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NEWS TAGGED CAPACITY EXPANSION
Wednesday 9 February 2022
Automotive CIS packaging capacity fully loaded
Automotive CMOS image sensor (CIS) packaging capacity at Taiwan-based OSATs such as Tong Hsing Electronic Industries and Xintec remains fully loaded, and they can easily carry out...
Wednesday 9 February 2022
DRAM chipmakers upbeat about demand for servers, data centers
DRAM chipmakers are generally optimistic about demand for servers and datacenters in 2022, when the overall market demand is forecast to increase 15-20%, according to industry sour...
Wednesday 9 February 2022
Nan Ya PCB posts record January revenue
Nan Ya PCB has reported its consolidated revenue climbed 33.6% on year to a record high of NT$5.24 billion (US$188.3 million) in January 2022.
Tuesday 8 February 2022
Infineon aims to ramp up in-house production in 2022
German-based automotive and power semiconductor supplier Infineon is planning to ramp up in-house production in 2022 as it expects semiconductor demand to continue to outweigh the...
Tuesday 8 February 2022
Winbond to kick off construction of phase-2 facility at new plant
Specialty DRAM specialist Winbond Electronics plans to advance its second-phase facility construction at its new plant in Kaohsiung, southern Taiwan to ease tight capacity for specialty...
Monday 7 February 2022
GlobalWafers earmarks US$3.6 billion for capacity expansion after Siltronic deal annulled
Taiwan-based GlobalWafers (GWS) announced on February 6 that the proceeds originally intended for the Siltronic acquisition are now earmarked for capital and operating expenses, focusing...
Friday 4 February 2022
Toshiba regards Thailand as manufacturing hub of discrete semiconductors
Toshiba Semiconductor (Thailand) is an important contributor to Toshiba's network of companies which provide a robust supply of discrete semiconductors. As Toshiba's largest semiconductor...
Thursday 27 January 2022
UMC warns of potential 28nm chip oversupply
The 28nm process market segment may experience an oversupply beyond 2023, according Jason Wang, president for pure-play foundry United Microelectronics (UMC).
Friday 21 January 2022
Compeq foresees intense high-end HDI PCB demand
Taiwan-based Compeq Manufacturing has expressed optimism about high-end HDI PCB demand in 2022, and expects its shipments for low-orbit satellites to double and to contribute 6-8%...
Wednesday 19 January 2022
Leadframe suppliers gearing up for capacity expansion
Leadframe supply for IC packaging remains tight, and suppliers such as Chang Wah Technology (CWTC) have been keen to expand production capacity to satisfy strong demand for processing...
Monday 17 January 2022
Mitsubishi Electric considers expanding power semiconductor production
Mitsubishi Electric is currently considering expanding production capacity for power semiconductors and turning its LCD panel plant in Kumamoto, Japan into a power semiconductor manufacturing...
Thursday 13 January 2022
What motivates TSMC to spend big on capacity expansion
TSMC's planned US$100 billion in capex from 2021 to 2023 will not be sufficient to carry out its capacity expansion projects in Taiwan and overseas, market observers believe. The...
Tuesday 11 January 2022
China chipmakers reportedly build additional output for power semiconductors
China-based chipmakers including China Resources Microelectronics (CR Micro), Silan Microelectronics and StarPower Semiconductor have reportedly stepped up their capacity expansion...
Friday 7 January 2022
Highlights of the day: TSMC likely to spend more on capacity expansion
Demand for foundry services has been so strong that TSMC may have to raise its capex budget for 2022 in order to accelerate...
Friday 7 January 2022
QCT, Wiwynn gearing up for capacity expansions
Server ODMs Quanta Cloud Technology (QCT) and Wiwynn are both looking to expand production capacities substantially in 2022, according to the Taiwan-based companies.