CONNECT WITH US
NEWS TAGGED HPC
Wednesday 2 November 2022
Taiwan ABF substrate suppliers to embrace sales growth in 4Q22
Taiwan-based IC substrate specialists Unimicron Technology, Nan Ya PCB, and Kinsus Interconnect Technology are poised to generate sequential revenue increases in the fourth quarter...
Monday 31 October 2022
PTI plans 40% capex cut in 2023
Backend house Powertech Technology (PTI) expects its capex for 2023 to be about 40% lower than this year's level estimated at NT$17 billion.
Tuesday 25 October 2022
US new semiconductor export control to hit China AI and supercomputer R&D, says DIGITIMES Research
The US government launched a new series of control of semiconductor export to China earlier in October - the move is expected to limit the country in designing and obtaining high-performance...
Tuesday 25 October 2022
TSMC adds new variant to CoWoS packaging
TSMC is in talks with its major clients about the adoption of its new CoWoS-R+ packaging technology for HPC chips utilizing high-bandwidth memory such as HBM3, according to industry...
Friday 21 October 2022
TSMC sees utilization rates for advanced packaging loosen
TSMC has seen capacity utilization rates for advanced integrated fan-out (InFO) and chip-on-wafer-on-substrate (CoWoS) packaging start loosening in the fourth quarter of 2022, due...
Tuesday 11 October 2022
TSMC capacity utilization for 7nm, mature nodes to fall in next 6 months
TSMC is expected to see its fab capacity utilization trending downward in the next six months, except for 5nm and 28nm process nodes, as order cuts by fabless clients are beginning...
Wednesday 5 October 2022
Sigurd sees stable demand for wireless and HPC chips
IC testing house Sigurd Microelectronics has enjoyed stable demand for wireless and HPC chips, enabling it to post about flat sequential revenue growth in September.
Wednesday 5 October 2022
Equipment supply and demand gap stabilizing for OSATs, IDMs: Q&A with K&S SVP Chan Pin Chong
Automotive chips and power devices continue to see uneven supplies, and Taiwan's leading OSATs including ASE Technology and international IDMs such as Infineon, Renesas, NXP, ST Microelectronics...
Monday 19 September 2022
MediaTek to mass produce HPC chips with CoWoS tech in 2023
MediaTek is set to mass produce its new HPC chips at TSMC in 2023 using advanced process node and CoWoS (chip on wafer on substrate) packaging technology, according to backend supply...
Monday 19 September 2022
Taiwan IC design houses keen to develop new chips, defying headwinds
Taiwan's IC design houses including MediaTek, Novatek Microelectronics and Realtek Semiconductor have sharply increased their new development projects for the next 1-2 years despite...
Thursday 15 September 2022
IC test interface solutions providers see promising HPC demand
Taiwan IC test interface solutions providers continue to embrace robust demand from major US HPC processor vendors Intel, Nvidia and AMD, which will effectively offset reductions...
Thursday 8 September 2022
IC inspection labs see demand for network chips remain strong
Taiwan's IC inspection and certification labs including Sporton International, Audix and BTL continue to enjoy strong demand for Wi-Fi and other network chips, with order visibility...
Friday 2 September 2022
Backend houses see limited impact from tightened US chip export rules to China
Taiwan-based IC packaging and testing houses expect new restrictions imposed by the US to cut China off from high-end artificial intelligence (AI) chips will have a limited impact...
Friday 2 September 2022
Fresh US chip export restrictions to curb China homegrown IC development
China's progress in developing its homegrown AI and HPC processor industry will be curbed by the US fresh restrictions on exports of advanced GPUs crucial for artificial intelligence...
Thursday 1 September 2022
ABF substrate oversupply emerges
The market for ABF substrates is slightly oversupplied, due mainly to sluggish demand for PC processors and GPUs, according to market sources.