As chipmakers continue to ramp up production of large-size HPC chips to meet the ever-rising requirements for computing power, IC substrate makers are all stepping up capacity expansion...
ASE Technology expects market conditions in 2022 to remain favorable to it and other OSATs, and is upbeat about its ASP growth next year as automotive chips wirebonding business and...
TSMC's newly-developed system-on-integrated-chips (SoIC) technology will be first adopted for AMD's multiple high-performance computing (HPC) chip series, according to industry sou...
In addition to orders from Apple and MediaTek, orders for HPC processors from AMD and Nvidia will be another major driver for TSMC's revenue growth in 2022, according to supply chain...
TSMC will see its 12- and 8-inch fab capacities stay tight in 2021 and throughout 2022, and is gearing up for its next stage of growth, said company CEO CC Wei at an earnings earnings...
TSMC expects to post revenues of between US$15.4 billion and US$15.7 billion in the fourth quarter of 2021, which is a 4.5% sequential increase at the midpoint. Gross margin and operating...
STMicroelectronics and Xilinx have both notified their clients about price increases for their chip solutions starting the fourth quarter of 2021, which is expected to fuel a new...
While global chip shortages can hardly ease in the short term and prices continue to rise further, regional semiconductor fleets are quietly taking shape as the US, EU, South Korea,...
Taiwan-based IC substrate maker Nan Ya PCB is poised to generate sequential revenue increases through the fourth quarter of 2021, as robust ABF-based as well as BT substrate demand...
As AMD and Nvidia are warming up for rolling out new-generation CPU and GPU processors in first-half 2022, Taiwan-based IC test solutions providers including Chunghwa Precision Test...
Backend houses are expected to raise their quotes for wirebonding packaging in the first half of 2022 to reflect higher material costs, according to industry sources.
