Market demand for silicon wafers, IC packaging leadframes, and other related process materials remains strong, and chipmaking materials distributors including Topco Scientific, Wah...

Taiwan-based OSAT ASE Technology and its EMS subsidiary Universal Scientific Industrial (USI) are eyeing a bigger presence in the automotive electronics field this year, according...

Niching Industrial, which distributes IC packaging materials, is expected to see its profits hit a record high in 2022 despite falling demand for display driver ICs, according to...

China-based outsourced semiconductor assembly and testing (OSAT) vendors and second-tier Taiwan-based backend houses are cutting their prices for conventional ICs to vie for more...

Taiwan's OSATs may not move to set up plants in the US though the US Congress has approved the Chips and Science Act 2022, and instead will carry out capacity expansions at their...

Powertech Technology (PTI) will be striving to keep its third-quarter revenue about on par with the second-quarter level amid volatile market conditions, according to the memory and...

Taiwan-based backend houses including flip chip (FC) packaging, high-end testing, and IC test interface specialists are gearing up production for upcoming high-performance computing...

Chang Wah Technology (CWTC) has seen the visibility of QFP (quad flat package) leadframe orders extended, buoyed by strong demand for automotive, industrial and network communication...

Taiwan-based OSATs including ASE Technology and Powertech Technology (PTI) continue to see their midrange and high-end IC packaging manufacturing capacity utilization rates stay at...

Niching Industrial, a supplier for display driver IC packaging materials, expects related DDI demand to bottom out in the third quarter and likely start picking up in the fourth.

Leadframe suppliers including Chang Wah Technology (CWTC), Jih Lin Technology and Shuen Der Industry (SDI) continue to see their supply for automotive IC packaging fall short of demand,...

Backend packaging and testing houses continue to see stable growth in orders for automotive chips despite weakness in orders for consumer electronics chips, according to industry...

Packaging demand for consumer electronics ICs including commodity MCUs, MOSFETs, lower-end logic ICs and power management ICs (PMICs) has contracted significantly amid lackluster...

High heat dissipation and other thermal management technologies are increasingly required for both front- and back-end chipmaking processes by companies engaged in the automotive,...