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Friday 21 October 2022
TSMC sees utilization rates for advanced packaging loosen
TSMC has seen capacity utilization rates for advanced integrated fan-out (InFO) and chip-on-wafer-on-substrate (CoWoS) packaging start loosening in the fourth quarter of 2022, due...
Tuesday 11 October 2022
TSMC capacity utilization for 7nm, mature nodes to fall in next 6 months
TSMC is expected to see its fab capacity utilization trending downward in the next six months, except for 5nm and 28nm process nodes, as order cuts by fabless clients are beginning...
Wednesday 5 October 2022
Sigurd sees stable demand for wireless and HPC chips
IC testing house Sigurd Microelectronics has enjoyed stable demand for wireless and HPC chips, enabling it to post about flat sequential revenue growth in September.
Wednesday 5 October 2022
Equipment supply and demand gap stabilizing for OSATs, IDMs: Q&A with K&S SVP Chan Pin Chong
Automotive chips and power devices continue to see uneven supplies, and Taiwan's leading OSATs including ASE Technology and international IDMs such as Infineon, Renesas, NXP, ST Microelectronics...
Monday 19 September 2022
MediaTek to mass produce HPC chips with CoWoS tech in 2023
MediaTek is set to mass produce its new HPC chips at TSMC in 2023 using advanced process node and CoWoS (chip on wafer on substrate) packaging technology, according to backend supply...
Monday 19 September 2022
Taiwan IC design houses keen to develop new chips, defying headwinds
Taiwan's IC design houses including MediaTek, Novatek Microelectronics and Realtek Semiconductor have sharply increased their new development projects for the next 1-2 years despite...
Thursday 15 September 2022
IC test interface solutions providers see promising HPC demand
Taiwan IC test interface solutions providers continue to embrace robust demand from major US HPC processor vendors Intel, Nvidia and AMD, which will effectively offset reductions...
Thursday 8 September 2022
IC inspection labs see demand for network chips remain strong
Taiwan's IC inspection and certification labs including Sporton International, Audix and BTL continue to enjoy strong demand for Wi-Fi and other network chips, with order visibility...
Friday 2 September 2022
Backend houses see limited impact from tightened US chip export rules to China
Taiwan-based IC packaging and testing houses expect new restrictions imposed by the US to cut China off from high-end artificial intelligence (AI) chips will have a limited impact...
Friday 2 September 2022
Fresh US chip export restrictions to curb China homegrown IC development
China's progress in developing its homegrown AI and HPC processor industry will be curbed by the US fresh restrictions on exports of advanced GPUs crucial for artificial intelligence...
Thursday 1 September 2022
ABF substrate oversupply emerges
The market for ABF substrates is slightly oversupplied, due mainly to sluggish demand for PC processors and GPUs, according to market sources.
Tuesday 30 August 2022
Nvidia mulls TSMC SoIC tech in HPC chips
Nvidia is working closely with TSMC to manufacture its top-end processors, considering the adoption of the foundry's 3D SoIC (system on integrated chips) technology in its HPC chip...
Monday 29 August 2022
Robust sub-7nm chip demand buoys Alchip 1H22 profits
Robust sub-7nm chip demand buoyed IC design service company Alchip Technologies' profit performance in the first half of 2022, when the company saw sales for HPC processor orders...
Thursday 25 August 2022
Eternal Materials conservative about 3Q22
Taiwan-based Eternal Materials, dedicated to supplying synthetic resins, PCB-use dry film photoresist and CCL, and other electronics materials, is conservative about business results...
Wednesday 24 August 2022
IC substrate and automotive PCB demand promising
Market observers are generally optimistic about the IC substrate and automotive PCB market prospects in the long term, with both product segments to become major growth drivers for...