It will take at least six months for Advantest to deliver its high-end SoC testing equipment as shortage of key chip components needed to power the equipment has constrained the company's...
Taiwan-based OSATs and IC test interface solution providers are upbeat about demand for new processors unveiled by vendors including AMD and Nvidia for the next couple of years, according...
Bullish performance seen across all semiconductor segments and players in almost the past two years will no longer remain in 2022, as chip demand will vary from segment to segment...
Fan-out packaging demand will be rising, as Qualcomm and MediaTek reportedly are moving to adopt the technology for processing their handset-use APs and power management ICs (PMIC)...
IC substrate supplier Unimicron Technology is showcasing its newly-developed fan-out panel-level packaging (FOPLP) substrates at the ongoing SEMICON Taiwan 2021, looking to better...
Samsung Electro-Mechanics (Semco) reportedly will set up a new ABF substrate plant in Vietnam mainly to provide dedicated capacity for Intel, with construction slated to kick off...
Taiwan-based OSATs will experience mixed supply of packaging materials, with molding compounds to see the worst crunch beyond ABF substrates, and wirebonding leadframes and DAF (die...
The supply of ABF substrates will continue to be at least 20% short of demand in 2022, and the crunch may start to ease only after most of new capacities at suppliers come online...
Testing demand for HPC chips, mobile application processors, wireless connectivity chips, and other high-end logic chips will stay strong in 2022, according to sources at Taiwan-based...
Taiwan's leading IC substrate maker Unimicron Technology has recently scaled up its capital expenses for 2022 to NT$35.858 billion (US$1.287 billion) from the originally planned level...
Foundry capacity supply will remain tight in 2022 as global IC shortage has yet to ease and IC designers continue to seek more capacity support, although demand for certain chips...
Taiwan-based Nan Ya Plastics has expressed optimism about sales of its CCLs and other electronic materials, citing brisk demand for 5G, automotive and HPC related applications.
Different types of SiP (system in package) solutions are facing diverse challenges, and can be materialized only through close cooperation among related semiconductor supply chain...
TSMC's 3DFabric family of 3D silicon stacking and advanced packaging technologies is in the next stage of its development, advancing from system integration to system scaling, according...
