News tagged bandwidth at DIGITIMES

NEWS TAGGED BANDWIDTH

Friday 21 August 2026

Research Insight: CPO gains momentum as AI interconnect demands outpace chip gains

The AI industry is watching the rise of co-packaged optics (CPO) as faster AI systems now depend on more efficient links between chips and data centers. At DIGITIMES Tech Forum 2026...

Friday 21 August 2026

SK hynix outlines CPO roadmap as AI computing shifts from chips to systems

SK hynix has published a technical roadmap for co-packaged optics (CPO) in the journal Nature Electronics, positioning the world's largest supplier of high-bandwidth memory...

Saturday 15 August 2026

Gelsinger calls HBM 'lousy', SK Hynix says it's not memory's final answer

High-bandwidth memory (HBM), a core component in AI semiconductors, has drawn fresh scrutiny after former Intel CEO Pat Gelsinger called...

Thursday 13 August 2026

409.6T switches could push industry toward CPO, Arista says

Co-packaged optics (CPO) has become a major focus of the optical networking industry, but pluggable modules remain the mainstream choice for optical interconnects. At a silicon photonics...

Wednesday 12 August 2026

OCP APAC 2026: ASE unveils AI packaging trilogy

Demand for AI infrastructure is forcing chipmakers and data-center operators to rethink how systems are built, with implications for...

Thursday 6 August 2026

Dark fiber essential for next-gen distributed AI centers

All-photonic networks (APN) are emerging as critical infrastructure for 6G, AI computing and smart cities. Nvidia's plan to expand...

Wednesday 5 August 2026

Kioxia and Sandisk unveil faster, denser QLC flash memory for AI infrastructure

Kioxia and Sandisk have introduced a next-generation QLC 3D flash memory technology that boosts storage density, bandwidth, and power efficiency, a development that could help global...

Tuesday 4 August 2026

SK Hynix, Sandisk release first HBF specs with up to 512GB and 3TB/s bandwidth

SK Hynix and Sandisk released the first standard specifications for High Bandwidth Flash (HBF) on August 4, defining a NAND-based memory technology with a capacity of up to 512GB and...

Tuesday 4 August 2026

Sandisk and SK Hynix release HBF spec to advance AI memory standard

Sandisk and SK Hynix have published a technical specification for high-bandwidth flash through the Open Compute Project, a move that could shape future AI infrastructure worldwide...

Thursday 30 July 2026

GlobalFoundries lands US$300M CHIPS backing for AI silicon photonics

GlobalFoundries has signed a letter of intent with the US Department of Commerce for a potential US$300 million award to accelerate...

Thursday 30 July 2026

Advantest lifts fiscal 2026 forecast as AI chip test demand surges

Advantest raised its outlook for the fiscal year ending March 2027 after demand for chip-test equipment tied to AI data centers strengthened,...

Friday 24 July 2026

AMD unveils Helios rack-scale AI platform to target hyperscale buildouts

AMD has formally introduced Helios, a next-generation rack-scale AI infrastructure platform designed for the fast-growing market of global AI factories and hyperscale data centers...

Wednesday 22 July 2026

Nvidia details Vera CPU for agentic AI workloads

Nvidia has outlined the design of its Vera CPU, positioning the chip for agentic AI systems that rely heavily on the processor for code execution, tool calls, retrieval, and data handling...

Wednesday 22 July 2026

WAIC 2026: Biren's 1,024-GPU NPO super node sharpens China's AI infrastructure race

Chinese GPU developer Biren Technology unveiled a next-generation near-packaged optics (NPO) super node at the World Artificial Intelligence...

Friday 17 July 2026

China's AI chips hit three walls — and bet on 3D memory to break through

China's AI chip industry is moving beyond a contest over process nodes and into a broader race involving memory, advanced packaging, chip interconnects and system architecture.

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Aug 20, 11:00

Corning-IRICO Trade Secret Case Enters New Phase

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