CONNECT WITH US
NEWS TAGGED EUV
Friday 20 October 2017
TSMC raises IC market forecasts for 2017
Taiwan Semiconductor Manufacturing Company (TSMC) has revised upward its forecasts for global foundry and overall IC market outlook for 2017 to a 7% and 16% growth, respectively,...
Friday 20 October 2017
ASML 3Q17 sales exceed guidance on extra EUV deliveries
ASML has announced net sales of EUR 2.45 billion (US$2.89 billion) for the third quarter of 2017, up 16.5% from EUR2.1 billion in the prior quarter. The Dutch fab tool vendor now...
Thursday 19 October 2017
Samsung completes qualification of 8LPP process
Samsung Electronics' 8nm FinFET process technology, the 8LPP (Low Power Plus), has been qualified and is ready for production, according to the company.
Monday 2 October 2017
China to install first EUV equipment as early as 2019, says ASML executive
Major China-based IC foundries are already in talks with ASML about the installation of their first extreme ultraviolet (EUV) lithography equipment for the manufacture of 7nm chips,...
Wednesday 27 September 2017
DRAM transition to EUV for sub-10nm node remains a financial challenge
Major DRAM chipmakers will continue to use multiple patterning exposure techniques for their 1x/1y nodes, but a question mark is still hanging over the prospect of their switch to...
Thursday 14 September 2017
SEMICON Taiwan 2017: Brewer Science showcasing innovative materials for EUV and 3D IC manufacturing
With the semiconductor-manufacturing industry needing the high computing power that can only be achieved through advanced node logic and memory, as well as the heterogeneous-integration...
Wednesday 13 September 2017
SEMICON Taiwan 2017: KLA-Tencor showcasing reticle blank inspection tools
At the ongoing SEMICON Taiwan 2017, KLA-Tencor is showcasing its new FlashScan reticle blank inspection product line which represents the company's entry into the dedicated reticle...
Wednesday 13 September 2017
ASML EUV equipment production to almost double in 2018
ASML has disclosed annual production of its extreme ultraviolet (EUV) lithography systems will increase to 20 units in 2018 from the current 12.
Tuesday 12 September 2017
Samsung intros 11nm LPP process; 7nm LPP with EUV on schedule
Samsung Electronics has added 11nm FinFET process technology (11LPP, Low Power Plus) to its advanced foundry process portfolio, offering customers with a wider range of options for...
Thursday 24 August 2017
ASML opens branch office in Nanjing
ASML has announced the opening of a new branch office in Nanjing, China where its major client TSMC is constructing a new 12-inch wafer plant.
Thursday 3 August 2017
Commentary: Can Samsung Foundry unseat TSMC?
Samsung Foundry has unveiled an aggressive sub-10nm roadmap that scales down to 4nm, and claimed it is looking to unseat United Microelectronics (UMC) as the world's second-largest...
Monday 24 July 2017
Marketech to enjoy robust OEM orders, says report
Taiwan-based Marketech International is set to enjoy a ramp-up of OEM orders from ASML for a component used in the fab tool vendor's extreme ultraviolet (EUV) lithography equipment...
Thursday 20 July 2017
ASML expects 25% growth in 2017 sales
ASML has disclosed that its second-quarter 2017 net sales came to EUR2.10 billion (US$2.42 billion), up from EUR1.94 billion from the previous quarter. The semiconductor equipment...
Wednesday 19 July 2017
FD-SOI a promising technology: Q&A with Globalfoundries CEO Sanjay Jha
Globalfoundries' fully-depleted silicon-on-insulator FD-SOI process technology targeted at Internet of Things (IoT), artificial intelligence (AI) and Big Data applications has started...
Tuesday 18 July 2017
TSMC expanding number of equipment suppliers for 7nm
Taiwan Semiconductor Manufacturing Company (TSMC) is expanding the number of suppliers of equipment for its 7nm process in a bid to maintain an ecosystem pricing balance, according...