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Friday 27 June 2025
SK Hynix debuts 16-layer HBM4, set to power AI chips in 2026
At HPE Discover 2025, SK Hynix unveiled its 16-layer sixth-generation high bandwidth memory (HBM4) for the first time, aiming to maintain its technological leadership in the HBM4...
Thursday 19 June 2025
Nvidia's NVL72 's new rival in town: Huawei flips the script with CloudMatrix 384
Huawei's CloudMatrix 384 supernode, powered by its Ascend 910 series AI processors, is positioning itself as a viable challenger to Nvidia's newly launched GB200 NVL72, despite trailing...
Wednesday 18 June 2025
Nvidia to unveil new China-bound downgraded AI chips after H20 export ban
Nvidia CEO Jensen Huang said the company will no longer include China in its official forecasts, signaling a pivotal shift in how the US chip giant navigates the intensifying tech...
Wednesday 4 June 2025
ASE bets on new chip tech to handle AI’s rising power and speed needs
ASE has introduced a new packaging innovation—FOCoS-Bridge with through-silicon via (TSV) integration—designed to support the growing power and bandwidth needs of artificial...
Monday 26 May 2025
Chunghwa Telecom, Askey team up for made-in-Taiwan private networks
Chunghwa Telecom has announced a collaboration with Asus subsidiary Askey Computer to strengthen its enterprise private network solutions with homegrown Wi-Fi technology. The project...
Tuesday 20 May 2025
Montage Technology embraces CXL innovation to scale memory and bandwidth for enhanced data center performance
Montage Technology is a global fabless semiconductor design company specializing in data processing and interconnect chip solutions. Founded in 2004, the company is headquartered...
Monday 5 May 2025
Hyperlume aims to revolutionize AI infrastructure with Micro-LED technology
Ottawa-based deep-tech startup Hyperlume is poised to disrupt the landscape of AI and high-performance computing with its innovative optical interconnect solutions. The company is...
Monday 28 April 2025
Taiwan telecom giant secures international connectivity with dual-focused investment strategy
Chunghwa Telecom (CHT) is intensifying its international network infrastructure investments as it approaches its 30th anniversary in 2025, focusing on a resilient connectivity strategy...
Friday 25 April 2025
Exclusive: Google considers HBM3E supplier change
Samsung Electronics has recently intensified its deployment in advanced high bandwidth memory (HBM) processes. However, supply chain sources reveal that Samsung's HBM3E certification...
Friday 25 April 2025
JEDEC bends rules—Samsung, SK Hynix charge ahead in AI memory war
JEDEC has relaxed the height specification for sixth-generation high bandwidth memory (HBM4), clearing a key obstacle for South Korean memory leaders Samsung Electronics and SK Hynix...
Saturday 19 April 2025
JEDEC rolls out HBM4 standard: 2TB/s memory poised to supercharge AI, HPC
The global push to meet surging demand from AI, high-performance computing (HPC), and advanced data centers has reached a new milestone. JEDEC, the international semiconductor standards...
Tuesday 15 April 2025
Micron reportedly secures Nvidia certification for fifth-gen 12-layer HBM3E supply
Micron Technology is advancing in the high bandwidth memory (HBM) market, historically led by South Korean giants SK Hynix and Samsung. Reports indicate that Micron has secured Nvidia's...
Friday 11 April 2025
HBM helps SK Hynix claim crown as Samsung loses DRAM leadership
Surpassing Samsung in DRAM market share for the first time in its 40-year history can be attributed mainly to SK Hynix's dominance in the high bandwidth memory (HBM) market. Samsung's...
Thursday 10 April 2025
Google unveils seventh-generation TPU for AI inference era
At the Google Cloud Next '25 conference, the company introduced the seventh-generation Tensor Processing Unit (TPU), Ironwood, designed for AI inference. This chip highlights Google's...
Friday 28 March 2025
SK Hynix to finalize 2026 HBM production target by mid-2025 amid rising AI demand
SK Hynix announced during its 77th shareholders' meeting that it will determine product volume for its high bandwidth memory (HBM) lineup in the first half of 2025. CEO Noh-Jung Kwak...