ASE has introduced a new packaging innovation—FOCoS-Bridge with through-silicon via (TSV) integration—designed to support the growing power and bandwidth needs of artificial...
Chunghwa Telecom has announced a collaboration with Asus subsidiary Askey Computer to strengthen its enterprise private network solutions with homegrown Wi-Fi technology. The project...
Montage Technology is a global fabless semiconductor design company specializing in data processing and interconnect chip solutions. Founded in 2004, the company is headquartered...
Ottawa-based deep-tech startup Hyperlume is poised to disrupt the landscape of AI and high-performance computing with its innovative optical interconnect solutions. The company is...
Chunghwa Telecom (CHT) is intensifying its international network infrastructure investments as it approaches its 30th anniversary in 2025, focusing on a resilient connectivity strategy...
Samsung Electronics has recently intensified its deployment in advanced high bandwidth memory (HBM) processes. However, supply chain sources reveal that Samsung's HBM3E certification...
JEDEC has relaxed the height specification for sixth-generation high bandwidth memory (HBM4), clearing a key obstacle for South Korean memory leaders Samsung Electronics and SK Hynix...
The global push to meet surging demand from AI, high-performance computing (HPC), and advanced data centers has reached a new milestone. JEDEC, the international semiconductor standards...
Micron Technology is advancing in the high bandwidth memory (HBM) market, historically led by South Korean giants SK Hynix and Samsung. Reports indicate that Micron has secured Nvidia's...
Surpassing Samsung in DRAM market share for the first time in its 40-year history can be attributed mainly to SK Hynix's dominance in the high bandwidth memory (HBM) market. Samsung's...
At the Google Cloud Next '25 conference, the company introduced the seventh-generation Tensor Processing Unit (TPU), Ironwood, designed for AI inference. This chip highlights Google's...
SK Hynix announced during its 77th shareholders' meeting that it will determine product volume for its high bandwidth memory (HBM) lineup in the first half of 2025. CEO Noh-Jung Kwak...
Micron Technology showcased its latest AI-optimized memory technologies at GTC 2025, unveiling advanced DRAM solutions designed for data center and high-performance computing (HPC)...
High bandwidth memory (HBM) major client Nvidia is said to have visited Samsung Electronics' advanced packaging plant again, just over a month after their last visit. Industry sources...
Samsung Electronics' potential collaboration with Baidu on advanced artificial intelligence (AI) chips may have been disrupted due to increased US pressure on China, according to...
