News tagged bandwidth at DIGITIMES

NEWS TAGGED BANDWIDTH

Friday 17 July 2026

China's AI chips hit three walls — and bet on 3D memory to break through

China's AI chip industry is moving beyond a contest over process nodes and into a broader race involving memory, advanced packaging, chip interconnects and system architecture.

Thursday 16 July 2026

Exclusive: Advanced packaging outpaces front-end growth while NPO paves way for commercial CPO

Generative AI is accelerating demand for computing power, memory and data bandwidth, shifting semiconductor innovation beyond front-end processes toward advanced packaging, silicon...

Wednesday 15 July 2026

Huawei to unveil largest Ascend SuperPoD at Xi-opened WAIC , scaling China's AI infrastructure

Huawei will publicly display its Atlas 950 SuperPoD AI computing system for the first time at the 2026 World Artificial Intelligence...

Wednesday 15 July 2026

China's Orient Computing unveils 14nm AI chip designed to bypass HBM constraints

Shanghai Orient Computing Core Technology has launched the DF1000, a 14-nanometre AI accelerator that uses software-defined computing...

Tuesday 14 July 2026

Rambus unveils DDR5 9600 chipset for next-generation AI servers

Rambus has introduced a new DDR5 9600 server RDIMM chipset aimed at faster, denser data center memory systems. The move matters beyond one supplier because higher bandwidth and better...

Monday 13 July 2026

SK Hynix hybrid bonding push signals next phase of HBM packaging race

SK Hynix is moving early to prepare hybrid bonding technology for next-generation high-bandwidth memory (HBM), as competition in AI memory shifts from stacking capacity toward packaging...

Sunday 5 July 2026

Applied Materials unveils integrated tools for HBM, chiplet, and 3D packaging scale-up

Applied Materials announced a new equipment platform aimed at addressing the memory bandwidth and energy-efficiency bottleneck confronting AI computing, unveiling tools across DRAM,...

Friday 3 July 2026

Competing Paths in Data Center Optics: XPO Could Beat CPO to Mass Production in 2027

DIGITIMES notes that Arista Networks unveiled XPO at The Optical Fiber Communication Conference and Exhibition 2026 (OFC 2026). Unlike CPO, which is associated with more disruptive...

Monday 29 June 2026

Taiwan joins post-HBM memory race with Intel, SoftBank

Taiwan's semiconductor ecosystem has entered the race to develop a possible post-HBM memory architecture, with Powerchip Semiconductor...

Thursday 25 June 2026

Nvidia CPO roadmap positions TSMC COUPE for next AI infrastructure wave

Co-packaged optics (CPO) is rapidly emerging as a foundational architecture for next-generation AI infrastructure. With Nvidia's latest Scale-Up CPO switch roadmap now taking shape,...

Thursday 25 June 2026

Qualcomm pushes into data center chips with Dragonfly lineup and Meta deal, taking aim at Nvidia

Qualcomm used its June 24 investor day to unveil a data center chip portfolio and a multi-generation CPU agreement with Meta, a strategic bid to diversify beyond a shrinking smartphone...

Wednesday 24 June 2026

JEDEC reportedly approves SPHBM4 standard to broaden HBM4 packaging and boost glass substrate prospects

JEDEC finalized a new HBM4 packaging specification called SPHBM4 that aims to broaden high bandwidth memory (HBM) use cases by reducing packaging complexity and cost, industry sources...

Friday 12 June 2026

Overcoming the High-Speed Semiconductor Testing Challenge

As artificial intelligence (AI) becomes increasingly sophisticated, the demand for higher processing power, speed and efficiency in computing has surged. Next-generation...

Thursday 11 June 2026

Montage Tech samples 9200 MT/s DDR5 RCD06 chip for AI server memory upgrade

Montage Technology has begun sampling its sixth-generation DDR5 registering clock driver chip (RCD06) to customers, marking a step forward in the performance upgrade of next-generation...

Monday 8 June 2026

Apple M5 Pro teardown points to chiplet strategy shift

Apple's M5 Pro signals a broader shift in laptop processors, with implications for global device makers, developers, and AI users. A teardown suggests Apple is combining chiplet-style...

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Jun 1, 08:00

LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE

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