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    Commentary: Behind Micron's bet for a long memory demand cycles
    2h 18min ago
    Interview: Qnity's Taiwan investment to focus on advanced packaging, CPO and cooling
    2h 19min ago
    GPU and ASIC new platforms to drive stronger server shipments in 2H26
    2h 19min ago
    South Korean memory makers weigh stronger profits from general DRAM than HBM
    2h 19min ago
    MCU price hike expectations drive early 1H26 pull-ins
    2h 19min ago
    iPhone 18 Pro price hike: Memory costs or margin play?
    2h 19min ago
    NEWS TAGGED BANDWIDTH
    Monday 29 June 2026
    Taiwan joins post-HBM memory race with Intel, SoftBank

    Taiwan's semiconductor ecosystem has entered the race to develop a possible post-HBM memory architecture, with Powerchip Semiconductor...

    Thursday 25 June 2026
    Nvidia CPO roadmap positions TSMC COUPE for next AI infrastructure wave
    Co-packaged optics (CPO) is rapidly emerging as a foundational architecture for next-generation AI infrastructure. With Nvidia's latest Scale-Up CPO switch roadmap now taking shape,...
    Thursday 25 June 2026
    Qualcomm pushes into data center chips with Dragonfly lineup and Meta deal, taking aim at Nvidia
    Qualcomm used its June 24 investor day to unveil a data center chip portfolio and a multi-generation CPU agreement with Meta, a strategic bid to diversify beyond a shrinking smartphone...
    Wednesday 24 June 2026
    JEDEC reportedly approves SPHBM4 standard to broaden HBM4 packaging and boost glass substrate prospects
    JEDEC finalized a new HBM4 packaging specification called SPHBM4 that aims to broaden high bandwidth memory (HBM) use cases by reducing packaging complexity and cost, industry sources...
    Friday 12 June 2026
    Overcoming the High-Speed Semiconductor Testing Challenge

    As artificial intelligence (AI) becomes increasingly sophisticated, the demand for higher processing power, speed and efficiency in computing has surged. Next-generation...

    Thursday 11 June 2026
    Montage Tech samples 9200 MT/s DDR5 RCD06 chip for AI server memory upgrade
    Montage Technology has begun sampling its sixth-generation DDR5 registering clock driver chip (RCD06) to customers, marking a step forward in the performance upgrade of next-generation...
    Monday 8 June 2026
    Apple M5 Pro teardown points to chiplet strategy shift
    Apple's M5 Pro signals a broader shift in laptop processors, with implications for global device makers, developers, and AI users. A teardown suggests Apple is combining chiplet-style...
    Wednesday 3 June 2026
    Lightmatter joins Nvidia NVLink Fusion ecosystem to expand optical AI connectivity
    Lightmatter has joined Nvidia's NVLink Fusion ecosystem, a move that could accelerate the rollout of high-performance optical links for AI infrastructure worldwide. The collaboration...
    Tuesday 2 June 2026
    Micron unveils AI memory and storage roadmap at COMPUTEX 2026
    Micron outlined a broad AI memory and storage strategy ahead of Computex 2026, saying surging demand across data centers and intelligent edge devices is reshaping the semiconductor...
    Monday 1 June 2026
    AuthenX targets CPO bottlenecks with detachable metalens FAU
    AuthenX is preparing to showcase a detachable 2D fiber-array unit at COMPUTEX 2026, as the Taiwanese optical-communications company seeks to address packaging and alignment challenges...
    Friday 29 May 2026
    Analysis: ASIC market tightens as capacity becomes key battleground for cloud chips
    Cloud service providers' demand for application-specific integrated circuits, or ASICs, is increasingly locked in as advanced process nodes, advanced packaging, and component supply...
    Tuesday 26 May 2026
    The US$16.5 Billion Bet: How Co-Packaged Optics Will Rewire AI's Backbone by 2030
    As AI clusters continue to scale, traditional interconnect architectures are facing new limits in bandwidth, power efficiency, and system integration. Co-Packaged Optics is emerging...
    Tuesday 26 May 2026
    Lightmatter joins TSMC on COUPE for 3D optical engines
    AI computing's massive demand for infrastructure is making interconnect and laser technologies key to overcoming power and bandwidth limits, prompting silicon photonics unicorn Lightmatter...
    Tuesday 26 May 2026
    Powerchip unveils 3D AI Foundry with 3D WoW DRAM stacking at COMPUTEX 2026
    Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices...
    Thursday 21 May 2026
    AMD commits over US$10 billion to Taiwan ecosystem to expand AI packaging and infrastructure capacity
    AMD said on May 21 that it plans to invest more than US$10 billion across Taiwan's semiconductor ecosystem to deepen strategic partnerships and expand advanced packaging capacity for...
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    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
    Thursday 28 May 2026
    AGI Debuts DDR5 R-DIMM and Smart Industrial Solutions at COMPUTEX 2026
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook