Delivery lead times for IC packaging and testing machines have shortened notably amid weakening demand and improving supply of basic ICs used in the machines, according to industry...
With China stepping up the subsidizing of its IC industry, China-based IC backend houses would be able to initiate effective price cuts to attract orders in 2023, according to industry...
Leadframe demand for packaging automotive and industrial chips has slightly dropped, and that for consumer electronics ICs continues to be adversely affected by the ongoing inventory...
Chengdu Silan Semiconductor Manufacturing, a subsidiary of discrete component IDM Silan Microelectronics, has raised CNY500 million (US$71.7 million) from two new Chinese investors...
An amendment to the Statute for Industrial Innovation, drafted by Taiwan's Ministry of Economic Affairs and designed to provide higher tax incentives for R&D projects by local...
Though TSMC is building advanced wafer fabs in the US, Taiwanese OSAT companies still have concerns about constructing facilities there to provide cutting-edge packaging services...
Display driver IC packaging materials suppliers have recently landed a pull-in of short lead-time orders, which DDI backend firms regard as a short-term phenomenon.
Advanced Semiconductor Engineering (ASE) plans to expand its factory site in Malaysia with total investment estimated at US$300 million, according to the outsourced semiconductor...
Display driver IC (DDI) backend specialists are finding their warehouses filled with "wafer bank" inventories from fabless chipmaker customers that are keeping their inventory at...
For mature manufacturing process, 3D IC packaging is expected to become their alternative solution to advanced processes and will develop faster than expected under the latest US...