CONNECT WITH US
NEWS TAGGED EQUIPMENT
Friday 15 August 2025
Exclusive: TSMC primes CoPoS supplier network for Chiayi, US fabs ahead of 2028 ramp
TSMC is pushing its advanced packaging roadmap beyond its CoWoS platform and the wafer-level multi-chip module (WMCM) — an enhanced InFO-PoP due in 2026 — with a new integration...
Friday 15 August 2025
ASC emerges from July slump as semiconductor manufacturers continue global expansion
ASC, a key supplier of fluororesin equipment and materials for the semiconductor industry, currently holds orders worth over NT$4 billion (US$133.6 million), reflecting a recovery...
Friday 15 August 2025
Applied Materials warns of $500M China sales drop in Q4 FY 2025
Applied Materials reported strong third-quarter fiscal 2025 results, but warned that revenue and profit will decline sequentially in the fourth quarter as the company navigates a...
Friday 15 August 2025
China's Visionox plots twin-track OLED surge, from Canon Tokki lines to ViP era
China's Visionox is pursuing a dual-track OLED expansion, ordering new production equipment to increase existing output while fast-tracking its proprietary Visionox Intelligent Pixelization...
Thursday 14 August 2025
Samsung reportedly plans US$170M in Japan packaging hub to challenge TSMC
Samsung Electronics is reportedly investing JPY25 billion (approx. US$170 million) to set up an advanced packaging research institute in Yokohama and acquire a major office tower...
Thursday 14 August 2025
AblePrint seizes AI packaging edge with early WMCM, CoPoS deployment

AblePrint Technology (APT), a key supplier of advanced degassing equipment to major chipmakers such as TSMC, reported strong second-quarter...

Thursday 14 August 2025
Tatung secures orders through 2027, steps up US heavy electrical plant acquisitions
Taiwan's renowned conglomerate Tatung Company has secured clear order visibility for its core power equipment and solutions through 2027 and is accelerating acquisitions of heavy...
Thursday 14 August 2025
Gemtek experienced a 51.5% drop in revenue in July, citing ongoing challenges with its transition
Networking equipment manufacturer Gemtek reported a significant drop in revenue for July 2025 and the first half of the year due to strategic changes in its business model. The company's...
Thursday 14 August 2025
TASA expands domestic satellite manufacturing with industry-led development platform
As Taiwan accelerates efforts to localize satellite manufacturing, the Taiwan Space Agency (TASA) recently held a briefing on its new communications satellite manufacturing industrialization...
Thursday 14 August 2025
Rubin testing supply chain takes shape: Taiwanese firms invest heavily in AI accelerator opportunities
With Nvidia's Rubin GPUs powering the next generation of AI servers scheduled to enter the market in the second half of 2026, recent developments show an accelerated expansion in...
Thursday 14 August 2025
US chip-gear maker sued in China over alleged trade secret theft
Top US chip-equipment supplier Applied Materials Inc. was sued by a rival in China over what that company characterized as trade secret theft, a further escalation in the technology...
Thursday 14 August 2025
South Korean equipment makers eye entry into India battery manufacturing
South Korean battery equipment manufacturers are positioning themselves to benefit from India's accelerating push into advanced battery production, with Tata Group's battery subsidiary...
Wednesday 13 August 2025
STSP welcomes three new companies spanning aerospace, PSCs, and water treatment equipment
The National Science and Technology Council (NSTC) Southern Taiwan Science Park (STSP) Bureau has recently approved investment applications from three companies: Yalixin, Mega Sunergy,...
Wednesday 13 August 2025
China's chip equipment spending surges in 1H25, defying global downturn
China's semiconductor industry posted CNY455 billion (approx. US$63.3 billion) in total investment during the first half of 2025, down 9.8% from a year earlier, according to a new...
Wednesday 13 August 2025
Samsung bets big on DRAM overhaul to reclaim HBM crown
Samsung Electronics is doubling down on its bet to regain leadership in high-bandwidth memory (HBM), the ultra-fast chip architecture powering next-generation artificial intelligence...