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NEWS TAGGED IC PACKAGING
Tuesday 18 April 2023
3D fabric business pushes TSMC into top 3 largest OSATs
TSMC came in as the world's third-largest OSAT when including its advanced packaging 3D fabric platform in 2022, according to market research quoted by China-based OSATs.
Monday 10 April 2023
Taiwan-based OSATs see upstream orders increase in 2Q23
Taiwan-based driver IC OSATs such as ChipMOS Technologies and Chipbond Technology are seeing the monthly operating growth rate of chip and backend companies exceed 20%, according...
Friday 7 April 2023
Ample Electronic expects stable surge in conductive materials shipments
Ample Electronic Technology, dedicated to supplying conductive paste and thick-film conductive materials, has seen a rebound in shipment pull-in momentum at customers since the start...
Wednesday 22 February 2023
IC packaging materials suppliers expect pick-up in demand for HPC substrates
IC packaging materials suppliers and distributors anticipate an increase in demand for HPC substrates in the second half of 2023, while demand for display driver ICs (DDI) will stabilize...
Thursday 16 February 2023
Wafer bank pressure starts to ease
IC backend houses warehouses have been filled with "wafer bank" inventories from fabless customers over the last two years, but the pressure has begun to ease, according to AH Liu,...
Monday 6 February 2023
IC packaging materials demand to hit bottom in 1Q23, but recover through rest of 2023, says CWE chair
The IC packaging materials sector will definitely hit rock bottom in the first quarter of 2023, but will then recover steadily in the rest of year, according to Chang Wah Electromaterials...
Wednesday 1 February 2023
Greatek expects backend demand from MCU sector to start recovering in 2Q23
Greatek Electronics, an affiliate of Powertech Technology (PTI) specializing in logic IC packaging, expects the backend packaging demand from its MCU clients to hit bottom in the...
Tuesday 27 December 2022
Delivery lead times for IC packaging and testing machines shorten notably
Delivery lead times for IC packaging and testing machines have shortened notably amid weakening demand and improving supply of basic ICs used in the machines, according to industry...
Friday 23 December 2022
OSATs cautious about demand prospects after Lunar New Year
Taiwan-based OSATs have expressed caution about demand prospects even after the Lunar New Year holiday in 2023, according to industry sources.
Thursday 22 December 2022
ASE talks about SiP development trends
OSAT ASE Group recently shared its vision regarding development trends for system-in-package (SiP) technology.
Wednesday 21 December 2022
Government subsidies may allow China IC backend houses to cut prices
With China stepping up the subsidizing of its IC industry, China-based IC backend houses would be able to initiate effective price cuts to attract orders in 2023, according to industry...
Friday 16 December 2022
IC packaging leadframe demand to hit bottom in 1Q23
Leadframe demand for packaging automotive and industrial chips has slightly dropped, and that for consumer electronics ICs continues to be adversely affected by the ongoing inventory...
Friday 16 December 2022
Chengdu Silan raises CNY500 million to fund automotive IC packaging biz
Chengdu Silan Semiconductor Manufacturing, a subsidiary of discrete component IDM Silan Microelectronics, has raised CNY500 million (US$71.7 million) from two new Chinese investors...
Thursday 15 December 2022
Law amendment to benefit more sectors than semiconductor in Taiwan, says economic minister
An amendment to the Statute for Industrial Innovation, drafted by Taiwan's Ministry of Economic Affairs and designed to provide higher tax incentives for R&D projects by local...
Monday 12 December 2022
Harvatek to focus on miniLED, microLED packaging in 2023
LED packaging service provider Harvatek will focus on miniLED and microLED in 2023, according to the company.
Research Report Database
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research