Display driver IC backend specialist Chipbond Technology and memory modules backend and EMS service provider Orient Semiconductor Electronics (OSE) have formed a long-term strategic...

The market for system-in-package (SiP) substrates is already tight and will become tighter as Apple is looking to adopt SiP technology in more of its AirPods series, according to...

Apple reportedly will have its next-generation AirPods series all adopt system-in-package (SiP) technology, which will significantly boost overall quartz component demand for the...

Apple's custom-designed ultra wideband (UWB) chip featured in the just-unveiled HomePod mini smart speaker is built using ASE Technology's SiP packaging technology, according to industry...

IC substrate makers Nan Ya PCB and Kinsus Interconnect Technology have reported impressive revenue increases for the third quarter of 2020 on strong shipments of diverse substrate...

SiP substrates adopted for processing core processors and peripheral components for new Apple Watch models reportedly will be all supplied by three Taiwanese makers, Unimicron Technology,...

ASE Technology and its EMS subsidiary Universal Scientific Industrial (USI) have reportedly grabbed major system-in-package (SiP) orders for the new Apple Watch Series 6 and Apple...

Leading OSAT providers, such as ASE Technology, are expected to see revenues generated from their SiP businesses climb about 30% in 2020, driven by demand for 5G, AI and HPC device...

TSMC, ASE Technology, IC substrate makers including Unimicron Technology as well as international materials and equipment suppliers are all gearing up for the SiP (system-in-package)...

Nan Ya PCB's August revenues rose 7.65% on month and 32.26% on year to a nine-year high of NT$3.636 billion (US$124.09 million) and expects its third-quarter revenues to reach the...

System-in-package (SiP) demand will grow further on a wide range of applications enabled by the emerging 5G, AI and HPC technologies in 2021, according to industry sources.

PCB and IC substrate suppliers have seen their shipments for TWS earbuds pick up significantly since the start of second-half 2020, and expect the shipment pull-in momentum to last...

Taiwan-based Universal Scientific Industrial (USI), a subsidiary of ASE Technology, has reportedly grabbed major system-in-package (SiP) orders for Wi-Fi 6E chip modules for 5G 6GHz...

SiP (system in package) combined with flexible PCB may be gaining ground in the supply chain of Apple devices, as the vendor reportedly will adopt the combination for its 5G handset...

Nan Ya PCB has delivered samples of SiP substrates for processing 5nm chips for validations by clients and expects to kick off shipments of such substrates by the end of 2020 at the...