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Thursday 12 March 2026
UMC, HyperLight to mass-produce TFLN photonics chiplets for AI data centers
United Microelectronics Corporation (UMC) has partnered with startup HyperLight to mass-produce thin-film lithium niobate (TFLN) chiplets, aiming to improve data transmission speeds...
Thursday 5 March 2026
Micron unveils 256GB SOCAMM2, scaling AI server memory to 2TB per CPU

Artificial intelligence (AI) infrastructure is evolving faster than traditional server hardware cycles can accommodate. As AI workloads...

Thursday 5 March 2026
Commentary: HBM hybrid bonding race heats up, but memory makers slow to adopt
Competition in the high bandwidth memory (HBM) market is intensifying, prompting equipment makers such as Hanwha Semitech and Semes to accelerate...
Tuesday 3 March 2026
FIT unveils 102.4T CPO external laser solution for AI data centers at OFC 2026
As AI model training scales up and cloud service providers (CSPs) accelerate the buildout of high-performance data centers, switch bandwidth is moving from 51.2Tbps to the 102.4Tbps...
Monday 2 March 2026
Commentary: Nvidia sparks silicon photonics race, yet copper still anchors data centers?
As data center computing demand expands, high-speed transmission architectures are under pressure to upgrade. Scaling high-performance computing platforms is exposing bandwidth and...
Monday 2 March 2026
Nvidia's Vera Rubin platform faces HBM4, cooling, and software hurdles ahead of ramp
Nvidia's next-generation Vera Rubin platform has moved from public unveiling to early customer sampling, with the company projecting a broader production ramp later this year. Both...
Wednesday 18 February 2026
Samsung advances LPDDR5X-PIM, signaling memory's new role in AI computing

Artificial intelligence is shifting the center of gravity in semiconductors. For decades, processors defined performance. Now memory bandwidth,...

Friday 13 February 2026
Citi flags post-HBM shift as edge memory, HBF advance
A Citi analyst said the next phase of artificial intelligence (AI) memory demand will extend beyond high-bandwidth memory (HBM), pointing to emerging opportunities in physical AI devices...
Friday 13 February 2026
SEMICON Korea: Samsung pushes hybrid bonding HBM, SK Hynix bets on platform AI
SEMICON Korea 2026, held in Seoul from February 11–13, brought senior executives from Samsung Electronics and SK Hynix to outline their AI-era memory R&D strategies. Samsung...
Saturday 7 February 2026
Microsoft's Maia 200 chip targets AI inference cost advantage, not Nvidia rivalry
Microsoft recently unveiled its second-generation custom AI chip, Maia 200, more than two years after its previous generation. The Maia chip's update cycle lags behind the rapid iterations...
Tuesday 3 February 2026
SK Hynix achieves major breakthrough in HBM4 quality tests, eyes stable supply for Nvidia Rubin
SK Hynix has reportedly made significant progress in the quality testing of Nvidia's sixth-generation high-bandwidth memory (HBM4) products, boosting the likelihood that it will become...
Saturday 31 January 2026
Intel signals return to memory with new DRAM bonding research
In early 2026, a research update published by Sandia National Laboratories (SNL), part of the US Department of Energy, sparked industry discussions about whether Intel is poised to...
Wednesday 28 January 2026
Lightmatter leverages Taiwan ecosystem to bridge the gap between photonics prototypes and production
Lightmatter is hosting its Tech Day in Taiwan on January 28, 2026, following the announcement of strategic partnerships with Global Unichip Corp. (GUC), Cadence Design Systems, and...
Wednesday 28 January 2026
Lightmatter and GUC Partner to Produce CPO Solutions for AI Hyperscalers

Collaboration combines GUC's ASIC design leadership with Lightmatter's industry-leading 3D CPO platform to redefine AI infrastructure scalability.Lightmatter, the leader...

Tuesday 27 January 2026
The end of the copper age? Lightmatter builds an alliance to power the optical future

In a major coordinated push to reshape high-performance computing, Lightmatter has announced strategic collaborations with Global Unichip Corp....