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Friday 4 October 2019
Advanced packaging, mini LED rising as new growth driver: Q&A with Kulicke & Soffa SVP CP Chong
US-based semiconductor assembly equipment supplier Kulicke & Soffa (K&S) is optimistic that 5G and AI applications will drive demand for advanced IC packaging equipment.
Thursday 3 October 2019
ASE provides SiP for TWS device SoC
Backend house ASE Technology Holding has offered a development board based on its system-in-package (SiP) services for heterogeneous SoC chips designed for true wireless stereo (TWS)...
Friday 20 September 2019
ASE building lights-out fabs to enhance high-end packaging
Backend service leader ASE Technology Holding plans to set up 15 lights-out fabs by the end of 2020 as part of its efforts to strengthen smart production capability to support high-end...
Thursday 19 September 2019
Pan-Moore's Laws to drive expansion in heterogeneous chips integration, says ASE COO
The global semiconductor sector will experience constant quantitative and qualitative changes in the next 20-30 years, and heterogeneous integration will not be confined to CPU and...
Tuesday 17 September 2019
ASE gearing up for 5G mmWave AiP, RF modules assembling
Leading IC backend house ASE Technology Holding will have its fan-out (FO) packaging technology ready in 2020 at the earliest for volume production of mmWave antenna-in-package (AiP)...
Wednesday 11 September 2019
ASE to enjoy revenue growth through 4Q19 on SiP orders
IC backend house ASE Technology Holding is expected to generate sequential revenue increases through the last quarter of 2019, driven by orders for SoC chips for smartphones, wearables...
Thursday 22 August 2019
ABF substrate demand to stay robust through 2020
ABF substrates have seen robust demand for processing 5G networking chips and high-performance computing chips since the start of 2019, but shipments of BT substrates for mobile chips...
Tuesday 13 August 2019
ShunSin eyes robust networking, face ID modules shipments to US in 2H19
ShunSin Technology, Foxconn Technology Group's IC backend service affiliate, is expected to see revenues and profits hit the year's highs in September and October, bolstered by robust...
Tuesday 13 August 2019
ASE to buy new factory building to optimize capacity deployment
Taiwan's top backend house Advanced Semiconductor Engineering (ASE) has decided to purchase a new factory building in Kaohsiung, southern Taiwan to provide more space for warehousing...
Monday 12 August 2019
IC backend supply chain to thrive on 5G smartphone penetration
With Qualcomm aggressively offering multiple APs, baseband chips and RF front-end modules (FEMs) to tap the 5G smartphone market, its Taiwan-based backend service providers including...
Monday 5 August 2019
Amkor reportedly grabs orders for MediaTek 7nm SoC
MediaTek has placed backend orders with Amkor Technology for its new 7nm SoC designed for low-band (sub-6GHz) 5G handsets, according to industry sources.
Thursday 1 August 2019
ASE gaining ground in SiP on heterogeneous integration demand
Taiwan's top IC backend specialist ASE Technology Holding has seen its SiP (system in package) business expand substantially so far this year amid growing demand for heterogeneous...
Tuesday 23 July 2019
Chipmakers keen to roll out power-saving 5G chip solutions
As shipments of 5G network equipment and terminal devices are set to trend up steadily, major global chipmakers are all gearing up for close combats in the 5G chipset market by releasing...
Friday 12 July 2019
ABF substrates makers see strong 2H19 demand for network, AI applications
Taiwan's makers of ABF-based IC substrates including Unimicron and Nan Ya PCB will see full capacity utilization for the product line through the second half of 2019 mainly thanks...
Wednesday 10 July 2019
Order visibility for IC packaging materials clear throughout 3Q19
Clear order visibility for diverse IC packaging materials is seen through the end of the third quarter of the year thanks mainly to increasingly robust demand from OSAT (outsourced...
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Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research