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Monday 16 September 2024
Samsung reportedly exploring dry photoresist technology for 1c DRAM
Samsung Electronics is reportedly exploring using dry photoresist for its upcoming 6G 10nm-class DRAM (1c DRAM) to widen its lead in DRAM with its competitors, such as SK Hynix and...
Monday 16 September 2024
Samsung Display gears up for Apple foldables with 2024 supply chain rollout
Samsung Display (SDC) is reportedly accelerating the development of foldable devices for Apple as the South Korean giant is coordinating preparations with its partners, aiming to...
Monday 16 September 2024
Posco Future M under siege from escalating Chinese competition; government support imperative
Posco Future M, a South Korean battery anode material manufacturer, is facing intensifying competition from Chinese rivals, resulting in a steady decrease in the utilization rate...
Friday 13 September 2024
Henkel Adhesives helps customers unlock growth for next-generation advanced packaging
SEMICON Taiwan 2024 featured the latest trends and innovations that focused on the future of Artificial Intelligence (AI) to connect Taiwan and global semiconductor ecosystems. The...
Friday 13 September 2024
Niching targets revenue boost from AI server cooling, substrates, and driver ICs
Niching Industrial, a Taiwan-based semiconductor materials and components distributor, has experienced a significant resurgence in orders for its three primary product lines –...
Thursday 12 September 2024
Taiwan SiC foundries to reshape global semiconductor industry
As more major Taiwan-based pure-play foundries enter the silicon carbide (SiC) manufacturing sector, they may provide international integrated device manufacturers (IDMs) with leverage...
Thursday 12 September 2024
AI data centers to accelerate SiC growth
The power conversion demands and power density requirements of data centers are constantly increasing, with materials such as wide-bandgap (WBG) semiconductors like silicon carbide...
Tuesday 10 September 2024
Advanced packaging focuses on CoWoS, 3D IC, and FOPLP at SEMICON Taiwan 2024
A major focus of SEMICON Taiwan 2024 that concluded last week was advanced packaging, with CoWoS, 3D IC, and FOPLP being the leading technologies. CoWoS has caught more attention...
Monday 9 September 2024
Naura, ACM grab attention at SEMICON, AMEC absent
SEMICON Taiwan 2024 has officially launched with global semiconductor equipment and materials suppliers in attendance.
Monday 9 September 2024
Exploring UK semiconductor powerhouse from automotive innovations to satellite communications
The UK continues to further its automotive and other industries while investing heavily in high-tech sectors. Harnessing its extensive academic expertise, the country is making significant...
Friday 6 September 2024
Supply chains, automotive brands gather at Cenex Expo 2024 debut
The annual Cenex Expo hosted by Cenex debuted in Milton Keynes on September 4, local time. Aside from the two main themes, low carbon vehicles (LCV) and connected and automated mobility...
Friday 6 September 2024
Dutch engineering expertise drives semiconductor industry forward
At Semicon Taiwan 2024, a group of Dutch companies showcased technologies quietly revolutionizing semiconductor manufacturing and related industries. These firms, many clustered around...
Friday 6 September 2024
UK auto industry shifts focus to net-zero as EV revolution gathers pace
Ahead of the UK Low Carbon Vehicle (LCV) event, Julian Hetherington, Director of the Advanced Propulsion Centre (APC), provided an early preview of the electric and energy-efficient...
Friday 6 September 2024
Power semiconductor makers step up SiC and GaN deployment
The power semiconductor industry is experiencing a surge in the development of compound semiconductor materials such as gallium nitride (GaN) and silicon carbide (SiC). These advancements...
Friday 6 September 2024
Advanced packaging material sales to skyrocket in 2025, says Topco Scientific
Topco Scientific, a supplier of semiconductor materials, anticipates substantial sales growth for advanced packaging materials in 2025 due to demand generated by AI applications.