Revenues at ShunSin Technology, a Foxconn subsidiary engaged in the assembly and testing of system-in-package (SiP) modules, are expected to rise substantially in July 2015 thanks...
The global IC packaging and testing industry has been working through excessive inventory for almost two quarters, but is set for tepid growth in the second half of the year, according...
Advanced Semiconductor Engineering (ASE) has acquired two new factory buildings nearby its operations in the Nantze Export Processing Zone, Kaohsiung, southern Taiwan, for a total...
Advanced Semiconductor Engineering (ASE) has announced it will be showcasing system-in-package (SiP) solutions for consumer applications at the Computex Taipei 2015. These SiP applications...
Dialog Semiconductor, which focuses on power management IC solutions, has announced plans to acquire a 40% stake in Taiwan-based Dyna Image, a wholly-owned subsidiary of Lite-On Se...
IC packaging and testing house Advanced Semiconductor Engineering (ASE) expects to more than double sales generated from its SiP (system-in-package) business in 2015, according to...
IC packaging and testing house Advanced Semiconductor Engineering (ASE) has reported net profits of NT$4.47 billion (US$146 million) for the first quarter of 2015, up 30% on year...
IC packager Advanced Semiconductor Engineering (ASE) will continue to expand its production capacity over the next three years, with investment to total between NT$100 billion (US$3.2...
A recent Chinese-language Commercial Times report quoted sources from Apple's supply chain as saying that Taiwan's Advanced Semiconductor Engineering (ASE) has obtained assembly...
Advanced Semiconductor Engineering (ASE) has reported record consolidated revenues and profits for 2014. For 2015, the IC backend house expects its quarterly sales to register sequential...
ShunSin Technology, a subsidiary of Foxconn Electronics (Hon Hai Precision Industry) specializing in assembly and test of system-in-package (SiP) modules, plans to have its stock...
Semicon Taiwan 2014 will kick off in Taipei from September 3-5, with this year's theme focusing on advanced wafer processes, next-generation memory technologies, 3D ICs and SiP packaging...
Universal Scientific Industrial (USI), an affiliated company of Advanced Semiconductor Engineering (ASE), reportedly has landed SiP module orders from Apple for its iWatch wearable...
Advanced Semiconductor Engineering (ASE), the world's largest chip packaging and testing company, expects its first-quarter shipments to decrease 12-15% sequentially due to seasonal...
SiP (system-in-package) currently accounts for 5-10% of the overall production value of the IC packaging sector, according to Tien Wu, COO for Advanced Semiconductor Engineering (ASE)...
