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NEWS TAGGED IC PACKAGING
Thursday 14 July 2022
Niching expects DDI demand to bottom out in 3Q22
Niching Industrial, a supplier for display driver IC packaging materials, expects related DDI demand to bottom out in the third quarter and likely start picking up in the fourth.
Friday 8 July 2022
Leadframe supply for automotive IC packaging remains tight
Leadframe suppliers including Chang Wah Technology (CWTC), Jih Lin Technology and Shuen Der Industry (SDI) continue to see their supply for automotive IC packaging fall short of demand,...
Tuesday 5 July 2022
Backend firms see brisk order visibility for automotive chips
Backend packaging and testing houses continue to see stable growth in orders for automotive chips despite weakness in orders for consumer electronics chips, according to industry...
Monday 4 July 2022
Consumer IC packaging demand unlikely to rebound till 1Q23
Packaging demand for consumer electronics ICs including commodity MCUs, MOSFETs, lower-end logic ICs and power management ICs (PMICs) has contracted significantly amid lackluster...
Monday 27 June 2022
Chipmakers focus on heat dissipation in manufacturing process upgrades
High heat dissipation and other thermal management technologies are increasingly required for both front- and back-end chipmaking processes by companies engaged in the automotive,...
Monday 27 June 2022
TSMC completes cleanroom construction at R&D center in Japan
An opening ceremony has been held recently at TSMC's 3DIC R&D center in Japan to mark the completion of cleanroom construction at the facility, according to the Taiwan-based fo...
Wednesday 22 June 2022
Second-tier OSATs see uncertainty in order visibility for 2H22
Unlike ASE Technology and other first-tier OSATs who still see robust order momentum from their IDM customers, smaller-size players including Greatek Electronics, Lingsen Precision...
Wednesday 15 June 2022
IC packaging materials demand remains strong
Demand for BT substrates, aQFN leadframes and other IC packaging materials continues ramping up, thanks to robust demand for network chips and devices, according to industry source...
Wednesday 8 June 2022
ASE, Unimicron to provide packaging, related substrates for new Apple M2 chip
Taiwan-based ASE Technology and Unimicron Technology have both seized flip chip ball grid array (FC-BGA) packaging and related substrate orders for Apple's just unveiled M2 processors,...
Thursday 2 June 2022
IC backend plants in Shanghai to see capacity utilization rebound
Taiwan-based IC backend houses with plant operations in Shanghai are expected to see their plant capacity utilization rates rebound to 90% between June and July as COVID lockdown...
Wednesday 1 June 2022
HPC chip vendors favor 'on substrate' packaging for system integration
System integration capability is increasingly needed in packaging HPC chips for AI, networking and other applications that accelerate digital transformation at enterprises and people's...
Tuesday 24 May 2022
Chiplet processing demand on the rise
While their consumer IC packaging business continues to slow down, Taiwan OSATs have received increasing inquiries about chiplet manufacturing solutions from clients in the US, China...
Tuesday 24 May 2022
TSMC poised to sustain lead with integrated advanced processes in next decade
While chip manufacturing technology continues to advance toward sub-5nm processes, advanced packaging also has been widely recognized as a key segment to progress drastically with...
Friday 20 May 2022
Metaverse concepts boost demand for IC packaging equipment, says K&S executive
Along with emerging metaverse concepts, there is growing demand for equipment for package IC and HPC (high-performance computing) chips, as well as bonding mini/microLED chips, according...
Tuesday 26 April 2022
ABF substrate makers to see new capacity boost biz results in next 3 years
Taiwan-based ABF substrate suppliers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology are expected to commercialize additional capacities boosting their...
Research Report Database
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research