AGC Asahi Glass (AGC) has decided to drastically expand a supply system for EUV lithography mask blanks at one of its group companies, AGC Electronics, in 2018, according to the Japan-based...
Toppan Photomasks has announced that additional investment will be made in new, leading-edge equipment for mass production of advanced photomasks at Toppan Photomasks Company Shanghai...
Taiwan Semiconductor Manufacturing Company (TSMC) is ready to enjoy a sure win over Samsung Electronics in the race of 7nm process volume production in 2018, as it has secured orders...
Samsung Electronics announced recently that its foundry business has commenced mass production of system-on-chip (SoC) products built on its second generation 10nm FinFET process...
Moore's Law has become invalid for a while, as the time needed for the transistor density to double is no longer 18-24 months although the density has indeed kept increasing, Morris...
Globalfoundries will first use EUV lithography technology in its 7nm FinFET node, and has started to work with AMD in the process development, said company CTO Gary Patton at a recent...
Taiwan Semiconductor Manufacturing Company (TSMC) has revised upward its forecasts for global foundry and overall IC market outlook for 2017 to a 7% and 16% growth, respectively,...
ASML has announced net sales of EUR 2.45 billion (US$2.89 billion) for the third quarter of 2017, up 16.5% from EUR2.1 billion in the prior quarter. The Dutch fab tool vendor now...
Samsung Electronics' 8nm FinFET process technology, the 8LPP (Low Power Plus), has been qualified and is ready for production, according to the company.
Major China-based IC foundries are already in talks with ASML about the installation of their first extreme ultraviolet (EUV) lithography equipment for the manufacture of 7nm chips,...
Major DRAM chipmakers will continue to use multiple patterning exposure techniques for their 1x/1y nodes, but a question mark is still hanging over the prospect of their switch to...
With the semiconductor-manufacturing industry needing the high computing power that can only be achieved through advanced node logic and memory, as well as the heterogeneous-integration...
At the ongoing SEMICON Taiwan 2017, KLA-Tencor is showcasing its new FlashScan reticle blank inspection product line which represents the company's entry into the dedicated reticle...
Samsung Electronics has added 11nm FinFET process technology (11LPP, Low Power Plus) to its advanced foundry process portfolio, offering customers with a wider range of options for...
