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NEWS TAGGED SEMI
Thursday 9 September 2010
Second-hand equipment market to remain hot through 2011, says Novellus exec
Used semiconductor equipment has become a hot market, as companies look to expand their capacity at lower costs, or in the shortest time possible in order to meet urgent demand for...
Thursday 9 September 2010
Over 150 fab projects lead to strong 2010 and 2011, says SEMI
More than 150 fab projects will contribute an estimated US$83 billion in spending , according to SEMI. The projects tracked include construction projects and equipment spending for...
Friday 20 August 2010
North America chip gear book-to-bill ratio up in July 2010, says SEMI
North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.23 in July 2010, compared to 1.18 in June, according to SEMI. The book-to-bill of 1.23...
Friday 6 August 2010
Silicon wafer shipments in 2Q10 soar 40% on year, says SEMI
Worldwide silicon wafer area shipments totaled 2.365 billion square inches in the second quarter of 2010, up 40% from a year earlier, according to SEMI. On a sequential basis, the...
Thursday 5 August 2010
Lite-On Semi revenues hit two-year high in July 2010
Lite-On Semiconductor has announced consolidated revenues of NT$980 million (US$31 million) for July 2010, the company's highest monthly result since August 2008. The accumulated...
Wednesday 21 July 2010
Chip gear book-to-bill ratios climb in June 2010
Japan's semiconductor production equipment manufacturers have reported a book-to-bill ratio of 1.40 for June, up from 1.13 in May, according to the Semiconductor Equipment Association...
Wednesday 14 July 2010
SEMI more upbeat about 2010 chip equipment market
SEMI issued upbeat forecasts on the chip equipment business on July 13, when SEMICON West 2010 kicked off in San Francisco.
Tuesday 6 July 2010
Lite-On Semi upbeat about 3Q10
Lite-On Semiconductor, a CMOS image sensor (CIS) and discrete-IC specialist, has pointed out that the company's order momentum remains strong. Revenues for the third quarter will...
Monday 21 June 2010
SEMI, SEAJ book-to-bill ratios stay strong in May 2010
Japan's semiconductor production equipment manufacturers posted a book-to-bill ratio of 1.13 in May 2010, up from 1.07 in April, according to the Semiconductor Equipment Association...
Friday 11 June 2010
SEMI approves Taiwan FPD standards
SEMI today announced the publication of four new FPD standards that originated from the Taiwan FPD Committee. Although Taiwan has previously contributed to standards efforts led by...
Wednesday 9 June 2010
Chip equipment billings up 32% sequentially in 1Q10, says SEMI
SEMI has reported that worldwide semiconductor manufacturing equipment billings reached US$7.46 billion in the first quarter of 2010. The billings figure is 32% higher than that in...
Friday 21 May 2010
North America chip-gear orders up 8% in April 2010, says SEMI
North America-based manufacturers of semiconductor equipment posted US$1.44 billion in orders in April (three-month average basis), up 8.1% from the revised level of US$1.33 billion...
Friday 14 May 2010
Silicon wafer shipments up 5% in 1Q10, says SEMI
Worldwide silicon wafer area shipments increased to 2,214 million square inches in the first quarter of 2010, a 5% increase from the 2,109 million square inches shipped during the...
Wednesday 21 April 2010
North America chip gear book-to-bill ratio at 1.19 in March 2010, says SEMI
North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.19 in March 2010, having been above parity for nine months in a row.
Sunday 21 March 2010
Chip-gear book-to-bill almost flat in February 2010
North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.22 in February 2010 compared to 1.23 in January, according to SEMI.