Tessera Technologies has announced that its wholly-owned subsidiary Invensas signed a new technology license and development agreement with Advanced Semiconductor Engineering (ASE)...
Advanced Semiconductor Engineering's core IC ATM (assembly, test and material) business has seen a pick-up in demand in the second quarter of 2016, but demand for SiP (system-in-package)...
Advanced Semiconductor Engineering (ASE), already a provider of SiP (system-in-package) modules for the first-generation Apple Watch, has reportedly grabbed the majority of SiP module...
Advanced Semiconductor Engineering (ASE) has announced three purchases of machinery equipment for a total of about NT$1.72 billion (US$52.6 million) from Kulicke & Soffa, Besi...
ShunSin Technology, a subsidiary of Foxconn Electronics (Hon Hai Precision Industry) specializing in assembly and test of system-in-package (SiP) modules, is expected to post revenue...
Jiangsu Changjiang Electronics Technology (JCET), China's largest semiconductor packaging and test services provider, has reportedly grabbed assembly orders for SiP (system-in-package)...
Advanced Semiconductor Engineering (ASE) is looking to grow revenues generated from the market in Korea, where the Taiwan-based IC backend house has invested US$1 billion in building...
The average utilization rate of Advanced Semiconductor Engineering's (ASE) IC ATM (assembly test and material) operation is expected to fall 4-6% sequentially in the fourth quarter...
IC packaging and testing houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have reported sequential increases of 5.8% and 5.7%, respectively,...
Advanced Semiconductor Engineering (ASE) has announced the official inauguration of ASE Embedded Electronics Incorporated, at a formal signing ceremony in Kaohsiung with TDK and local...
Siliconware Precision Industries (SPIL) expects its strategic partnership with Foxconn Electronics for developing SiP (system-in-package) packaging technology to begin bearing fruit...
AMICCOM, located in Taiwan Hsinchu Science Park, announces new Bluetooth Low Energy product, named A8107SiP. A8107SiP is a silicon-in-package (SiP) product and it includes A8107 and...
Advanced Semiconductor Engineering (ASE) will manage to post sequential revenue growth through the fourth quarter of 2015, according to company COO Tien Wu.
