While chip manufacturing technology continues to advance toward sub-5nm processes, advanced packaging also has been widely recognized as a key segment to progress drastically with...
Along with emerging metaverse concepts, there is growing demand for equipment for package IC and HPC (high-performance computing) chips, as well as bonding mini/microLED chips, according...
Taiwan-based ABF substrate suppliers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology are expected to commercialize additional capacities boosting their...
With advanced 2.5D and 3D IC packaging technologies requiring a considerable amount of capex for R&D and manufacturing capabilities, there will be just a few players engaged in...
Memory backend services companies Powertech Technology (PTI) and Walton Advanced Engineering have seen their production capacities for mobile DRAM running in high gear recently thanks...
IC packaging firm Greatek Electronics saw its March revenues soar 58% on month to NT$650 million (US$19.35 million), buoyed by strong demand for consumer electronics products in China...
With the global semiconductor market falling on difficult times, IC packaging and testing houses Sigurd Microelectronics and King Yuan Electronics Company (KYEC) expect to see a 10%...
