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    NEWS TAGGED EAST ASIA
    Monday 18 August 2025
    Hua Hong Semiconductor to acquire HLMC to expand 12-inch chipmaking capacity

    Hua Hong Semiconductor announced on August 17 that it will acquire a controlling stake in Shanghai Huali Microelectronics Corporation...

    Monday 18 August 2025
    Dixon Technologies, HKC seal joint venture agreement for display manufacturing in India
    Dixon Technologies formed a joint venture with China's HKC, highlighting a thaw in India-China business ties, even as US President Donald Trump's 50% tariff on Indian goods unsettles...
    Monday 18 August 2025
    Huawei escalates IP battle with Africa's dominant smartphone vendor
    Chinese handset maker Shenzhen Transsion Holdings Co., known as the "king of phones in Africa," is facing a fresh legal challenge from Huawei, highlighting growing intellectual property...
    Monday 18 August 2025
    ASML's uneasy role in the tech war: What 3 years inside the Dutch giant reveal about US–China rivalry
    The United States has steadily ratcheted up export controls on semiconductor technology to China, with its ban on ASML's extreme ultraviolet (EUV) lithography machines standing as...
    Monday 18 August 2025
    Huawei tests China's first HBM3 as CXMT accelerates expansion to counter supply squeeze
    China's push for self-reliance in artificial intelligence (AI) semiconductors is running into fresh obstacles as Washington tightens controls on advanced memory. In response, ChangXin...
    Monday 18 August 2025
    Weekly news roundup: Apple's US$599 MacBook, China's HBM3 breakthrough, and TSMC 2nm leak update
    Below are the top DIGITIMES Asia stories from August 11 to 17, 2025. Leading the headlines: Apple is preparing to launch a US$599 MacBook, with mass production of key components expected...
    Monday 18 August 2025
    SK Hynix labor dispute delays Nvidia HBM supply talks
    A proposed bonus exceeding KRW100 million (US$72,000) per employee threatens to spark SK Hynix's first full-scale strike, with stalled high-bandwidth memory (HBM) supply talks heightening...
    Monday 18 August 2025
    Samsung DRAM market share sinks to decade low, consumer electronics cushion the blow
    Samsung Electronics' global DRAM market share slipped to 32.7% in the first half of 2025, down 8.8% from 41.5% a year earlier, according to its August 14 semiannual earnings report,...
    Monday 18 August 2025
    Samsung signs DeepX for 2nm process to advance GenAI computing at the edge
    Global pioneer in ultra-low-power AI semiconductors, DeepX, has recently become one of Samsung Electronics' foundry clients utilizing its 2nm semiconductor manufacturing process....
    Monday 18 August 2025
    China commands 60% of global AI patents, races to close US gap in computing power
    China is entering the second half of 2025 by reviewing its "14th Five-Year Plan" technology milestones and mapping priorities for the upcoming "15th Five-Year Plan." Liu Liehong,...
    Sunday 17 August 2025
    Kdan Mobile Software partners with Japanese AI search startup for agent ecosystem
    Kdan Mobile Software (KDAN) has formed a strategic partnership with Japanese AI search engine startup Felo, with integrated technologies expected to debut in the fourth quarter of...
    Sunday 17 August 2025
    Applied Materials faces lawsuit from smaller Chinese rival
    Chinese semiconductor equipment makers are increasingly taking the offensive in protecting their technology and intellectual property. Beijing E-Town Semiconductor Technology has...
    Saturday 16 August 2025
    China breaks neutral atom quantum record, showcasing AI’s role in next-gen computing
    The quantum research team at the University of Science and Technology of China (USTC) has set a new world record. Academic administrator Jianwei Pan and Professor Chao-Yang Lu from...
    Saturday 16 August 2025
    SK Hynix expands EUV in 1c DRAM, launches faster low-power chips for AI PCs

    SK Hynix is stepping up its use of extreme ultraviolet (EUV) lithography in next-generation DRAM, increasing the number of EUV layers...

    Friday 15 August 2025
    China's CXMT resumes big-ticket chip investments to expand DDR5, fast-track HBM3 output
    ChangXin Memory Technologies (CXMT) has restarted major facility investments to ramp up DRAM output and fast-track high-bandwidth memory (HBM) development, highlighting Beijing's...
    6/203 pages
    Veeam Q3
    BIZ FOCUS
    Aug 5, 11:49
    Cultivating OCP, embracing open source
    Wednesday 13 August 2025
    Advanced WLP and back-end solutions at SEMICON Taiwan 2025
    Wednesday 9 July 2025
    TRI unveils new multi-camera AOI, TR7500 SIII Ultra
    Wednesday 13 August 2025
    Alif Semiconductor vying for market dominance in battery-powered generative AI applications and Edge AI
    RESEARCH INSIGHTS
    Intel signals overhaul of IDM 2.0 and foundry strategy with Lip-Bu Tan's appointment, says DIGITIMES