IC test interfaces that can withstand high current of up to 1,000 A and high voltage of 1,200V will see a significant surge in demand for processing high-current driver ICs and other...
In the era of smart devices, the capabilities of traditional networking equipment are no longer sufficient as more diverse IT system functions become available. Therefore, virtualization...
Taiwan-based IC testing houses including King Yuan Electronics (KYEC), Sigurd Microelectronics and Ardentec have all kicked off R&D for more advanced 3nm-made chips, while also...
Taiwan's backend houses have seen their order visibility stay brisk despite concerns over a rapid surge in domestic Covid-19 infections, but long-term impacts of the pandemic remain...
Nan Ya Printed Circuit Board has disclosed plans to invest a total of NT$8 billion (US$286.4 million) to expand production capacity for ABF substrates at its factory site in Shulin,...
Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology have all posted both sequential and on-year increases for their April revenues, and are poised to embrace brisk...
Some Taiwan-based IC distributors and testing service vendors in AMD's supply chain are benefiting significantly from robust sales of the US firm's HPC (high-performance computing)...
NAND flash controller specialists Phison Electronics and Silicon Motion Technology have placed orders for 2022 with their foundry partners, but are still aware tight mature process...
Demand for flip-chip (FC) packaging particularly FC-BGA will be rising significantly driven by the HPC device market boom this year, and backend houses in Taiwan and China have seen...
TSMC is expected to substantially scale up its 5nm chip output in the second half of 2021 in order to boost 5nm chip sales as a proportion of its total wafer revenue to 20% by the...
TSMC expects to post revenues of between US$12.9 billion and US$13.2 billion in the second quarter of 2021, which is a 1% sequential increase at the midpoint. Gross margin and operating...
The supply of IC packaging production tools including polish grinders, wafer-dicing machines, and tape laminators has become severely tight, apart from delivery lead times lengthened...
Semiconductor material distributors including Topco Scientific, Topco Technologies and Wahlee Industrial, and IC packaging materials distributors Chang Wah Electromaterials (CWE)...
Nvidia CEO Jensen Huang has unveiled the company's latest innovations covering autonomous machines, AIs, chips, supercomputers and software during his presentation at GTC 2021.
TSMC, United Microelectronics (UMC) and Vanguard International Semiconductor (VIS) are all expected to see their revenues hit another record highs in the second quarter of 2021, as...
