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    Hanmi Semiconductor expands Taiwan and US push for potential Terafab supply chain role
    Jun 4, 17:56
    CXMT said to poach more than 200 South Korean engineers
    Jun 4, 17:56
    China EV startups return to losses in 1Q26 amid price war and R&D pressure
    Jun 4, 17:56
    NEWS TAGGED BANDWIDTH
    Wednesday 3 June 2026
    Lightmatter joins Nvidia NVLink Fusion ecosystem to expand optical AI connectivity
    Lightmatter has joined Nvidia's NVLink Fusion ecosystem, a move that could accelerate the rollout of high-performance optical links for AI infrastructure worldwide. The collaboration...
    Tuesday 2 June 2026
    Micron unveils AI memory and storage roadmap at COMPUTEX 2026
    Micron outlined a broad AI memory and storage strategy ahead of Computex 2026, saying surging demand across data centers and intelligent edge devices is reshaping the semiconductor...
    Monday 1 June 2026
    AuthenX targets CPO bottlenecks with detachable metalens FAU
    AuthenX is preparing to showcase a detachable 2D fiber-array unit at COMPUTEX 2026, as the Taiwanese optical-communications company seeks to address packaging and alignment challenges...
    Friday 29 May 2026
    Analysis: ASIC market tightens as capacity becomes key battleground for cloud chips
    Cloud service providers' demand for application-specific integrated circuits, or ASICs, is increasingly locked in as advanced process nodes, advanced packaging, and component supply...
    Tuesday 26 May 2026
    The US$16.5 Billion Bet: How Co-Packaged Optics Will Rewire AI's Backbone by 2030
    As AI clusters continue to scale, traditional interconnect architectures are facing new limits in bandwidth, power efficiency, and system integration. Co-Packaged Optics is emerging...
    Tuesday 26 May 2026
    Lightmatter joins TSMC on COUPE for 3D optical engines
    AI computing's massive demand for infrastructure is making interconnect and laser technologies key to overcoming power and bandwidth limits, prompting silicon photonics unicorn Lightmatter...
    Tuesday 26 May 2026
    Powerchip unveils 3D AI Foundry with 3D WoW DRAM stacking at COMPUTEX 2026
    Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices...
    Thursday 21 May 2026
    AMD commits over US$10 billion to Taiwan ecosystem to expand AI packaging and infrastructure capacity
    AMD said on May 21 that it plans to invest more than US$10 billion across Taiwan's semiconductor ecosystem to deepen strategic partnerships and expand advanced packaging capacity for...
    Saturday 16 May 2026
    One-person companies may upend small businesses in AI shift, adviser says

    Lee-Feng Chien, innovation economy adviser to the Executive Yuan's Economic Development Commission, said at an AI forum on May 14 that...

    Friday 15 May 2026
    InP compound semiconductors break AI power and bandwidth barriers
    Indium phosphide (InP) and other compound semiconductors are taking on a bigger role as demand rises for highly efficient light emission and ultra-high-frequency transmission. Their...
    Thursday 14 May 2026
    Taiwan panel industry transforms by riding the AI wave into microLED optical communications

    Introduction

    Monday 11 May 2026
    Memory bottlenecks threaten data-center GPU efficiency as AI inference scales, says Micron SVP
    Micron's senior vice president, Jeremy Werner, told The Circuit Podcast that memory has become a strategic bottleneck for data-center inference, warning that insufficient memory can...
    Monday 11 May 2026
    Secure City Solutions: The Canadian Firm Revolutionizing High-Stakes Video Data

    In the high-stakes world of global security and emergency response, the shift toward "video-centric" operations has created a massive technical bottleneck: the struggle...

    Wednesday 6 May 2026
    SoftBank, Intel target HBM limits with 9-layer memory
    SoftBank's memory unit SAIMEMORY is preparing to present a new 3D DRAM technology developed with Intel, as the AI hardware industry seeks ways to ease the power and heat constraints...
    Tuesday 5 May 2026
    South Korea eyes memory-led AI order against Nvidia
    As AI shifts from training to inference and from single-task use to multi-agent collaboration, South Korea's semiconductor industry is seeking to recast the market around memory rather...
    1/22 pages
    Research Report Database
    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    VIA Labs Announces Hub Controllers for Multi-Display USB-C Docking
    Thursday 28 May 2026
    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
    CPC
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook