IC packaging materials suppliers and distributors anticipate an increase in demand for HPC substrates in the second half of 2023, while demand for display driver ICs (DDI) will stabilize...

IC backend houses warehouses have been filled with "wafer bank" inventories from fabless customers over the last two years, but the pressure has begun to ease, according to AH Liu,...

The IC packaging materials sector will definitely hit rock bottom in the first quarter of 2023, but will then recover steadily in the rest of year, according to Chang Wah Electromaterials...

Greatek Electronics, an affiliate of Powertech Technology (PTI) specializing in logic IC packaging, expects the backend packaging demand from its MCU clients to hit bottom in the...

Delivery lead times for IC packaging and testing machines have shortened notably amid weakening demand and improving supply of basic ICs used in the machines, according to industry...

Taiwan-based OSATs have expressed caution about demand prospects even after the Lunar New Year holiday in 2023, according to industry sources.

OSAT ASE Group recently shared its vision regarding development trends for system-in-package (SiP) technology.

With China stepping up the subsidizing of its IC industry, China-based IC backend houses would be able to initiate effective price cuts to attract orders in 2023, according to industry...

Leadframe demand for packaging automotive and industrial chips has slightly dropped, and that for consumer electronics ICs continues to be adversely affected by the ongoing inventory...

Chengdu Silan Semiconductor Manufacturing, a subsidiary of discrete component IDM Silan Microelectronics, has raised CNY500 million (US$71.7 million) from two new Chinese investors...

An amendment to the Statute for Industrial Innovation, drafted by Taiwan's Ministry of Economic Affairs and designed to provide higher tax incentives for R&D projects by local...

LED packaging service provider Harvatek will focus on miniLED and microLED in 2023, according to the company.

Though TSMC is building advanced wafer fabs in the US, Taiwanese OSAT companies still have concerns about constructing facilities there to provide cutting-edge packaging services...

Display driver IC packaging materials suppliers have recently landed a pull-in of short lead-time orders, which DDI backend firms regard as a short-term phenomenon.

Advanced Semiconductor Engineering (ASE) plans to expand its factory site in Malaysia with total investment estimated at US$300 million, according to the outsourced semiconductor...