marking a major step in the commercialization of next-generation low-power server DRAM designed for AI workloads,...
    Thursday 16 April 2026
    Samsung pushes HBM4 yields as advanced testing and cutting technologies emerge
    Samsung Electronics is accelerating efforts to improve yields for its sixth-generation high bandwidth memory (HBM4), as it seeks to narrow the gap with market leader SK hynix. According...
    Thursday 16 April 2026
    Kbro enters 10G era with NT$10 billion investment, advocates heterogeneous network backup to replace price wars
    Taiwan's Kbro Broadband on April 15 unveiled its next-generation 10G broadband service, backed by a planned NT$10 billion (approx. US$316.45 million) investment to upgrade network...
    Thursday 16 April 2026
    Renesas reports accelerated MRDIMM adoption in China
    As AI servers rapidly increase demand for high bandwidth and large-capacity memory, Renesas Electronics noted that, driven by strong demand in China and expanding capacity, its Memory...
    Wednesday 8 April 2026
    AI server boom lifts Taiwan's ACES Electronics into the high-speed interconnect race
    As AI servers grow more complex and bandwidth demands surge, components once considered peripheral—connectors and high-speed cables—are emerging as critical determinants...
    Wednesday 1 April 2026
    Micron reportedly developing stacked GDDR to address shifting AI memory demand

    Micron is reportedly developing vertically stacked graphics DRAM (GDDR) products to address shifting AI memory demand, according to...

    Monday 30 March 2026
    AI compute shifts to inference, reshaping data center bottlenecks

    The focus of artificial intelligence computing is set to shift from training to inference beyond 2025, a transition that will also redefine...

    Tuesday 24 March 2026
    Huawei's Ascend 950PR debuts with nearly 3x H20 performance, targets China's AI compute gap
    Huawei has officially launched its Ascend 950PR processor and introduced the Atlas 350 AI accelerator card equipped with this chip, marking the commercial debut of its next-generation...
    Monday 16 March 2026
    HyperLight, UMC, and Wavetek form foundry partnership for high-volume TFLN chiplet production
    HyperLight Corporation, United Microelectronics Corporation (UMC), and Wavetek Microelectronics Corporation, a wholly owned UMC subsidiary, have announced a strategic manufacturing...
    Thursday 12 March 2026
    UMC, HyperLight to mass-produce TFLN photonics chiplets for AI data centers
    United Microelectronics Corporation (UMC) has partnered with startup HyperLight to mass-produce thin-film lithium niobate (TFLN) chiplets, aiming to improve data transmission speeds...
    Thursday 5 March 2026
    Micron unveils 256GB SOCAMM2, scaling AI server memory to 2TB per CPU

    Artificial intelligence (AI) infrastructure is evolving faster than traditional server hardware cycles can accommodate. As AI workloads...

    Thursday 5 March 2026
    Commentary: HBM hybrid bonding race heats up, but memory makers slow to adopt
    Competition in the high bandwidth memory (HBM) market is intensifying, prompting equipment makers such as Hanwha Semitech and Semes to accelerate...
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    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook