As AMD and Nvidia are warming up for rolling out new-generation CPU and GPU processors in first-half 2022, Taiwan-based IC test solutions providers including Chunghwa Precision Test...
Backend houses are expected to raise their quotes for wirebonding packaging in the first half of 2022 to reflect higher material costs, according to industry sources.
ABF substrate makers have seen more of their customers eager to strike long-term agreements to ensure sufficient supplies through 2025 and even beyond, as tight supply is expected...
TSMC, United Microelectronics (UMC) and Vanguard International Semiconductor (VIS) are forecast to see their combined revenues increase over 10% sequentially in the third quarter...
China-based PCB maker Shennan Circuits has disclosed plans to invest a total of CNY6 billion (US$925.3 million) in building production lines for ABF substrates, making it the first...
Production technology for ABF substrates will be evolving rapidly to satisfy demand for HPC and other high-end chips, according to Tzyy-Jang Tseng, chairman for Unimicron technology...
ABF substrate suppliers have secured orders set to be fulfilled through 2023 and beyond, as major HPC chips vendors Intel, AMD, Nvidia and 5G networking chips supplier Xilinx have...
Major OSATs, including ASE Technology and Powertech Technology (PTI), are already engaged in talks with their substrate suppliers about orders for 2023, according to industry sourc...
Apple is expected to significantly increase the adoption of IPD (integrated passive devices) for new iPhones and other iOS products, providing robust business opportunities for manufacturing...
Unimicron Technology expects to sustain full capacity utilization for ABF substrates through 2025 as its capacity has been almost fully booked till then, according to the Taiwan-based...
Taiwan-based IC test solutions provider Chunghwa Precision Test Tech (CHPT) expects to post sequential revenue increases through the fourth quarter of 2021, buoyed by growing demand...
IC substrate maker Kinsus Interconnect Technology saw its net profits for second-quarter 2021 shoot up 202% on year to NT$1.01 billion (US$36.1 million), thanks to substantial improvements...
Taiwan-based leading PCB maker Zhen Ding Technology and Austria's AT&S are set to enter the high-end ABF substrate segment where demand will stay robust through 2025, both making...
ABF substrate supply is likely to remain short of demand through 2023 although makers in Taiwan, Japan and South Korea have all geared up capacity expansions at the request of chipmaking...
