OSATs with SiP (system-in-package) technology, including ASE Technology and ShunSin Technology, are poised to gain from the ever-growing SiP demand for integrating heterogeneous chips...
China's PCB maker Dongshan Precision Manufacturing (DSBJ) has disclosed plans to invest CNY1.5 billion (US$232.1 million) in establishing a new wholly-owned subsidiary that will be...
IC substrate maker Kinsus Interconnect Technology saw its net profits for second-quarter 2021 shoot up 202% on year to NT$1.01 billion (US$36.1 million), thanks to substantial improvements...
Foxconn Technology (Hon Hai Precision Industry) has started installing equipment including lithography systems for high-end IC packaging at its chip plant in Qingdao, northeast China,...
Shipments of flexible PCBs (FPCB) and SiP modules for use in the next-generation AirPods have kicked off in small volumes, and will be scaled up between late third-quarter and fourth-quarter...
Taiwan's leading OSAT ASE Technology Holding will see big orders from major clients Apple, Qualcomm and MediaTek further power its revenue growth in the third quarter after posting...
Nan Ya PCB and Kinsus Interconnect Technology both saw their June revenue climb over 30% from a year earlier, driven mainly by the arrival of new production capacity, according to...
Taiwan's PCB maker Zhen Ding Technology has disclosed plans to set up four new plants in Taiwan and China in 2021, mostly dedicated to production of high-end IC substrates and rigid...
Apple reportedly has enlisted AT&S as a new supplier of BT-based AiP (antenna in package) substrates for new 5G mmWave iPhones to be released later in the year, expanding to five...
IC substrate makers continue to see their output fall short of demand, despite a recent slowdown in cryptomining demand, according to industry sources.
BT substrate vendors in the supply chain of Apple devices are all gearing up shipments for next-generation Apple Watch, AirPods and iPhone devices, which will all massively adopt...
The upcoming Apple Watch series reportedly will massively adopt double-sided SiP packaging for power management ICs, with ASE Technology as the main backend partner, according to...
The supply of BT substrates is likely to fall short of demand in the second half of this year, but the shortage will be less severe than that of ABF substrates, according to industry...
Backend house ShunSin Technology, a subsidiary of Foxconn Technology (Hon Hai Precision) specializing in system-in-package (SiP) modules, is poised to reap handsome income by rendering...
