Taiwan Semiconductor Manufacturing Company (TSMC) is still evaluating the proposal from ASML for joint development of new technologies, and no decision has been made yet, according...
ASML has been developing the next generation of its NXE-series EUV lithography machines, the 3300 series, according to Peter Jenkins, VP of marketing at the Dutch fab tool supplier...
IMEC has announced that it has signed a new agreement with ASML for a period of five years (2011-2015). The pair's continued collaboration guarantees the global semiconductor ecosystem...
Applied Materials, Inc. advanced the state-of-the art in photomask technology with its new Applied Centura Tetra EUV Advanced Reticle Etch system. Overcoming a major hurdle to the...
The transition to manufacturing semiconductors on larger wafers continues to be one of the hottest topics in the industry. However, uncertainty with EUV rollout has exacerbated the...
ASML has received 10 orders for its next-generation ultraviolet (EUV) lithography system – the NXE:3300 – with deliveries starting in 2012, according to the Dutch fab...
Taiwan-based DRAM makers will find themselves at a disadvantage to migrate their production to 20nm and below processes, as they struggle to preserve cash for the expenses needed...
ASML has recently invited DRAM companies to make early reservations for extreme ultraviolet (EUV) lithography tools to avoid a repeat of early 2010, when immersion scanners saw constrained...
Extreme ultraviolet (EUV) lithography is likely to reach mass production in 2014 at the earliest, according to Luc Van den hove, president and CEO of Belgian researcher IMEC. But...
Taiwan Semiconductor Manufacturing Company (TSMC) will take delivery of its first extreme ultraviolet (EUV) lithography system from ASML in 2011 paving the way for the company to...
ASML Holding today announced that Taiwan Semiconductor Manufacturing Company (TSMC) will take delivery of a Twinscan NXE:3100 extreme ultra-violet (EUV) lithography system. This tool...
Toshiba has announced development of a high-resolution photo-sensitive film (photoresist) essential for future application of extreme ultraviolet (EUV) lithography in semiconductor...
Customers have turned more active in placing orders, according to Antonio Mesquida Kusters, Director of Market Intelligence for ASML. Citing predictions by research firms, Kusters...
United Microelectronics Corporation (UMC) currently focuses its R&D on 28nm and 22nm processes and related key technologies as well as 18-inch wafers, according to company central...
KLA-Tencor has introduced the Teron 600-series reticle defect inspection system to address a major transition in mask design at the 2Xnm logic (3Xnm half-pitch memory) node. The new...
