According to Korean media Money S, the South Korean government and major semiconductor firms have signed a "Semiconductor Advanced Packaging Technology Cooperation Development...
Advanced packaging and testing have become the hottest topics in the semiconductor industry in 2023, with TSMC's CoWoS packaging technology experiencing extremely high demand due...
Semiconductor material suppliers are among the beneficiaries of robust demand from TSMC, Amkor Technology, and OSATs for CoWoS packaging, according to industry sources.
Topco Scientific (TSC), a leading semiconductor material distributor, is expanding its advanced packaging material supply operations. In addition to silicon wafers and photoresist,...
Taiwan-based IC lead frame maker Chang Wah Technology (CWTC) expects to gain momentum for its automotive product segment in 2024, driven by major achievements in car chip developments...
LED packaging house Harvatek is unlikely to see its revenue grow as strong as expected in the second half as its US-based clients were conservative about demand during the peak season,...
Niching Industrial, which distributes IC packaging materials, has seen a steady recovery in demand for display driver ICs (DDI) and a significant rise in demand for vapor chambers...
IC packaging leadframe supplier Chang Wah Technology (CWTC), which saw its monthly revenue exceed NT$1 billion (US$32.5 million) for the second consecutive month in May, is likely...
The passive components sector is expected to embrace a normal peak season in the third quarter of 2023, as materials suppliers for the components have seen customers turn aggressive...
The global consumer electronics market has faced sluggish end demand since the beginning of 2023. Sources anticipates suppliers to buoy the market with new product series this year,...
Malaysia should strive to attract investors to set up at least one medium-size wafer foundry fab to build a complete semiconductor manufacturing supply chain in the country, not just...
TSMC came in as the world's third-largest OSAT when including its advanced packaging 3D fabric platform in 2022, according to market research quoted by China-based OSATs.
Taiwan-based driver IC OSATs such as ChipMOS Technologies and Chipbond Technology are seeing the monthly operating growth rate of chip and backend companies exceed 20%, according...
Ample Electronic Technology, dedicated to supplying conductive paste and thick-film conductive materials, has seen a rebound in shipment pull-in momentum at customers since the start...
IC packaging materials suppliers and distributors anticipate an increase in demand for HPC substrates in the second half of 2023, while demand for display driver ICs (DDI) will stabilize...
