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NEWS TAGGED SEMI
Thursday 22 September 2011
PV equipment book-to-bill ratio drops below parity in 2Q11, says SEMI
SEMI has reported that worldwide photovoltaic manufacturing equipment billings reached US$2.03 billion for the quarter ended on June 30, 2011. Billings increased 17% sequentially,...
Friday 16 September 2011
SEMI book-to-bill ratio slips to 0.80 in August
North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.80 for August 2011, down from 0.85 in July, according to new figures from SEMI. A book-to-bill...
Friday 9 September 2011
450mm and EUV linked with uncertainty, says SEMI
The transition to manufacturing semiconductors on larger wafers continues to be one of the hottest topics in the industry. However, uncertainty with EUV rollout has exacerbated the...
Wednesday 7 September 2011
Proportion of copper wire bonding to rise to over 20% in 2011, says SEMI
Due to rising gold prices, replacement of conventional processes based on gold wire with copper-wire bonding processes is increasing. The proportion of total wire bonding volume for...
Wednesday 7 September 2011
SEMICON Taiwan 2011: Major IDMs participate for procurement talks
Major IDMs including Panasonic Semiconductor, Philips, Renesas Electronics and Toshiba are being invited to hold face-to-face procurement talks with Taiwan-based suppliers of chemicals,...
Wednesday 7 September 2011
Chip equipment billings up 31% in 2Q11, says SEMI
Worldwide semiconductor manufacturing equipment billings reached US$11.92 billion in the second quarter of 2011, according to SEMI. The billings figure is 1% lower than that in the...
Wednesday 7 September 2011
SEMI downgrades forecast for 2011 fab-tool spending, but still sees record year
SEMI's latest statistics suggests that capital expenditure will increase to US$41.1 billion in 2011, the highest on record, according to the industry association. The prediction is...
Thursday 1 September 2011
China government to promote semi industry consolidation, says Digitimes Research
According to a recently published Digitimes Research...
Friday 19 August 2011
Chip equipment book-to-bill lower in July 2011
North America-based semiconductor production equipment makers posted a book-to-bill ratio of 0.86 in July, down from 0.94 in June, according to SEMI. Meanwhile, data gathered by the...
Thursday 4 August 2011
Silicon wafer shipments up 5% in 2Q11, says SEMI
Worldwide silicon wafer area shipments increased 5% during the second quarter of 2011 compared to the prior quarter, according to SEMI.
Thursday 21 July 2011
North America chip-gear orders slip in June, says SEMI
North America-based manufacturers of semiconductor equipment posted US$1.55 billion in orders in June 2011 (three-month average basis), down 4.4% from the revised level of US$1.62...
Tuesday 12 July 2011
Chip equipment sales to grow 12% in 2011, says SEMI
Worldwide sales of semiconductor manufacturing equipment will reach US$44.33 billion in 2011, representing growth of 12.1% on year, according to SEMI's mid-year forecast.
Friday 17 June 2011
SEMI book-to-bill ratio slips to 0.97 in May
North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.97 for May 2011, down from 0.98 in April, according to new figures from SEMI.
Wednesday 15 June 2011
Chip equipment billings up 61% in 1Q11, says SEMI
SEMI has reported that worldwide semiconductor manufacturing equipment billings reached US$12 billion in the first quarter of 2011. The billings figure is 1% higher than that in the...
Thursday 9 June 2011
SEMI forecasts 31% rise in equipment spending and 9% manufacturing capacity increase in 2011
SEMI statistics suggests increasing capital expenditure and growing installed semiconductor manufacturing capacity in 2011. Fab construction spending, however, decelerates this year...