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Thursday 13 January 2022
TSMC expects 7.4% sales growth in 1Q22
TSMC expects to post revenues of between US$16.6 billion and US$17.2 billion in the first quarter of 2022, which is a 7.4% sequential increase at the midpoint. Gross margin and operating...
Thursday 13 January 2022
What motivates TSMC to spend big on capacity expansion
TSMC's planned US$100 billion in capex from 2021 to 2023 will not be sufficient to carry out its capacity expansion projects in Taiwan and overseas, market observers believe. The...
Tuesday 11 January 2022
OLED DDI demand to boom for handset, automotive applications in 2022
OLED display drive IC (DDI) demand for handset and automotive applications is set to grow sharply in 2022 allowing DDI backend specialists ChipMos Technologies and Chipbond Technology...
Monday 10 January 2022
Lead times for high-end SoC testers extend to over 6 months, says Advantest
It will take at least six months for Advantest to deliver its high-end SoC testing equipment as shortage of key chip components needed to power the equipment has constrained the company's...
Thursday 6 January 2022
Taiwan OSAT, test interface vendors upbeat about demand for new processors
Taiwan-based OSATs and IC test interface solution providers are upbeat about demand for new processors unveiled by vendors including AMD and Nvidia for the next couple of years, according...
Monday 3 January 2022
Bullish sales not to be seen in all IC supply chains in 2022
Bullish performance seen across all semiconductor segments and players in almost the past two years will no longer remain in 2022, as chip demand will vary from segment to segment...
Wednesday 29 December 2021
Fan-out packaging demand to grow for mobile chips
Fan-out packaging demand will be rising, as Qualcomm and MediaTek reportedly are moving to adopt the technology for processing their handset-use APs and power management ICs (PMIC)...
Wednesday 29 December 2021
Unimicron showcases FOPLP substrates at SEMICON Taiwan 2021
IC substrate supplier Unimicron Technology is showcasing its newly-developed fan-out panel-level packaging (FOPLP) substrates at the ongoing SEMICON Taiwan 2021, looking to better...
Tuesday 28 December 2021
Semco reportedly to build new ABF substrate capacity in Vietnam to serve Intel
Samsung Electro-Mechanics (Semco) reportedly will set up a new ABF substrate plant in Vietnam mainly to provide dedicated capacity for Intel, with construction slated to kick off...
Friday 24 December 2021
Molding compounds to see worst crunch among packaging materials in 2022
Taiwan-based OSATs will experience mixed supply of packaging materials, with molding compounds to see the worst crunch beyond ABF substrates, and wirebonding leadframes and DAF (die...
Wednesday 22 December 2021
ABF substrate supply to see 20% shortage throughout 2022, says Unimicron
The supply of ABF substrates will continue to be at least 20% short of demand in 2022, and the crunch may start to ease only after most of new capacities at suppliers come online...
Wednesday 22 December 2021
High-end IC testing demand to stay robust in 2022
Testing demand for HPC chips, mobile application processors, wireless connectivity chips, and other high-end logic chips will stay strong in 2022, according to sources at Taiwan-based...
Monday 20 December 2021
Unimicron to increase 2022 capex on ABF substrate capacity for non-Intel clients
Taiwan's leading IC substrate maker Unimicron Technology has recently scaled up its capital expenses for 2022 to NT$35.858 billion (US$1.287 billion) from the originally planned level...
Thursday 16 December 2021
TSMC intros N4X process
TSMC has introduced its N4X process technology, tailored for the demanding workloads of high performance computing (HPC) products.
Monday 13 December 2021
Foundry capacity to stay tight in 2022 as global IC shortage lingers
Foundry capacity supply will remain tight in 2022 as global IC shortage has yet to ease and IC designers continue to seek more capacity support, although demand for certain chips...
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Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research