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    US Justice Department probes Nvidia-Groq deal over antitrust concerns
    9min ago
    NEWS TAGGED BANDWIDTH
    Thursday 10 September 2026
    Compute-in-memory returns to the spotlight with edge AI's power, memory squeeze
    AI is shifting from data centers to PCs, personal AI systems, robots, and other edge devices, renewing a core semiconductor challenge: delivering enough compute and memory bandwidth...
    Wednesday 9 September 2026
    Backed by Nanya partnership, PieceMakers eyes AI memory upgrade boom
    As AI compute requirements scale, memory bandwidth has become a primary bottleneck governing system performance. PieceMakers Technology, which maintains a strategic partnership with...
    Tuesday 8 September 2026
    Nvidia reportedly shifts Rubin Ultra toward 8-high HBM as memory costs rise

    Nvidia is reportedly shifting its Rubin Ultra AI accelerator toward an eight-high high-bandwidth memory (HBM) configuration, down from...

    Tuesday 8 September 2026
    Corning targets AI bottlenecks with glass substrates, optics for high-speed data transmission
    As AI processors advance toward higher compute density, larger package footprints, and increased bandwidth demands, advanced packaging and high-speed data transmission have emerged...
    Friday 4 September 2026
    Ennostar accelerates AI optical communications with micro LED
    Ennostar is pushing into AI high-speed optical communications and says Taiwan's full supply-chain ecosystem could bring micro LED into commercial use sooner than expected. Andrew Tsai,...
    Thursday 3 September 2026
    SanDisk pushes HBF ecosystem as AI inference reshapes token economics
    The rapid rise of AI inference, multimodal inputs, and AI agents is giving NAND flash a new strategic role.
    Thursday 3 September 2026
    Apple, Xiaomi and Nvidia chase terabyte-class bandwidth for AI chips
    For decades, semiconductor performance gains largely came from shrinking process nodes, from 22nm and 14nm to 7nm and 3nm. AI is changing the constraint: processors are getting faster,...
    Wednesday 2 September 2026
    Sandisk says HBF can match HBM bandwidth with up to 16x the capacity
    Sandisk says its NAND-based High Bandwidth Flash (HBF) technology can match HBM bandwidth while providing eight to 16 times the capacity at a similar cost, positioning flash memory...
    Wednesday 2 September 2026
    Micron says tightly coupled DRAM could deliver more than 10x HBM bandwidth
    Micron Technology is exploring tightly coupled DRAM that could deliver more than 10 times the bandwidth of HBM while using substantially less energy per bit, as the memory maker looks...
    Wednesday 2 September 2026
    DRAM giants target 3D stacking to break memory wall and power bottlenecks
    At a shared stage at Semicon Taiwan 2026, executives from Samsung Electronics, SK Hynix, and Micron agreed that traditional 2.5D high-bandwidth memory (HBM) using interposers is approaching...
    Wednesday 2 September 2026
    UMC targets 12-inch TFLN to break 400G SiPh bottleneck
    As interconnect traffic in AI hyperscale data centers climbs, optical modules are moving toward the 1.6T and 3.2T generations. United Microelectronics Corporation (UMC), Taiwan's second-largest...
    Wednesday 2 September 2026
    Apple's M6, M5 Ultra break rule tying process to chip strength
    Apple has unveiled new Mac mini and Mac Studio models, equipped respectively with its first 2-nanometer chip, the M6, and the four-die M5 Ultra. Most notably, the latest 2-nanometer...
    Wednesday 2 September 2026
    8 September Hsinchu seminar: Silicon photonics driving AI chains

    As AI infrastructure drives demand for higher bandwidth, lower power consumption and faster connectivity, silicon photonics is becoming increasingly important to the...

    Wednesday 2 September 2026
    Nvidia pushes into HBM base dies as NVHBM battle heats up
    The competition in high-bandwidth memory (HBM) is moving beyond DRAM stack height, bandwidth, and packaging to the base die at the very bottom of the package. As Nvidia pushes its...
    Tuesday 1 September 2026
    Samsung eyes early 2027 LPDDR5X-PIM production, touts 3.8x performance gain
    Samsung Electronics is targeting mass production of its LPDDR5X processing-in-memory (PIM) solution in late 2026 or early 2027, moving the technology closer to commercialization as...
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    BIZ FOCUS
    Sep 10, 08:00
    Stress, Sleep, and Lifestyle Balance: Perspectives from Traditional Chinese Medicine
    Wednesday 9 September 2026
    IDA Partners with Taiwan's Semiconductor Industry to Advance Global Talent Strategy
    Tuesday 8 September 2026
    Shining a Light on the Precision Behind AI and Data Infrastructure
    Wednesday 2 September 2026
    World Diamond Technology accelerates mass production of 300 mm diamond wafers
    reportAIglasses