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NEWS TAGGED IC PACKAGING
Wednesday 31 August 2022
Harvatek expanding IC packaging biz
LED packaging service provider Harvatek will continue expanding its IC packaging capacity, expecting its IC packaging business to account for 15% of revenue by 2023 compared to less...
Friday 26 August 2022
IC packaging material suppliers continue to see order pull-ins from ASE
ASE Technology Holding continues to step up its leadframe and other IC packaging materials procurement while other outsourced semiconductor assembly and test (OSAT) vendors are slowing...
Thursday 25 August 2022
CWTC obtains leadframe orders for automotive miniLED devices
Chang Wah Technology (CWTC) has newly developed leadframes for miniLED device applications, which have cut into the supply chain of tier-1 Europe-based LED manufacturers, with shipments...
Monday 22 August 2022
JCET not optimistic about business prospects for 2H22
China's largest OSAT Jiangsu Changjiang Electronics Technology (JCET) has scored impressive revenue and profit gains for the first half of 2022, but is not optimistic about business...
Wednesday 17 August 2022
Tong Hsing building new plant in Taiwan
CMOS image sensor (CIS) packaging service provider Tong Hsing Electronic Industries is constructing its fourth plant in northern Taiwan, with the facility to begin production in the...
Wednesday 10 August 2022
Silicon wafer, leadframe demand remains strong
Market demand for silicon wafers, IC packaging leadframes, and other related process materials remains strong, and chipmaking materials distributors including Topco Scientific, Wah...
Friday 5 August 2022
ASE Technology steps up deployment in automotive electronics
Taiwan-based OSAT ASE Technology and its EMS subsidiary Universal Scientific Industrial (USI) are eyeing a bigger presence in the automotive electronics field this year, according...
Wednesday 3 August 2022
Niching to post record 2022 profit
Niching Industrial, which distributes IC packaging materials, is expected to see its profits hit a record high in 2022 despite falling demand for display driver ICs, according to...
Wednesday 3 August 2022
OSATs cutting prices for conventional ICs
China-based outsourced semiconductor assembly and testing (OSAT) vendors and second-tier Taiwan-based backend houses are cutting their prices for conventional ICs to vie for more...
Tuesday 2 August 2022
OSATs see little drive from Chips Act for building US operations
Taiwan's OSATs may not move to set up plants in the US though the US Congress has approved the Chips and Science Act 2022, and instead will carry out capacity expansions at their...
Thursday 28 July 2022
PTI expects flat performance in 3Q22
Powertech Technology (PTI) will be striving to keep its third-quarter revenue about on par with the second-quarter level amid volatile market conditions, according to the memory and...
Friday 22 July 2022
Taiwan backend firms gearing up for next-gen HPC processors
Taiwan-based backend houses including flip chip (FC) packaging, high-end testing, and IC test interface specialists are gearing up production for upcoming high-performance computing...
Wednesday 20 July 2022
CWTC sees QFP leadframe order visibility extended
Chang Wah Technology (CWTC) has seen the visibility of QFP (quad flat package) leadframe orders extended, buoyed by strong demand for automotive, industrial and network communication...
Friday 15 July 2022
Advanced packaging demand remains brisk
Taiwan-based OSATs including ASE Technology and Powertech Technology (PTI) continue to see their midrange and high-end IC packaging manufacturing capacity utilization rates stay at...
Vortex
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research