Deceleration in pull-ins of orders for HPC and handset chips has significantly shortened delivery lead times at IDMs, according to industry sources in China. However, the available...
Nan Ya PCB is looking to grow its automotive IC substrate sales as a proportion of company revenue to over 10% in 2022, up from 7-8% in 2021, according to company sources.
Packaging demand for consumer electronics ICs including commodity MCUs, MOSFETs, lower-end logic ICs and power management ICs (PMICs) has contracted significantly amid lackluster...
Despite lingering handset sales uncertainty, mobile SoC vendors MediaTek and Qualcomm continue to roll out new high-end offerings, while Apple remains keen on developing high-performance...
Taiwan's suppliers of high-end IC test interface solutions are poised to enjoy growing HPC chip demand for AI, datacenter and server applications, particularly now that Chinese chipmakers...
With declining chip demand for consumer devices and new capacities gradually coming online, foundry houses could hardly sustain full utilization of their fab capacities, but it is...
As Industrial 4.0 and smart manufacturing emerge, the integration of virtuality and reality has become the mainstream. This trend has subsequently brought changes to the landscape...
High heat dissipation and other thermal management technologies are increasingly required for both front- and back-end chipmaking processes by companies engaged in the automotive,...
Leading CPU and GPU vendors AMD and Nvidia are all set to commercialize brand-new CPU and GPU platforms in 2023, and their backend partners in Taiwan are all gearing up to give full...
Demand for BT substrates, aQFN leadframes and other IC packaging materials continues ramping up, thanks to robust demand for network chips and devices, according to industry source...
Taiwan's IC analysis and inspection labs are optimistic about better performance in the second half of 2022 than the first half, bolstered by increasing wafer material analysis (MA)...
Robust AI and HPC processor orders have boosted TSMC's chip-on-wafer-on-substrate (CoWoS) packaging capacity utilization to nearly 100%, according to industry sources.
As a whole, the notebook market has seen a reversal in demand, with consumer models bearing the brunt of sales downturn. Shipments of education-use Chromebooks, which played a pioneering...
ASE Technology with its advanced packaging capability is eyeing a bigger presence in the field of server and network chips, and expects to post revenue growth in 2022.
TSMC is unwavering in its goal of reaching 30% revenue growth by US dollars in 2022, as demand for automotive and high-performance computing (HPC) chips remains high, according to...
