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Monday 24 June 2024
Innolux, OSATs stepping up FOPLP deployment
In recent years, Fan-Out Panel-Level Packaging (FOPLP) technology has become a rare opportunity for OSATs and other industry participants to compete with TSMC, Samsung Electronics,...
Monday 24 June 2024
South Korean manufacturers rumored to consider 'full liquidation' of old equipment
Even since the US imposed sanctions on China, South Korean manufacturers have been storing old equipment in warehouses, incurring annual rental fees exceeding KRW20 billion (approx...
Monday 24 June 2024
South Korean equipment makers set to benefit from BOE's 8.6G OLED plant construction in China
BOE Technology, the largest Chinese display panel manufacturer, is reportedly placing equipment orders for its 8.6-generation (8.6G) OLED panel plant under construction in China....
Thursday 20 June 2024
Fab toolmakers see strong demand for HBM, CoWoS-like from China
IC equipment and materials suppliers have seen a surge in demand from China's semiconductor industry, where companies are rushing to adopt HBM memory and CoWoS-like technology, according...
Wednesday 19 June 2024
US lawmakers look to bar Chips Act winners from using Chinese tools
US lawmakers want to prevent companies that win federal chipmaking funds from using Chinese-made equipment at government-backed factories, part of efforts to limit Beijing's influence...
Tuesday 18 June 2024
FitTech faces challenges, seeks opportunities with TSMC's advanced packaging
The Mini LED demand in the LED industry has shown a lack of new momentum, leading to a halt in expansion plans, and impacting equipment supplier FitTech's operations.
Monday 17 June 2024
Fab tool and equipment suppliers benefit from TSMC 2H24 business boom
TSMC's second-quarter sales may surpass the target, seeing customers' AI and HPC-related orders flowing in. In July, chips for Apple's iPhone 16 and Intel's 3nm chips will start mass...
Thursday 13 June 2024
China accounts for half of Japan's chip equipment exports for 3 quarters in a row
China's demand for Japanese semiconductor equipment has been growing rapidly amidst the export sanction imposed by the US on advanced semiconductor equipment and technologies.
Thursday 6 June 2024
Imec, ASML open joint lithography lab
Imec and ASML have jointly announced the inauguration of a High NA EUV lithography lab in Veldhoven, the Netherlands. This lab is operated jointly by the two companies.
Tuesday 4 June 2024
Laying groundwork for panel-level packaging processes, Manz deepens deployment in advanced semiconductor packaging blue ocean
As the Artificial Intelligence (AI) and High-Performance Computing (HPC) markets continue to rapidly grow, the semiconductor industry is racing to satisfy customer needs with advanced...
Thursday 30 May 2024
Sony adjusts CIS production expansion schedule; equipment investment reduced for next three years
Sony's semiconductor business division, primarily focused on CMOS Image Sensors (CIS), plans to reduce its equipment investment amount in the next three fiscal years from 2024 to...
Thursday 30 May 2024
Malaysia plots US$5.3 billion roadmap to build advanced chip ecosystem
Malaysian Prime Minister Anwar Ibrahim announced the National Semiconductor Strategy (NSS), with the government allocating MYR25 billion (US$5.3 billion) to foster industry develop...
Wednesday 29 May 2024
MEAN WELL showcases power supply expertise at COMPUTEX to support industry's carbon reduction goals
As the world strives to achieve the vision of net-zero carbon emissions, improving energy efficiency has become more important than ever. Eris Wu, Chief Technical Service Officer...
Tuesday 28 May 2024
Micron reportedly plans to produce advanced DRAM in Japan by the end of 2027
Micron, which has a DRAM factory in Hiroshima Prefecture, Japan, is reportedly planning to construct a new plant adjacent to the existing Hiroshima factory as early as 2026.
Tuesday 28 May 2024
Russia to produce 350nm chips with its self-developed lithography machines in 2024, says Chinese media
Vasily Shpak, Deputy Minister of Industry and Trade of the Russian Federation, was quoted by Ijiwei, a Chinese media focusing on semiconductor news that Russia will soon...
Colder Products Company
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research