DIGITIMES Research analyst is cautious about India's ambitious plan to make a breakthrough in chipmaking in five years. Foxconn announced a fresh round of investments to expand manufacturing...
Moore Silicon, a chip subsidiary of the Chinese state-owned electronics company TCL, is the latest dissolved in-house IC design team of a technology conglomerate in China after Oppo's...
As the AI era arrives, cloud service providers (CSP) have increasingly recognized the importance of high-performance computing (HPC) chips, and system integrators, hardware manufacturers,...
India is aggressively recruiting Taiwanese partners for its semiconductor dream. Not only aiming to produce mature-node semiconductors for its 1.4 billion population market, it also...
Intel held the 'Intel Innovation Taipei 2023 Technology Forum' on November 7th in Taipei, which highlighted the importance of the Taiwanese PC and data center supply chain for Intel...
The market believes escalating restrictions imposed by the US on AI chip shipments to China will detrimentally affect US chip vendors Advanced Micro Devices (AMD), Intel, and Nvidia;...
TSMC has become the primary revenue backer of the Southern Taiwan Science Park (STSP), as it is for the Hsinchu Science Park (HSP), which is nearly saturated with land, according...
Nexchip Semiconductor, a Chinese mature-node IC foundry, has stepped up its deployment in the automotive IC sector with the opening of a new fab in Hefei specializing in manufacturing...
Winbond Electronics, a specialty DRAM and flash memory maker, has expressed optimism about its business and market prospects for next year, noting the resolution of the majority of...
Qualcomm's Snapdragon Summit 2023 has ignited a new round of competition in the AI PC and AI smartphone markets, with major competitors Apple and MediaTek set to unveil their new...
With smartphone developments revolving around AI, a massive shift is taking place in smartphone SoC architecture. Qualcomm insiders point to a rethink of the conventional wisdom:...
AI chips and co-packaged optics (CPO) will stimulate demand for advanced packaging in 2024, during which the semiconductor industry is expected to rebound.