Ennostar is pushing into AI high-speed optical communications and says Taiwan's full supply-chain ecosystem could bring micro LED into commercial use sooner than expected. Andrew Tsai,...
For decades, semiconductor performance gains largely came from shrinking process nodes, from 22nm and 14nm to 7nm and 3nm. AI is changing the constraint: processors are getting faster,...
Sandisk says its NAND-based High Bandwidth Flash (HBF) technology can match HBM bandwidth while providing eight to 16 times the capacity at a similar cost, positioning flash memory...
Micron Technology is exploring tightly coupled DRAM that could deliver more than 10 times the bandwidth of HBM while using substantially less energy per bit, as the memory maker looks...
At a shared stage at Semicon Taiwan 2026, executives from Samsung Electronics, SK Hynix, and Micron agreed that traditional 2.5D high-bandwidth memory (HBM) using interposers is approaching...
As interconnect traffic in AI hyperscale data centers climbs, optical modules are moving toward the 1.6T and 3.2T generations. United Microelectronics Corporation (UMC), Taiwan's second-largest...
Apple has unveiled new Mac mini and Mac Studio models, equipped respectively with its first 2-nanometer chip, the M6, and the four-die M5 Ultra. Most notably, the latest 2-nanometer...
As AI infrastructure drives demand for higher bandwidth, lower power consumption and faster connectivity, silicon photonics is becoming increasingly important to the...
The competition in high-bandwidth memory (HBM) is moving beyond DRAM stack height, bandwidth, and packaging to the base die at the very bottom of the package. As Nvidia pushes its...
Samsung Electronics is targeting mass production of its LPDDR5X processing-in-memory (PIM) solution in late 2026 or early 2027, moving the technology closer to commercialization as...
DIGITIMES observed that as AI systems continued to scale, interconnect requirements inside AI data centers had expanded from chips, packages, and boards to racks, clusters, and eventually...
For global cloud operators and network vendors, Cisco said co-packaged optics (CPO) is moving from lab promise to commercial necessity as AI data centers strain power budgets and bandwidth...
Samsung Electronics is reportedly developing an 8-layer version of seventh-generation high-bandwidth memory for Nvidia, matching the chipmaker's requirements for its customized NVHBM...
TSMC is sharpening its silicon photonics (SiPh) roadmap to address the widening gap between AI compute growth and chip-to-chip data movement, unveiling two bandwidth-scaling paths...
