Speculation has emerged that Microsoft has scaled down its orders for Nvidia's H100 AI chips, which some industry sources believe could help other companies get their hands on more...
Huawei's Mate 60 Pro has been shown to be equipped with only locally-produced SoCs and no peripheral chips from US-based companies. This revelation is part of the greater trend in...
Semiconductor material distributors, such as Niching Industrial, Chang Wah Technology (CWTC), Topco Scientific, and Wahlee Industrial, continue to observe relatively stable demand...
IC design company Weltrend Semiconductor has seen operations recover quarter by quarter as it moves inventory at a healthy pace. The company sees promising futures for both its main...
Memory makers continue to see end-market demand trail behind supply, but a recent surge in spot prices has prompted channel distributors and retailers to stockpile in anticipation...
As the smart home ecosystem continues to expand and the AI application trend rages on, many traditional Chinese home appliance makers like TCL, Hisense, Midea, and Gree are observing...
IC packaging leadframe suppliers are bracing for on-year profit decreases in 2023, as demand for automotive chips cannot offset the impact of diminishing consumer chip demand, according...
IC design firms are aware of a rising pattern of Chinese clients shifting orders to domestic competitors in favor of homegrown chips, according to industry sources in Taiwan.
TSMC has deployed 3nm process technology to mass production with Apple as its first customer, and is gearing up to execute more orders for 3nm chips from other key customers in 2024,...
Qualcomm said Monday that it will continue to supply Apple with 5G modem chips through 2026, raising concerns about the progress of Apple's in-house developed 5G chip.
Taiwan-based IC backend houses have witnessed an improvement in their sales performance during the third quarter. However, it is anticipated that a significant rebound in demand may...
Driven by the AI frenzy, high-performance computing (HPC) chips are becoming pivotal in the semiconductor landscape, spotlighting advanced packaging technologies like CoWoS. Heat...
Amid the AI frenzy, advanced packaging technology such as CoWoS has gained significant market attention, but smartphone APs based on 3D chiplet technology are expected to take off...
