OSATs have started slowing down wirebonding and other mature packaging capacity expansions in response to waning chip demand for consumer applications, but leading players such as...
Taiwan-based backend houses including flip chip (FC) packaging, high-end testing, and IC test interface specialists are gearing up production for upcoming high-performance computing...
Advanced computing is becoming an integral part of many verticals. Artificial intelligence (AI), high-performance computing (HPC), machine learning, graphics computing, and video...
TSMC is on track to develop InFO_3D technology for processing mobile device chips that are going slimmer and lighter, looking to further expand its 3D Fabric lineup and serve more...
TSMC expects its third-quarter revenue in US dollar terms to grow about 11.2% at the midpoint. Revenue for all of 2022 in US dollar terms is forecast to register a 34-36% increase,...
Deceleration in pull-ins of orders for HPC and handset chips has significantly shortened delivery lead times at IDMs, according to industry sources in China. However, the available...
Nan Ya PCB is looking to grow its automotive IC substrate sales as a proportion of company revenue to over 10% in 2022, up from 7-8% in 2021, according to company sources.
Packaging demand for consumer electronics ICs including commodity MCUs, MOSFETs, lower-end logic ICs and power management ICs (PMICs) has contracted significantly amid lackluster...
Despite lingering handset sales uncertainty, mobile SoC vendors MediaTek and Qualcomm continue to roll out new high-end offerings, while Apple remains keen on developing high-performance...
Taiwan's suppliers of high-end IC test interface solutions are poised to enjoy growing HPC chip demand for AI, datacenter and server applications, particularly now that Chinese chipmakers...
With declining chip demand for consumer devices and new capacities gradually coming online, foundry houses could hardly sustain full utilization of their fab capacities, but it is...
As Industrial 4.0 and smart manufacturing emerge, the integration of virtuality and reality has become the mainstream. This trend has subsequently brought changes to the landscape...
High heat dissipation and other thermal management technologies are increasingly required for both front- and back-end chipmaking processes by companies engaged in the automotive,...
Leading CPU and GPU vendors AMD and Nvidia are all set to commercialize brand-new CPU and GPU platforms in 2023, and their backend partners in Taiwan are all gearing up to give full...
Demand for BT substrates, aQFN leadframes and other IC packaging materials continues ramping up, thanks to robust demand for network chips and devices, according to industry source...
