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Wednesday 6 November 2024
GlobalWafers' profit slumps through 3Q24; CEO expects 90%+ utilization for 12-inch wafers
High client inventory levels and slower clearance rates contributed to a slowdown in GlobalWafers' silicon wafer shipments for 2024, resulting in a 38.9% drop in after-tax profit...
Wednesday 6 November 2024
HBM and beyond: SK Hynix deepens strategic partnership with TSMC
SK Hynix has strengthened its collaboration with TSMC, designating the foundry to manufacture its next-generation HBM4 logic die. The company's development of high-capacity Compute...
Wednesday 6 November 2024
Kyocera faces challenges in entering AI chip supply chain amid organic packaging substrate slump
Japan's component manufacturer Kyocera Corporation is experiencing a downturn in its semiconductor organic packaging materials business. Current demand has not met previous forecasts,...
Wednesday 6 November 2024
GF faces penalties for shipments to SJS despite SMIC, JCET divesting stakes
The US Department of Commerce's Bureau of Industry and Security (BIS) announced on November 1 that GlobalFoundries (GF), a US semiconductor foundry, has been fined US$500,000 for...
Wednesday 6 November 2024
NexChip and Samsung Foundry lead 3Q24 LCD/OLED driver IC markets
NexChip and Samsung Foundry have emerged as the dominant players in the display driver IC (DDIC) market for the third quarter of 2024, according to the latest insights from Omdia's...
Wednesday 6 November 2024
GlobalFoundries' 3Q24 earnings: 7% revenue growth driven by design wins despite YoY decline
GlobalFoundries (GF) posted earnings results for the third quarter of 2024 that ended September 30, 2024, achieving 7% sequential revenue growth to US$1.739 billion, primarily driven...
Wednesday 6 November 2024
Mature process fab capacity stays oversupplied; VIS sees price war ease but pressure remains
Vanguard International Semiconductor (VIS) reports that while price competition has diminished, market competition pressure persists due to continued mature process fabrication capacity...
Wednesday 6 November 2024
Backend firm ChipMOS cautious on 2025 capex amid DDI market concerns
ChipMOS Technology has embraced a cautious approach to capital expenditures for 2025 and anticipates that the demand for display driver ICs will experience a more pronounced correction...
Wednesday 6 November 2024
Intel CEO briefly visits Taiwan to finalize 3/2nm production capacity at TSMC
Intel CEO Pat Gelsinger was recently in Taiwan for a brief visit to meet with TSMC chairman C. C. Wei at the Hsinchu Science Park (HSP), according to sources familiar with the matt...
Wednesday 6 November 2024
To split or not to split: Intel's dilemma has no clear-cut solution
Intel is grappling with an operational crisis as its IDM 2.0 transformation plan has yet to yield results, casting doubt on when its foundry business might finally become profitable...
Wednesday 6 November 2024
Ibiden and Shinko Electric optimistic about AI, but standard server demand remains weak
Japanese IC substrate manufacturer Ibiden has lowered its overall performance forecast for the fiscal year 2024 (April 2024 to March 2025). Similarly, another IC substrate company,...
Wednesday 6 November 2024
Samsung's new semiconductor R&D campus to launch, driving next-gen memory development
Samsung Electronics plans to open its new semiconductor research and development campus in mid-November. The installation of advanced equipment is set to take place from November...
Tuesday 5 November 2024
Taiwan chips in over US$103 million to boost AMD's R&D center initiative
Following Nvidia's footsteps, AMD is set to establish an R&D center in Taiwan. The project has received approval from the Ministry of Economic Affairs (MOEA) under its "Global...
Tuesday 5 November 2024
US election to catalyst Taiwan's global semiconductor expansion, says Microip chairman
The uncertainty and potential disruption that may unfold in the wake of the 2024 US presidential election looms over Taiwan's booming semiconductor industry. At the recent launch...
Tuesday 5 November 2024
Nvidia's Jensen Huang requests early shipment of HBM4 from SK Hynix
Nvidia CEO Jensen Huang emphasized during a video call at the SK AI Summit in Seoul's Coex that he aims to strengthen collaboration with SK Hynix in the high bandwidth memory (HBM)...
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research