Taiwan's IC substrate supplier Nan Ya PCB has witnessed a surge in rush orders for BT substrates needed to process memory and other chip solutions for mobile smart devices and TV...
ASE Technology has cut into the medical care industry supply chain with its system in a package (SiP) packaging for ultra-wideband (UWB) modules, according to industry sources.
Taiwan-based OSAT ASE Technology has reported September revenue grew 4.5% sequentially to a record high of NT$66.65 billion (US$2.09 billion), while revenue at memory backend specialist...
Universal Scientific Industrial (USI), a subsidiary of Taiwan's ASE Technology Holding, has stepped up its deployment in the automotive, industrial, and AR device fields.
The newly released Apple Watch Ultra is widely believed to take on Garmin in the smartwatch market, and Taiwan's leading OSAT ASE Technology is gearing up to render backend support...
Cadence Design Systems' analog and mixed-signal (AMS) IC design flow has been certified for United Microelectronics' (UMC) 22ULP/ULL process technologies, according to the companies...
China's largest OSAT Jiangsu Changjiang Electronics Technology (JCET) has scored impressive revenue and profit gains for the first half of 2022, but is not optimistic about business...
Chipmakers have kicked off shipments for the upcoming iPhones slated for launch in September, but uncertainty remains whether the shipments will continue to see strong momentum between...
Siliconware Precision Industries (SPIL) and Universal Scientific Industrial (USI), both under ASE Technology Holding, have cut into the supply chains for the upcoming Apple Watch...
Nan Ya PCB is looking to grow its automotive IC substrate sales as a proportion of company revenue to over 10% in 2022, up from 7-8% in 2021, according to company sources.
Foxconn Technology (Hon Hai Precision Industry) has been expanding its IC backend business through subsidiaries, such as ShunSin Technology and Qingdao KoreSemi, according to industry...
Advanced Semiconductor Engineering (ASE), a member of ASE Technology, has introduced VIPack as its family of vertically integrated package solutions including 3D heterogeneous integration...
Taiwan-based Chipbond Technology, now holding the world's largest backend capacity for panel display driver ICs (DDI), continues to deepen cooperation with local OSAT Orient Semiconductor...
Labor and talent shortages will become a new normal for the semiconductor industry, and how to leverage AI, automation and systematization technologies to address diverse market needs...
