CONNECT WITH US
NEWS TAGGED HPC
Wednesday 30 June 2021
Fierce competition among HPC chip suppliers to benefit TSMC
Foundry market leader TSMC has been pinpointed as a major beneficiary of the increasingly fierce competition among HPC chip providers, according to market sources.
Monday 28 June 2021
Intel, AMD, Nvidia in keen competition for ABF substrate capacity
Intel, AMD and Nvidia are heating up competition to win more capacity support from suppliers of ABF substrates needed to process their HPC chips through at least 2025, according to...
Monday 28 June 2021
Backend demand for HPC chips strong, but ABF substrate support matters
Taiwan's OSATs, now sustaining full capacity utilization for wire-bonding process for lower-end logic chips, are embracing strong backend demand for diverse HPC chips, but their actual...
Wednesday 23 June 2021
Unimicron accelerates construction of new ABF substrate plant
IC substrate supplier Unimicron Technology is accelerating the construction of its new plant in Yangmei, northern Taiwan, and expects the facility to get ready for full-scale production...
Monday 21 June 2021
TSMC to start equipment move-in at Arizona fab as early as mid-2022
Pure-play foundry TSMC is expected to kick off equipment move-in at its new advanced 5nm fab in the US state of Arizona as early as mid 2022, according to industry sources.
Thursday 17 June 2021
Ansys multiphysics solutions achieve certification for TSMC N3 and N4
Ansys has achieved certification of its cutting-edge multiphysics signoff solutions for TSMC's advanced N3 and N4 process technologies, according to the EDA company. This enables...
Wednesday 16 June 2021
Hermes Testing poised to tap cantilever probe card market
Hermes Testing Solutions (HTSI), a unit of chipmaking equipment supplier Hermes-Epitek, is poised to develop and manufacture cantilever probe cards with the technology already transferred...
Tuesday 15 June 2021
Innodisk poised to post record 2Q21 revenue
Specializing in industrial flash storage, memory module maker Innodisk is poised to see its second-quarter revenue hit a record high, according to market sources.
Friday 11 June 2021
Taiwan IC distributors to enjoy strong 2021
Taiwan-based IC distributors, particularly those specializing in memory IC sales, are poised to generate impressive revenues in 2021, according to industry sources.
Monday 7 June 2021
Taiwan backend houses caught in cluster COVID infections
Taiwan's major dedicated IC testing house King Yuan Electronics (KYEC) has been ordered by the Central Epidemic Command Center (CECC) to have all its migrant workers undergo a 14-day...
Monday 7 June 2021
Samsung to see non-memory chip sales boom in 2021
Samsung Electronics is expected to see sales of its non-memory business particularly the system LSI segment boom this year, buoyed by strong demand for handset application processors,...
Thursday 3 June 2021
AT&S to set up ABF substrate production base in Southeast Asia
AT&S has disclosed plans to invest EUR1.7 billion (US$2.07 billion) to set up a new production base for ABF substrates in Southeast Asia to satisfy the needs of its major HPC...
Thursday 3 June 2021
TSMC stepping up advanced process capacity expansion
TSMC will be stepping up its advanced process capacity expansion through 2023, according to company CEO CC Wei.
Wednesday 2 June 2021
AiP, 3D IC packaging increasingly adopted for 5G mmWave, HPC chips
With more mmWave-capable and HPC chip designs being developed, AiP, 3D stacking and other advanced packaging technologies will be increasingly needed for commercial applications,...
Friday 28 May 2021
ABF substrate suppliers see clear order visibility through 2023
Taiwan ABF substrate makers have been running their production lines at full capacity, with new orders unlikely to be fulfilled until 2023, according to industry sources.
CHT
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research