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Friday 31 July 2020
ASE reportedly grabs major SiP orders for new Apple Watch
ASE Technology has obtained major backend orders for Apple Watch 6 slated for launch later this year, according to industry sources.
Monday 13 July 2020
Chinese chipmakers keen on developing 5G RF, PA modules
Chinese chipmakers including Lansus Technologies, MeidaTek-affiliate Vanchip Technology, and Unisoc Communications under the Tsinghua Unigroup are keenly developing 5G RF-FEM products...
Friday 10 July 2020
ASE Technology sees record 1H20 revenues, stronger 3Q20
Leading IC backend house ASE Technology Holding saw its revenues for both second-quarter and first-half 2020 hit record highs, thanks mainly to high capacity utilization for wire...
Thursday 2 July 2020
China top-3 OSAT firms to see combined revenues rise 8% in 2020, says Digitimes Research
China's top-3 OSAT providers - Jiangsu Changjiang Electronics Technology (JCET), Huatian Technology and Tongfu Microelectronics - are expected to see their combined revenues increase...
Thursday 18 June 2020
Nan Ya PCB looks to ABF, SiP substrates for profit growth in 2020
Nan Ya PCB will be striving to boost its profits in 2020 by focusing more on shipments of high-value products such as ABF and SiP substrates, according to company chairman CC Wu.
Thursday 28 May 2020
Kinsus gearing up to expand presence in FCBGA, AiP fields
Kinsus Interconnect Technology will strive to grow its business in the FCBGA and AiP packaging fields this year seeking to better cash in on new business opportunities arising from...
Monday 25 May 2020
ASE poised to apply SESUB-based SiP tech to new TWS devices
Taiwan's backend leader ASE Technology is poised to apply its SESUB (semiconductor embedded in substrate)-based SiP packaging technology to next-generation TWS (true wireless stereo)...
Monday 25 May 2020
ASE Technology likely to process ALS devices for new AirPods
Apple is expected to incorporate ambient light sensors (ALS) in next-generation AirPods devices in the coming 1-2 years, and Taiwan's ASE Technology may handle the backend process...
Monday 18 May 2020
Foxconn-TSMC collaboration in US not impossible, say sources
It would not be a surprise if Foxconn Technology Group collaborated with TSMC to jointly develop their operations in the US by 2024, given the firm's deployments in fan-out panel-level...
Wednesday 29 April 2020
Kinsus swings to profit in 1Q20 on strong ABF substrate shipments
IC substrate supplier Kinsus Interconnect Technology swung to net profits of NT$79 million (US$2.6 million) in the first quarter 2020 on revenues of NT$5.89 billion, from losses a...
Wednesday 22 April 2020
Backend firm PTI poised to challenge new revenue records in 2020
Memory backend specialist Powertech Technology (PTI) has seen clear order visibility through the third quarter of 2020 and may have a chance to end the year with record revenues as...
Monday 13 April 2020
5G iPhone mmWave AiP production schedule hinges on Apple strategy
Apple's assembly partners reportedly may defer volume production of 5G iPhones by at least one month amid high uncertainty of the coronavirus pandemic, but its mmWave AiP modules...
Thursday 26 March 2020
PCB partners unkeen on following Apple relocation
Apple is reportedly moving more of its production out of China, but Taiwanese PCB makers in the supply chain of iOS devices seem to stay conservative in following in the vendor's...
Friday 20 March 2020
Nan Ya PCB swings to profit in 2019
Nan Ya PCB returned to profitability in 2019, thanks to strong shipments of its high-end ABF substrates and an influx of new orders for SiP substrates.
Wednesday 11 March 2020
IC backend, verification partners for Apple devices see bright 2020
IC backend and verification specialists in the supply chain of Apple devices have regained confidence in their revenue performances for 2020 as they are moving to deliver shipments...