News tagged bandwidth at DIGITIMES

NEWS TAGGED BANDWIDTH

Thursday 30 July 2026

GlobalFoundries lands US$300M CHIPS backing for AI silicon photonics

GlobalFoundries has signed a letter of intent with the US Department of Commerce for a potential US$300 million award to accelerate...

Thursday 30 July 2026

Advantest lifts fiscal 2026 forecast as AI chip test demand surges

Advantest raised its outlook for the fiscal year ending March 2027 after demand for chip-test equipment tied to AI data centers strengthened,...

Friday 24 July 2026

AMD unveils Helios rack-scale AI platform to target hyperscale buildouts

AMD has formally introduced Helios, a next-generation rack-scale AI infrastructure platform designed for the fast-growing market of global AI factories and hyperscale data centers...

Wednesday 22 July 2026

Nvidia details Vera CPU for agentic AI workloads

Nvidia has outlined the design of its Vera CPU, positioning the chip for agentic AI systems that rely heavily on the processor for code execution, tool calls, retrieval, and data handling...

Wednesday 22 July 2026

WAIC 2026: Biren's 1,024-GPU NPO super node sharpens China's AI infrastructure race

Chinese GPU developer Biren Technology unveiled a next-generation near-packaged optics (NPO) super node at the World Artificial Intelligence...

Friday 17 July 2026

China's AI chips hit three walls — and bet on 3D memory to break through

China's AI chip industry is moving beyond a contest over process nodes and into a broader race involving memory, advanced packaging, chip interconnects and system architecture.

Thursday 16 July 2026

Exclusive: Advanced packaging outpaces front-end growth while NPO paves way for commercial CPO

Generative AI is accelerating demand for computing power, memory and data bandwidth, shifting semiconductor innovation beyond front-end processes toward advanced packaging, silicon...

Wednesday 15 July 2026

Huawei to unveil largest Ascend SuperPoD at Xi-opened WAIC , scaling China's AI infrastructure

Huawei will publicly display its Atlas 950 SuperPoD AI computing system for the first time at the 2026 World Artificial Intelligence...

Wednesday 15 July 2026

China's Orient Computing unveils 14nm AI chip designed to bypass HBM constraints

Shanghai Orient Computing Core Technology has launched the DF1000, a 14-nanometre AI accelerator that uses software-defined computing...

Tuesday 14 July 2026

Rambus unveils DDR5 9600 chipset for next-generation AI servers

Rambus has introduced a new DDR5 9600 server RDIMM chipset aimed at faster, denser data center memory systems. The move matters beyond one supplier because higher bandwidth and better...

Monday 13 July 2026

SK Hynix hybrid bonding push signals next phase of HBM packaging race

SK Hynix is moving early to prepare hybrid bonding technology for next-generation high-bandwidth memory (HBM), as competition in AI memory shifts from stacking capacity toward packaging...

Sunday 5 July 2026

Applied Materials unveils integrated tools for HBM, chiplet, and 3D packaging scale-up

Applied Materials announced a new equipment platform aimed at addressing the memory bandwidth and energy-efficiency bottleneck confronting AI computing, unveiling tools across DRAM,...

Friday 3 July 2026

Competing Paths in Data Center Optics: XPO Could Beat CPO to Mass Production in 2027

DIGITIMES notes that Arista Networks unveiled XPO at The Optical Fiber Communication Conference and Exhibition 2026 (OFC 2026). Unlike CPO, which is associated with more disruptive...

Monday 29 June 2026

Taiwan joins post-HBM memory race with Intel, SoftBank

Taiwan's semiconductor ecosystem has entered the race to develop a possible post-HBM memory architecture, with Powerchip Semiconductor...

Thursday 25 June 2026

Nvidia CPO roadmap positions TSMC COUPE for next AI infrastructure wave

Co-packaged optics (CPO) is rapidly emerging as a foundational architecture for next-generation AI infrastructure. With Nvidia's latest Scale-Up CPO switch roadmap now taking shape,...

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Jul 30, 08:00

EDOM Accelerates Edge AI Deployment with NVIDIA Technologies

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