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NEWS TAGGED HPC
Tuesday 24 May 2022
Chiplet processing demand on the rise
While their consumer IC packaging business continues to slow down, Taiwan OSATs have received increasing inquiries about chiplet manufacturing solutions from clients in the US, China...
Tuesday 24 May 2022
Metaverse, ESG in spotlight at Computex 2022
Computex 2022 has kicked off in Taipei, with the focus this year on the metaverse, ESG (environmental, social, and governance), high-performance computing (HPC), AI, and 5G-related...
Tuesday 24 May 2022
TSMC poised to sustain lead with integrated advanced processes in next decade
While chip manufacturing technology continues to advance toward sub-5nm processes, advanced packaging also has been widely recognized as a key segment to progress drastically with...
Friday 20 May 2022
IC test solutions providers see orders for HPC chips boom
IC test solutions providers including Chunghwa Precision Test Tech (CHPT), MPI and WinWay Technology have seen a strong influx of probe card and final-test socket orders for HPC processors,...
Friday 20 May 2022
TSMC to move CoWoS-L technology to commercial production in 2 years
TSMC's CoWoS-L is the latest CoWoS process variant, and is expected to kick off commercial production in 2023-2024, according to industry sources. The offering is designed to target...
Wednesday 11 May 2022
Intel Vision 2022 reveals on-demand service in cloud-to-edge infrastructure
On the first day of the Intel Vision 2022 event on May 10, Intel revealed an early look at the "Intel On Demand service," offering to help enterprises meet the needs...
Wednesday 4 May 2022
CHPT lands MEMS probe card orders from Asia-based customers
IC test interface solutions provider Chunghwa Precision Test Tech (CHPT) has newly landed MEMS probe card orders for smartphone chips from Asia-based customers, with volume production...
Tuesday 3 May 2022
Taiwan's new recruit from NASA aims to enhance tech innovation and industrial transformation through HPC
High-performance computing technology has been widely adopted in advanced countries to facilitate technological innovation, commercial big-data analytics, and aerospace missions....
Friday 29 April 2022
OSAT ASE upbeat about demand for automotive, HPC and network ICs
Taiwan-based OSAT ASE Technology expects demand for automotive, HPC and network ICs to stay robust and buoy further its sales performance in the second quarter and the second half...
Tuesday 26 April 2022
ABF substrate makers to see new capacity boost biz results in next 3 years
Taiwan-based ABF substrate suppliers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology are expected to commercialize additional capacities boosting their...
Monday 25 April 2022
Demand for HPC chip analysis, inspection stays strong
Demand for HPC chip analysis and inspection remains robust in the second quarter of 2022, according to industry sources in Taiwan, where major pure-play foundries and OSATs operate...
Friday 22 April 2022
TSMC sets timetable to commercialize 2nm GAA process in 2025
TSMC has set a timetable to move its 2nm GAA process to production in 2025 while commercializing its 3nm FinFET process with improved yield rates in the second half of 2022, with...
Thursday 21 April 2022
Samsung hits snag in 3nm process, yet posing new challenges to TSMC
Poor 3nm GAA process yield performance is deemed as a major setback for Samsung Electronics in its advanced foundry technology race with TSMC, which may dash the Korean tech giant's...
Thursday 21 April 2022
Non-foundry IC segments gaining weight in HPC era, says DIGITIMES Research
Apple has become a bellwether in the HPC chip segment by rolling out its high-performance M1 series built using advanced process at its foundry partner, but all other manufacturing...
Wednesday 20 April 2022
ASE gearing up for HPC chip boom
OSAT ASE Technology with its fan-out chip on substrate (FOCoS) packaging technology is gearing up for a boom in HPC chip demand, eyeing orders from major processor vendors including...
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Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research