News tagged bandwidth at DIGITIMES

NEWS TAGGED BANDWIDTH

Saturday 29 August 2026

Qualcomm's HBC play pulls Samsung and SK hynix into a new race beyond HBM

The AI infrastructure race has spent the past few years fixated on high-bandwidth memory as one of the most indispensable building blocks of accelerated compute. Yet as model sizes,...

Friday 28 August 2026

Samsung eyes zHBM products from 2029 as heat remains key hurdle

Samsung Electronics expects products based on its first-generation zHBM specifications to appear in 2029 or later, giving the 3D memory concept unveiled earlier this month an initial...

Thursday 27 August 2026

Samsung signals zHBF push as memory race moves beyond HBM

Samsung Electronics is signaling a push into high bandwidth flash (HBF), extending its next-generation memory ambitions beyond HBM as rivals move to establish a new NAND-based memory...

Thursday 27 August 2026

CXMT DDR5 closes in on SK Hynix at 8,000 MT/s, benchmark gap falls below 1%

CXMT is narrowing the performance gap with SK Hynix in high-speed DDR5 memory, with new benchmark tests showing CXMT chips running stably at 8,000 MT/s and delivering productivity...

Wednesday 26 August 2026

Hot Chips 2026: Samsung advances LPDDR5X-PIM as HBM costs mount

At Hot Chips 2026, Samsung Electronics moved processing-in-memory (PIM) closer to practical deployment, presenting what it described as the industry's first LPDDR-based PIM device...

Wednesday 26 August 2026

Apple gives 2nm debut to Mac, not iPhone: M6 leads TSMC node transition

Apple on Aug. 25 introduced M6 in a new Mac mini and M5 Ultra in a new Mac Studio, framing both chips around AI compute and memory bandwidth rather than conventional CPU headline numbers...

Wednesday 26 August 2026

Samsung, Intel widen AI chip battle into memory, packaging

Samsung Electronics and Intel are pushing into each other's core businesses as AI semiconductor competition shifts from individual chips to full-system integration. South Korean reports...

Monday 24 August 2026

SK Hynix charts advanced HBM packaging path: hybrid bonding, Intel EMIB and 3D integration

Competition in high bandwidth memory (HBM) is shifting from raw memory performance to advanced packaging. As bandwidth, capacity and stack heights keep climbing, thermal management,...

Monday 24 August 2026

Analysis: SK Hynix pushes beyond HBM with HBF and CPO

SK Hynix is moving on several fronts as it pushes deeper into system-level memory competition. From high-bandwidth memory (HBM) and high-bandwidth flash (HBF) to a recently published...

Friday 21 August 2026

Research Insight: CPO gains momentum as AI interconnect demands outpace chip gains

The AI industry is watching the rise of co-packaged optics (CPO) as faster AI systems now depend on more efficient links between chips and data centers. At DIGITIMES Tech Forum 2026...

Friday 21 August 2026

SK hynix outlines CPO roadmap as AI computing shifts from chips to systems

SK hynix has published a technical roadmap for co-packaged optics (CPO) in the journal Nature Electronics, positioning the world's largest supplier of high-bandwidth memory...

Saturday 15 August 2026

Gelsinger calls HBM 'lousy', SK Hynix says it's not memory's final answer

High-bandwidth memory (HBM), a core component in AI semiconductors, has drawn fresh scrutiny after former Intel CEO Pat Gelsinger called...

Thursday 13 August 2026

409.6T switches could push industry toward CPO, Arista says

Co-packaged optics (CPO) has become a major focus of the optical networking industry, but pluggable modules remain the mainstream choice for optical interconnects. At a silicon photonics...

Wednesday 12 August 2026

OCP APAC 2026: ASE unveils AI packaging trilogy

Demand for AI infrastructure is forcing chipmakers and data-center operators to rethink how systems are built, with implications for...

Thursday 6 August 2026

Dark fiber essential for next-gen distributed AI centers

All-photonic networks (APN) are emerging as critical infrastructure for 6G, AI computing and smart cities. Nvidia's plan to expand...

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Aug 27, 08:00

ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026

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