Universal Scientific Industrial (USI), a global leader in electronics manufacturing services (EMS) and original design manufacturing (ODM), has published its February 2025 revenue...
Qualcomm is preparing for a more dominant entry into the PC market after seeing a rather successful entry in the mobile segment with its Snapdragon X Elite SKUs. According to German...
Surging demand for artificial intelligence (AI) is pushing TSMC to expand its advanced packaging capacity. As a key testing partner, Xintec—a TSMC-affiliated outsourced semiconductor...
ShunSin Technology, a subsidiary of Hon Hai Technology Group (Foxconn) that specializes in System-in-Package (SiP) modules, has accelerated the deployment of Silicon Photonics (SiPh)...
Yield Microelectronics (SIP) has solidified its standing among the global leaders in the embedded Non-Volatile Memory (eNVM) sector, securing a position within the top 5. With the...
Apple has disclosed its supplier list for fiscal year 2023. Nan Ya PCB, the second-largest provider of IC substrates, re-entered the supply chain after an extended absence.
Photomask specialist Taiwan Mask Corporation has announced plans to participate in optical components supplier TrueLight's private placement, with a total investment of around NT$410...
China's JCET Group, a provider of IC backend manufacturing and technology services, reported revenue climbed 30.8% sequentially to CNY8.26 billion (US$1.13 billion).
Future cars have emerged as a major global technology trend, but chip shortages and other supply-side issues may hinder progress, according to Universal Scientific Industrial (USI),...
Taiwanese OSAT providers stated that the trend of connectivity in everything will continue in 2024, and it will be combined with trends such as cloud AI, edge computing, and high-speed...
The new S9 system-in-package (SiP) that powers the just-unveiled Apple Watch is manufactured by Advanced Semiconductor Engineering (ASE) and Universal Scientific Industrial (USI),...
Taiwan-based IC backend houses have witnessed an improvement in their sales performance during the third quarter. However, it is anticipated that a significant rebound in demand may...
The era of software-defined automobiles is approaching, and while electronic control units (ECUs) are becoming more streamlined, the computing and integration capabilities of the...
USI has developed advanced electronic component failure analysis (FA) technology to meet the increasingly complex and diverse needs of SiP miniaturized products.
