CONNECT WITH US
NEWS TAGGED SIP
Thursday 22 December 2022
ASE talks about SiP development trends
OSAT ASE Group recently shared its vision regarding development trends for system-in-package (SiP) technology.
Friday 11 November 2022
Nan Ya PCB sees increasing rush orders for BT substrates
Taiwan's IC substrate supplier Nan Ya PCB has witnessed a surge in rush orders for BT substrates needed to process memory and other chip solutions for mobile smart devices and TV...
Tuesday 25 October 2022
ASE cuts into medical care supply chain with SiP
ASE Technology has cut into the medical care industry supply chain with its system in a package (SiP) packaging for ultra-wideband (UWB) modules, according to industry sources.
Wednesday 12 October 2022
ASE September revenue up, PTI down
Taiwan-based OSAT ASE Technology has reported September revenue grew 4.5% sequentially to a record high of NT$66.65 billion (US$2.09 billion), while revenue at memory backend specialist...
Thursday 22 September 2022
USI steps up deployment in automotive, industrial, and AR fields
Universal Scientific Industrial (USI), a subsidiary of Taiwan's ASE Technology Holding, has stepped up its deployment in the automotive, industrial, and AR device fields.
Monday 12 September 2022
ASE's SiP technology key to new Apple Watch's competitiveness
The newly released Apple Watch Ultra is widely believed to take on Garmin in the smartwatch market, and Taiwan's leading OSAT ASE Technology is gearing up to render backend support...
Thursday 25 August 2022
Cadence, UMC team up for 22nm analog and mixed-signal IC design flow certification
Cadence Design Systems' analog and mixed-signal (AMS) IC design flow has been certified for United Microelectronics' (UMC) 22ULP/ULL process technologies, according to the companies...
Monday 22 August 2022
JCET not optimistic about business prospects for 2H22
China's largest OSAT Jiangsu Changjiang Electronics Technology (JCET) has scored impressive revenue and profit gains for the first half of 2022, but is not optimistic about business...
Friday 12 August 2022
Uncertainty remains about iPhone demand between 4Q22 and 1Q23
Chipmakers have kicked off shipments for the upcoming iPhones slated for launch in September, but uncertainty remains whether the shipments will continue to see strong momentum between...
Thursday 21 July 2022
SPIL and USI cut into supply chain for new wearables
Siliconware Precision Industries (SPIL) and Universal Scientific Industrial (USI), both under ASE Technology Holding, have cut into the supply chains for the upcoming Apple Watch...
Tuesday 5 July 2022
Nan Ya to boost automotive IC substrate sales in 2022
Nan Ya PCB is looking to grow its automotive IC substrate sales as a proportion of company revenue to over 10% in 2022, up from 7-8% in 2021, according to company sources.
Friday 24 June 2022
Foxconn expands IC backend biz through affiliates
Foxconn Technology (Hon Hai Precision Industry) has been expanding its IC backend business through subsidiaries, such as ShunSin Technology and Qingdao KoreSemi, according to industry...
Thursday 2 June 2022
ASE intros VIPack advanced packaging solutions
Advanced Semiconductor Engineering (ASE), a member of ASE Technology, has introduced VIPack as its family of vertically integrated package solutions including 3D heterogeneous integration...
Thursday 2 June 2022
Cutting DDI production orders not an easy deal: Q&A with Chipbond Technology chair Fei-Jain Wu
Taiwan-based Chipbond Technology, now holding the world's largest backend capacity for panel display driver ICs (DDI), continues to deepen cooperation with local OSAT Orient Semiconductor...
Wednesday 25 May 2022
Manpower crunch becoming new normal for semiconductor sector, says ASE chair
Labor and talent shortages will become a new normal for the semiconductor industry, and how to leverage AI, automation and systematization technologies to address diverse market needs...