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NEWS TAGGED IC PACKAGING
Monday 11 September 2023
3D chiplets to steer the next advanced packaging trend
Advanced packaging and testing have become the hottest topics in the semiconductor industry in 2023, with TSMC's CoWoS packaging technology experiencing extremely high demand due...
Friday 8 September 2023
IC packaging material suppliers to capitalize on CoWoS surge
Semiconductor material suppliers are among the beneficiaries of robust demand from TSMC, Amkor Technology, and OSATs for CoWoS packaging, according to industry sources.
Thursday 31 August 2023
Topco Scientific expands product offerings to CoWoS and 3D IC
Topco Scientific (TSC), a leading semiconductor material distributor, is expanding its advanced packaging material supply operations. In addition to silicon wafers and photoresist,...
Thursday 27 July 2023
IC lead frame demand for China-developed auto chips to pick up in 2024, says CWTC
Taiwan-based IC lead frame maker Chang Wah Technology (CWTC) expects to gain momentum for its automotive product segment in 2024, driven by major achievements in car chip developments...
Monday 10 July 2023
Harvatek expects LED packaging demand to stay weak in 2H23, but business to remain profitable for 2023
LED packaging house Harvatek is unlikely to see its revenue grow as strong as expected in the second half as its US-based clients were conservative about demand during the peak season,...
Thursday 29 June 2023
Niching sees clear demand visibility through end-2023
Niching Industrial, which distributes IC packaging materials, has seen a steady recovery in demand for display driver ICs (DDI) and a significant rise in demand for vapor chambers...
Wednesday 7 June 2023
CWTC likely to report higher-than-anticipated 2Q23 revenue
IC packaging leadframe supplier Chang Wah Technology (CWTC), which saw its monthly revenue exceed NT$1 billion (US$32.5 million) for the second consecutive month in May, is likely...
Thursday 11 May 2023
Passive components sector poised to embrace normal peak season in 2H23
The passive components sector is expected to embrace a normal peak season in the third quarter of 2023, as materials suppliers for the components have seen customers turn aggressive...
Monday 8 May 2023
Nvidia's new mid-end gaming series to be mild boost to peripheral IC packaging & testing
The global consumer electronics market has faced sluggish end demand since the beginning of 2023. Sources anticipates suppliers to buoy the market with new product series this year,...
Friday 28 April 2023
Malaysia needs at least one medium-size wafer foundry fab, says MSIA president
Malaysia should strive to attract investors to set up at least one medium-size wafer foundry fab to build a complete semiconductor manufacturing supply chain in the country, not just...
Tuesday 18 April 2023
3D fabric business pushes TSMC into top 3 largest OSATs
TSMC came in as the world's third-largest OSAT when including its advanced packaging 3D fabric platform in 2022, according to market research quoted by China-based OSATs.
Monday 10 April 2023
Taiwan-based OSATs see upstream orders increase in 2Q23
Taiwan-based driver IC OSATs such as ChipMOS Technologies and Chipbond Technology are seeing the monthly operating growth rate of chip and backend companies exceed 20%, according...
Friday 7 April 2023
Ample Electronic expects stable surge in conductive materials shipments
Ample Electronic Technology, dedicated to supplying conductive paste and thick-film conductive materials, has seen a rebound in shipment pull-in momentum at customers since the start...
Wednesday 22 February 2023
IC packaging materials suppliers expect pick-up in demand for HPC substrates
IC packaging materials suppliers and distributors anticipate an increase in demand for HPC substrates in the second half of 2023, while demand for display driver ICs (DDI) will stabilize...
Thursday 16 February 2023
Wafer bank pressure starts to ease
IC backend houses warehouses have been filled with "wafer bank" inventories from fabless customers over the last two years, but the pressure has begun to ease, according to AH Liu,...