China-based AI and HPC chip developers have quietly stepped up their pace of orders demanding advanced-node manufacturing at TSMC, according to industry sources.
Taiwan-based pure-play foundries including TSMC, United Microelectronics (UMC), Vanguard International Semiconductor (VIS) and Powerchip Semiconductor Manufacturing (PSMC) are all...
ABF substrate prices are likely to rise quarter by quarter in the second half of the year, as demand for such substrates continues to outgrow new capacity supply, according to industry...
Apple reportedly is set to roll out its third-generation iPhone SE series in the first half of 2022, providing new business opportunities for chip probing specialists including TSMC...
Symtek Automation Asia (SAA), an automated semiconductor equipment supplier, has seen its first-tier customers raise capital spending in a bid to push their development of 5G and...
TSMC expects to post revenues of between US$14.6 billion and US$14.9 billion in the third quarter of 2021, which is an 11% sequential increase at the midpoint. Gross margin and operating...
Taiwan's PCB manufacturer Global Brands Manufacture (GBM) is cautiously optimistic about its performance in the third quarter of 2021, as the ongoing IC shortages may disrupt its...
China-based OSATs including Jiangsu Changjiang Electronics Technology (JCET), Huatian Technology and Tongfu Microelectronics have stepped up their deployments in the advanced packaging...
Taiwan-based IC test solutions providers Chunghwa Precision Test Tech (CHPT) and Keystone Microtech are both expected to enjoy a strong second half of 2021, thanks to robust demand...
Taiwan's dedicated IC testing house King Yuan Electronics (KYEC) will see its business operations return to a growth track in the third quarter of the year after its June revenues...
Persistent foundry capacity crunch has not only ushered in high growth prospects for leading player TSMC, but also enabled some losses-ridden peers such as GlobalFoundries (GF) and...
Foundry market leader TSMC has been pinpointed as a major beneficiary of the increasingly fierce competition among HPC chip providers, according to market sources.
Intel, AMD and Nvidia are heating up competition to win more capacity support from suppliers of ABF substrates needed to process their HPC chips through at least 2025, according to...
Taiwan's OSATs, now sustaining full capacity utilization for wire-bonding process for lower-end logic chips, are embracing strong backend demand for diverse HPC chips, but their actual...
