SEMI today announced the publication of four new FPD standards that originated from the Taiwan FPD Committee. Although Taiwan has previously contributed to standards efforts led by...
SEMI has reported that worldwide semiconductor manufacturing equipment billings reached US$7.46 billion in the first quarter of 2010. The billings figure is 32% higher than that in...
North America-based manufacturers of semiconductor equipment posted US$1.44 billion in orders in April (three-month average basis), up 8.1% from the revised level of US$1.33 billion...
Worldwide silicon wafer area shipments increased to 2,214 million square inches in the first quarter of 2010, a 5% increase from the 2,109 million square inches shipped during the...
North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.19 in March 2010, having been above parity for nine months in a row.
North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.22 in February 2010 compared to 1.23 in January, according to SEMI.
The global semiconductor materials market contracted 19% in 2009 compared to 2008 as the semiconductor industry reacted quickly to deteriorating market conditions in the first part...
The worldwide semiconductor equipment market will grow 47% in 2010, and the growth in China will be more than 100%, according to Stanley Myers, president and CEO of SEMI, speaking...
Worldwide sales of semiconductor manufacturing equipment totaled US$15.92 billion in 2009, representing a 46% decline compared to US$29.52 billion posted in 2008, according to SEMI...
Spending on worldwide fab projects, including construction, facilities and equipping, in 2010 could grow by 88% over 2009 levels, according to SEMI. The industry association previously...
Worldwide silicon wafer area shipments decreased by 18% in 2009 when compared to 2008 area shipments, according to SEMI. The slide indicates improvement compared with the first half...
North America-based manufacturers of semiconductor equipment posted US$1.13 billion in orders in January 2010 (three-month average basis) and a book-to-bill ratio of 1.20, according...
An increasing number of fabless chip companies and IDMs are considering copper wire for some new products, though a number of issues exist regarding this transition, according to...
North America-based manufacturers of semiconductor equipment posted US$863.3 million in orders in December 2009 (three-month average basis) and a book-to-bill ratio of 1.03, according...
Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.18 in November 2009 compared to the prior month's level of 1.28, according to Semiconductor Equipment...
