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    MOEA says zero tariffs to impact Taiwan auto output value by over 1%
    0min ago
    Taiwan breaks ground on 12-inch semiconductor R&D base at ITRI, backed by TSMC equipment donations
    35min ago
    South Korean IC design faces up to one-year packaging delays amid AI chip material shortages
    Feb 10, 18:22
    Chinese TV brands surpass South Korean rivals with TCL nearing Samsung's market share
    Feb 10, 18:22
    GPTC management shakeup raises concerns over TSMC, ASE, Micron orders
    Feb 10, 18:11
    NEWS TAGGED EQUIPMENT
    Sunday 28 September 2025
    Tokyo Electron revises profit outlook amid China sales slowdown and market shifts
    Tokyo Electron has revised downward its net profit forecast for the fiscal year ending March 2026, citing a slowdown in Chinese market sales and customer capital expenditure adjustments...
    Friday 26 September 2025
    China to command 42% of global chipmaking capacity by 2028, SEMI says
    The global semiconductor industry is entering an unprecedented growth phase driven by artificial intelligence, with market forecasts projecting the sector to exceed US$1 trillion by...
    Friday 26 September 2025
    Tata Electronics reportedly in talks with ASML, JT Corp for fab and OSAT projects in India
    Tata Electronics is in discussions with several global semiconductor equipment makers, including Dutch giant ASML and South Korea's JT Corp, to supply its upcoming fabrication plant...
    Thursday 25 September 2025
    Philippines’ pro-US pivot draws Taiwanese network suppliers
    Amid changing geopolitical dynamics, Southeast Asia is becoming a key expansion area for Taiwanese manufacturers. The Philippines' shift from pro-China to pro-US, coupled with its...
    Thursday 25 September 2025
    China builds a multi-track lithography push

    Shenzhen-based Wonder Sight has launched its first domestically developed high-precision stepper lithography machine, a milestone in China's...

    Wednesday 24 September 2025
    Yole Group CEO interview (Part 2): Post-Moore's Law era sparks advanced packaging race
    As Moore's Law approaches physical and commercial limits, advanced packaging has surged as a new battleground in the semiconductor industry. TSMC not only leads globally with its CoWoS...
    Tuesday 23 September 2025
    Hanwha Semitech reportedly courts Foxconn, ASE in OSAT race
    Hanwha Semitech is stepping up its push into Taiwan's semiconductor supply chain, holding closed-door talks with Foxconn and ASE Holdings at SEMICON Taiwan 2025, according to South...
    Monday 22 September 2025
    Sunengine enters CPO advanced packaging supply chain
    The explosive growth in AI computing demand is driving increased needs for GPUs, ASICs, and other components, accelerating the rapid development of global data center infrastructure...
    Monday 22 September 2025
    Not just Apple anymore: TSMC's 2nm finds 15 buyers hungry for AI performance
    TSMC's 2nm (N2) process is nearing mass production, with industry sources indicating it has secured up to 15 customers. About 10 are focused on high-performance computing (HPC), showing...
    Friday 19 September 2025
    Samsung and SK Hynix set stage for global battle over HBM4 chips

    SK Hynix has announced it is the first in the world to establish a mass production system for sixth-generation High Bandwidth Memory (HBM4),...

    Thursday 18 September 2025
    Sinbon Electronics drives expansion amid strong global semiconductor demand
    Sinbon Electronics is actively expanding its production capacity in response to robust global demand in the semiconductor sector. The company recently secured certifications from several...
    Thursday 18 September 2025
    Arm inaugurates Bengaluru design center, boosting India's chip ambitions
    Arm has opened a new chip design center in Bengaluru focused on advanced 2nm chips. Union IT minister Ashwini Vaishnaw called it a milestone for India's semiconductor goals, making...
    Thursday 18 September 2025
    CoPoS emerges as successor to CoWoS: K&S aligns with AI chip demands
    Advanced packaging has emerged as the centerpiece of semiconductor innovation, with industry attention now focused on what will replace the dominant chip-on-wafer-on-substrate (CoWoS)...
    Thursday 18 September 2025
    Hanwha Semitech stakes early lead in hybrid bonding race for SK Hynix's HBM4
    Hybrid bonding machines are set to become critical by 2027, when chipmakers move into mass production of 20-layer, sixth-generation high-bandwidth memory (HBM4). Global equipment suppliers...
    Thursday 18 September 2025
    India-based Cyient Semiconductors partners with US-based Anora on semiconductor validation and test facility in India
    Cyient Semiconductors has entered a strategic partnership with US-based Anora, headquartered in Texas, to provide end-to-end semiconductor development solutions, from design to production...
    22/55 pages
    Research Report Database
    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
    Special Report
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook