Heterogeneous integration of diverse semiconductor components to support 5G, AI, automotive electronics, and IoT applications is gaining significant momentum, driving demand for SiP...
Taiwan-based Nan Ya PCB is gearing up to further upgrade its process technology and adjust product portfolios seeking to fully swing to profitability in the entire 2019 by cashing...
China-based OSAT (outsourced semiconductor assembly and test) firms are gearing up to tap into medium to high-end packaging fields, including the flip chip (FC) packaging segment...
Taiwan-based IC fabrication and packaging material distributors including Topco Scientific, Niching Industrial and Wahlee Industrial are expected to end 2018 with impressive annual...
System in package (SiP) will continue to gain momentum to become the mainstream IC packaging process in the future as it can further complete heterogeneous integration of diverse...
ASE Technology Holding, the parent company of IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), has reported October consolidated...
Amkor Technology will soon start operating a new factory at its manufacturing site in Longtan, northern Taiwan for wafer-level packaging (WLP) and wafer test services. The arrival...
Backend house ShunSin Technology, a subsidiary of Foxconn Electronics (Hon Hai Precision Industry) specializing in system-in-package (SiP) modules, will be stepping up its diversification...
ASE Industrial holding, the parent company of IC backend houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), is expected to report revenue...
As one of China's three leading IC backend service firms, Tongfu Microelectronics (TFME) has managed to provide one-stop packaging and testing solutions by expanding its operation...
ASE Industrial holding, the parent company of Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), will be diversifying its offerings to satisfy growing...
Pure-play foundry Taiwan Semiconductor Manufacturing Company (TSMC) has been enhancing its IC packaging capability by developing system-level packaging technology.
Foxconn Electronics (Hon Hai Precision Industry) has set up a semiconductor subgroup, which is mulling 12-inch fab construction, industry sources have claimed.
Advanced Semiconductor Engineering (ASE) has reported consolidated revenues of NT$64.97 billion (US$2.22 billion) for the first quarter of 2018, down 22.6% sequentially and 2.4% on...
ShunSin Technology, a subsidiary of Foxconn Electronics (Hon Hai Precision Industry) specializing in assembly and test of system-in-package (SiP) modules, returned to profitability...
