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Friday 28 March 2025
SK Hynix to finalize 2026 HBM production target by mid-2025 amid rising AI demand
SK Hynix announced during its 77th shareholders' meeting that it will determine product volume for its high bandwidth memory (HBM) lineup in the first half of 2025. CEO Noh-Jung Kwak...
Wednesday 26 March 2025
Micron breaks the 'memory wall' with Nvidia: SOCAMM, HBM3E now shipping
Micron Technology showcased its latest AI-optimized memory technologies at GTC 2025, unveiling advanced DRAM solutions designed for data center and high-performance computing (HPC)...
Thursday 13 March 2025
Nvidia reportedly visits Samsung packaging plant amid HBM3E supply uncertainty
High bandwidth memory (HBM) major client Nvidia is said to have visited Samsung Electronics' advanced packaging plant again, just over a month after their last visit. Industry sources...
Thursday 13 March 2025
Trump card: Did US pressure sink Samsung's Baidu 2nm chip deal?
Samsung Electronics' potential collaboration with Baidu on advanced artificial intelligence (AI) chips may have been disrupted due to increased US pressure on China, according to...
Friday 7 March 2025
Micron's Mark Liu hire aims to close HBM gap amid US chip push
Micron has appointed former TSMC chairman Mark Liu as a board member. Multiple South Korean media outlets report this move as Micron's attempt to expand its market share in high bandwidth...
Wednesday 26 February 2025
Macronix, TSRI announce new 3D DRAM technology
The Taiwan Semiconductor Research Institute (TSRI), under the National Science and Technology Council (NSTC), announced at a press conference held by Taiwan's National Applied Research...
Monday 24 February 2025
AI boom sends HBM demand soaring as Samsung eyes ASIC market shift
The global AI boom is set to keep high bandwidth memory (HBM) in short supply through 2025, as demand surges across AI and data-intensive applications, according to experts at SEMICON...
Monday 3 February 2025
China's Tongfu Microelectronics reportedly begins HBM2 trial assembly
According to a report by Nikkei, Tongfu Microelectronics is rumored to have commenced trial production of high bandwidth memory (HBM2). This development follows fellow Chinese...
Wednesday 8 January 2025
CES 2025: HDMI 2.2 debuts, advancing immersive and virtual experiences
The HDMI Forum introduced the HDMI 2.2 specification at CES 2025, a major upgrade designed to expand the capabilities of the HDMI ecosystem. This new standard provides content creators...
Thursday 26 December 2024
Development of NVLink

Introduction

Wednesday 18 December 2024
US tightened chip controls put Samsung's China operations at risk
The US Department of Commerce's Bureau of Industry and Security (BIS) has expanded semiconductor export controls to include high bandwidth memory (HBM), a crucial component for artificial...
Tuesday 17 December 2024
Advantest unveils testing solutions for AI and advanced chips
Japanese semiconductor testing equipment firm Advantest has announced its latest testing solutions for advanced applications such as high-end memory, 5G, AI, and high-performance...
Monday 16 December 2024
Samsung gears up for AI edge market with LPDDR6 samples expected by 2025
Samsung Electronics plans to introduce samples of its next-generation LPDDR6 memory by late 2025, addressing the growing demand for on-device AI solutions. The initiative aims to...
Thursday 12 December 2024
Nokia sees 6G and AI reshaping telecom landscape by 2030
Nokia laid out an ambitious roadmap for 6G development and network innovation at a recent Taiwan event, forecasting explosive growth in bandwidth demand and a shift toward AI-driven...
Tuesday 10 December 2024
Samsung reportedly explores discrete LPDDR for future iPhones amid rising AI demands
Samsung Electronics is exploring the development of discrete package low-power DRAM (LPDDR) for Apple's iPhones to meet the tech giant's evolving requirements, though Samsung has...