Nano-electronics research center imec and Cadence Design Systems have announced that the companies completed the first tapeout of a 5nm test chip using extreme ultraviolet (EUV) as...
ASML has confirmed that Taiwan Semiconductor Manufacturing Company (TSMC) has successfully exposed more than 1000 wafers on an NXE:3300B EUV system in a single day, an important step...
Lithography system vendor ASML announced on November 24 that Taiwan Semiconductor Manufacturing Company (TSMC) has ordered two NXE:3350B EUV systems for delivery in 2015 with the...
ASML's new EUV system, the NXE:3300B, has obtained 18 orders. In order to meet customer demand, the lithography tool vendor is looking to boost its production capacity for EUV tool...
ASML and Cymer have entered into a definitive agreement under which ASML will acquire all outstanding shares of Cymer in a cash-and-stock transaction currently valued at EUR1.95 billion...
Taiwan Semiconductor Manufacturing Company (TSMC) is still evaluating the proposal from ASML for joint development of new technologies, and no decision has been made yet, according...
ASML has been developing the next generation of its NXE-series EUV lithography machines, the 3300 series, according to Peter Jenkins, VP of marketing at the Dutch fab tool supplier...
IMEC has announced that it has signed a new agreement with ASML for a period of five years (2011-2015). The pair's continued collaboration guarantees the global semiconductor ecosystem...
Applied Materials, Inc. advanced the state-of-the art in photomask technology with its new Applied Centura Tetra EUV Advanced Reticle Etch system. Overcoming a major hurdle to the...
The transition to manufacturing semiconductors on larger wafers continues to be one of the hottest topics in the industry. However, uncertainty with EUV rollout has exacerbated the...
ASML has received 10 orders for its next-generation ultraviolet (EUV) lithography system – the NXE:3300 – with deliveries starting in 2012, according to the Dutch fab...
Taiwan-based DRAM makers will find themselves at a disadvantage to migrate their production to 20nm and below processes, as they struggle to preserve cash for the expenses needed...
ASML has recently invited DRAM companies to make early reservations for extreme ultraviolet (EUV) lithography tools to avoid a repeat of early 2010, when immersion scanners saw constrained...
Extreme ultraviolet (EUV) lithography is likely to reach mass production in 2014 at the earliest, according to Luc Van den hove, president and CEO of Belgian researcher IMEC. But...
