Despite growing concerns about end-market demand slowdowns, pure-play foundries continue to see their fabs fully utilized with no major cutbacks in customer orders, according to industry...
Suppliers of IC packaging materials including leadframes and substrates are poised to raise their prices in the second quarter to reflect rising raw materials costs, despite a slight...
An extended COVID lockdown in Kunshan, China is not much constraining PCB and IC substrate supply from plants there operated by Taiwan-based makers Unimicron Technology and Nan Ya...
Taiwan's OSATs will find it a major task for them to prevent their capacity utilization rates from falling in the second half of 2022 though they are poised to experience steady business...
TSMC and other Taiwan-based IC foundries including United Microelectronics (UMC), Vanguard International Semiconductor (VIS) and Powerchip Semiconductor Manufacturing (PSMC) continue...
Taiwan's IC test interface specialists including Chunghwa Precision Test Tech (CHPT) are striving hard to strengthen deployments in multiple market segments beyond handsets as demand...
TSMC is expected to reiterate its sales growth outlook for 2022 of 25-29% while maintaining its capex target this year of US$40-44 billion at its upcoming investor conference call...
Having hired R&D talent from Huawei's HiSilicon, China's leading OSAT Jiangsu Changjiang Electronics Technology (JCET) has been developing its flip-chip(FC) packaging, 2.5D IC,...
Nvidia has announced its next-generation accelerated computing platform with Hopper architecture, dubbed H100 GPU, which is built using TSMC's 4nm (N4) process customized for the...
Nvidia is set to launch new HPC GPU platforms for datacenter, AI and gaming applications in 2022, and its manufacturing partner TSMC reportedly is expected to triple order placements...
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announces the availability of a platform to shorten design cycles for low-risk, high-yield production of ASICs with TSMC 2.5D...
MediaTek has seen its inventory level for handset application processors (including 4G and 5G ones) swell to 160-180 days from past regular levels of around 100 days, due mainly to...
Apple reportedly is in talks with a Korean substrate maker for the supply of ABF-based FC-BGA substrates for processing Apple Car chip solutions, sparking concerns about which IC...
Taiwan's OSATs are slowing down their logic IC wirebonding capacity expansions as the visibility of orders for processing consumer ICs is still unclear beyond the second quarter of...
Nan Ya PCB has set aside a capex budget of NT$17 billion (US$605.5 million) for 2022, double last year's level of NT$8.45 billion, mainly to expand its production capacity for ABF...
