Handset chips supply chain players share the view that their 2022 shipments for the segment will at best stay flat at 2021 levels, but HPC chip demand will continue to grow for datacenter,...

Taiwan-based IC testing firms expect to enjoy strong demand for high-end testing driven by network chips, high-performance computing (HPC) solutions, power management ICs (PMIC),...

Cooling module maker Auras Technology and Nidec Chaun-Choung Technology (CCI) are both turning their focuses to producing vapor chambers (VCs) for HPC and high-end notebook products,...

Advanced Semiconductor Engineering (ASE), a member of ASE Technology, has introduced VIPack as its family of vertically integrated package solutions including 3D heterogeneous integration...

System integration capability is increasingly needed in packaging HPC chips for AI, networking and other applications that accelerate digital transformation at enterprises and people's...

Ever-advancing datacenter, server, networking and AI applications continue to drive R&D momentum for diverse HPC chip solutions, and Arm-based HPC chips, in particular, have been...

Outsourced semiconductor assembly and testing (OSAT) vendors continue to enjoy strong order pull-in for high-end chips used in automotive, high-performance computing (HPC), and server...

Some Taiwan-based diode and MCU suppliers have extended their chip offerings for niche markets, such as middle- to high-end high-speed transmission, high-performance computing, and...

TSMC and other chipmakers have seen no cutback in orders for datacenter applications, despite market concerns raised recently about Meta Platforms' and Google's potential capex cuts,...

Despite chip demand showing signs of a downturn since the start of 2022, the capacity expansion spree at foundry houses seems unstoppable, sparking concerns that overcapacity may...

While their consumer IC packaging business continues to slow down, Taiwan OSATs have received increasing inquiries about chiplet manufacturing solutions from clients in the US, China...

Computex 2022 has kicked off in Taipei, with the focus this year on the metaverse, ESG (environmental, social, and governance), high-performance computing (HPC), AI, and 5G-related...

While chip manufacturing technology continues to advance toward sub-5nm processes, advanced packaging also has been widely recognized as a key segment to progress drastically with...

IC test solutions providers including Chunghwa Precision Test Tech (CHPT), MPI and WinWay Technology have seen a strong influx of probe card and final-test socket orders for HPC processors,...

TSMC's CoWoS-L is the latest CoWoS process variant, and is expected to kick off commercial production in 2023-2024, according to industry sources. The offering is designed to target...