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NEWS TAGGED HPC
Thursday 10 March 2022
GUC announces 2.5D and 3D multi-die APT platform for AI, HPC, networking ASICs
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announces the availability of a platform to shorten design cycles for low-risk, high-yield production of ASICs with TSMC 2.5D...
Wednesday 9 March 2022
MediaTek seeing handset AP inventory swell
MediaTek has seen its inventory level for handset application processors (including 4G and 5G ones) swell to 160-180 days from past regular levels of around 100 days, due mainly to...
Tuesday 8 March 2022
Apple Car reportedly may adopt ABF substrates from Korean maker
Apple reportedly is in talks with a Korean substrate maker for the supply of ABF-based FC-BGA substrates for processing Apple Car chip solutions, sparking concerns about which IC...
Monday 7 March 2022
OSATs slowing down wirebonding capacity expansions for 2H22
Taiwan's OSATs are slowing down their logic IC wirebonding capacity expansions as the visibility of orders for processing consumer ICs is still unclear beyond the second quarter of...
Friday 4 March 2022
Nan Ya PCB doubles capex budget for 2022
Nan Ya PCB has set aside a capex budget of NT$17 billion (US$605.5 million) for 2022, double last year's level of NT$8.45 billion, mainly to expand its production capacity for ABF...
Wednesday 23 February 2022
Intel's IDM 2.0 vision juggles chip cost and performance
It remains to be seen how Intel will materialize its IDM 2.0 growth vision, but the chipmaker will have to face a trade-off between production cost and chip performance in determining...
Tuesday 22 February 2022
TSMC obtains significant sub-7nm chip orders
TSMC has secured significant orders demanding its sub-7nm process manufacturing from major US vendors, according to sources at semiconductor equipment suppliers.
Friday 18 February 2022
Silicon photonics gaining ground in datacenter applications
Demand for silicon photonics, mainly used in high-bandwidth optical transceivers, continues to gain momentum to support proliferating high-performance computing (HPC) applications...
Thursday 17 February 2022
Kinsus to expand production capacity for ABF substrates in 2022, 2023
Kinsus Interconnect Technology is on track to expand its production capacity for ABF substrates by 30-40% in 2022, and by another 40% in 2023, to meet ever-increasing demand for processing...
Friday 11 February 2022
TSMC posts record January revenue
TSMC saw its revenue hit a record high for the second consecutive month in January.
Monday 7 February 2022
MediaTek readies growth roadmaps for next three years
MediaTek has completed its growth plan for the next three years, and plans to achieve medium double-digit sales increases in multiple product lines rather than just handset SoCs,...
Friday 28 January 2022
Samsung foundry revenue sets record high in 4Q21
Samsung Electronics has reported consolidated revenue climbed to a record high of KRW76.57 trillion (US$63.65 billion) in the fourth quarter of 2021, when its foundry business posted...
Monday 24 January 2022
TSMC reportedly to build new advanced packaging fab in southern Taiwan
TSMC reportedly is planning to build a new advanced packaging plant in Chiayi or Yunlin county, southern Taiwan as it is fast revising its production roadmaps in response to rapid...
Tuesday 18 January 2022
PC processor prices poised to rise in 2022
PC processor prices are poised to rise substantially in 2022 to reflect rising foundry costs; processors fabricated using sub-7nm process nodes are particularly likely to rise in...
Friday 14 January 2022
TSMC expects up to 29% sales growth in 2022
TSMC expects to see its 2022 revenue in US dollar terms increase 25-29% on year, outperforming the industry average.
megawin
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research