DIGITIMES observed that as AI systems continued to scale, interconnect requirements inside AI data centers had expanded from chips, packages, and boards to racks, clusters, and eventually...
For global cloud operators and network vendors, Cisco said co-packaged optics (CPO) is moving from lab promise to commercial necessity as AI data centers strain power budgets and bandwidth...
Samsung Electronics is reportedly developing an 8-layer version of seventh-generation high-bandwidth memory for Nvidia, matching the chipmaker's requirements for its customized NVHBM...
TSMC is sharpening its silicon photonics (SiPh) roadmap to address the widening gap between AI compute growth and chip-to-chip data movement, unveiling two bandwidth-scaling paths...
The AI infrastructure race has spent the past few years fixated on high-bandwidth memory as one of the most indispensable building blocks of accelerated compute. Yet as model sizes,...
Samsung Electronics expects products based on its first-generation zHBM specifications to appear in 2029 or later, giving the 3D memory concept unveiled earlier this month an initial...
Samsung Electronics is signaling a push into high bandwidth flash (HBF), extending its next-generation memory ambitions beyond HBM as rivals move to establish a new NAND-based memory...
CXMT is narrowing the performance gap with SK Hynix in high-speed DDR5 memory, with new benchmark tests showing CXMT chips running stably at 8,000 MT/s and delivering productivity...
At Hot Chips 2026, Samsung Electronics moved processing-in-memory (PIM) closer to practical deployment, presenting what it described as the industry's first LPDDR-based PIM device...
Apple on Aug. 25 introduced M6 in a new Mac mini and M5 Ultra in a new Mac Studio, framing both chips around AI compute and memory bandwidth rather than conventional CPU headline numbers...
Samsung Electronics and Intel are pushing into each other's core businesses as AI semiconductor competition shifts from individual chips to full-system integration. South Korean reports...
Competition in high bandwidth memory (HBM) is shifting from raw memory performance to advanced packaging. As bandwidth, capacity and stack heights keep climbing, thermal management,...
SK Hynix is moving on several fronts as it pushes deeper into system-level memory competition. From high-bandwidth memory (HBM) and high-bandwidth flash (HBF) to a recently published...
The AI industry is watching the rise of co-packaged optics (CPO) as faster AI systems now depend on more efficient links between chips and data centers. At DIGITIMES Tech Forum 2026...
SK hynix has published a technical roadmap for co-packaged optics (CPO) in the journal Nature Electronics, positioning the world's largest supplier of high-bandwidth memory...
