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Tuesday 10 March 2020
Taiwan IC substrate makers embracing strong 1Q20
Taiwan-based IC substrate makers including Unimicron Technology and Nan Ya PCB have posted double-digit annual revenue gains for February despite the coronavirus outbreak, and they...
Friday 21 February 2020
USI may enter backend supply chain of AirPods Pro series
Taiwan-based Universal Scientific Industrial (USI), a unit of ASE Technology, is likely to obtain system-in-package (SiP) orders for AirPods Pro Lite, which may also benefit Taiwanese...
Wednesday 22 January 2020
Taiwan IC backend houses to expand production capacity
Taiwan-based IC backend houses plan to implement their capacity expansion projects in 2020 to satisfy growing demand for more complex chip designs and high-end testing, according...
Monday 20 January 2020
ASE, IDMs teaming up to deepen deployments in auto IC modules
Despite global automotive semiconductor market being dominated by IDMs in Europe, the US and Japan, Taiwan's backend service leader ASE Technology Holding has been strengthening its...
Wednesday 15 January 2020
PTI expects sales growth in 1Q20
Backend house Powertech Technology (PTI) expects its revenues to be higher than year-ago levels in the first quarter of 2020, and is positive about its performance in all of the ye...
Friday 10 January 2020
ASE Technology to see core backend biz post flat sales growth in 1Q20
ASE Technology Holding is expected to see its core IC assembly, testing and material (ATM) business register flat sequential revenue growth in the first quarter of 2020, thanks to...
Wednesday 8 January 2020
Nan Ya, Kinsus see bright prospect for diverse IC substrates in 2020
IC substrate makers Nan Ya PCB and Kinsus Interconnect are both expected to post significant revenue and profit increases in 2020 as robust demand from segments of smartphones, servers,...
Thursday 26 December 2019
ASE planning capacity expansion in southern Taiwan
IC assembly and test services provider ASE Technology Holding has signed a MoU with Taiwan's STSP (Southern Taiwan Science Park) Bureau to secure 20 hectares of land at a new national...
Thursday 26 December 2019
Chinese backend firm JCET enters supply chain of Samsung, LG
China-based backend house Jiangsu Changjiang Electronics Technology (JCET), through its production subsidiary JCET STATS ChipPAC Korea (JSCK), has reportedly cut into the supply chain...
Tuesday 24 December 2019
Rigid-flex PCB makers to sustain robust shipments for AirPods 2 in 1H20
Taiwan PCB makers are expected to maintain strong shipments of rigid-flex boards at least throughout the first half of 2020 to meet robust demand for AirPods 2 and other TWS (true...
Friday 20 December 2019
Semiconductor tech to be more important in future 5G and AI applications
While 5G and AI will dominate new emerging tech applications to create cash flows for enterprises in the next decade, relevant semiconductor materials and technologies will not only...
Wednesday 18 December 2019
Rigid-flex boards to stay as mainstream for midrange applications
While SiP substrates are increasingly needed to support function upgrades on wearables, TWS earbuds and other devices, rigid-flex PCBs will firmly stay as mainstream applications...
Wednesday 11 December 2019
Zhen Ding to build capacity for SiP, AiP substrates
Taiwan-based PCB specialist Zhen Ding Technology has decided to enforce a capital increment of US$50 million at its second IC substrate subsidiary to build new capacity for advanced...
Wednesday 11 December 2019
ASE to see strong 1Q20 with robust 5G mobile SoCs backend orders
Robust orders for 5G smartphone application processors from the world's major Android phone vendors will allow backend house ASE Technology Holding to enjoy a particularly strong...
Monday 9 December 2019
ASE reportedly grabs SiP orders for new Qualcomm PC processor
Qualcomm has launched new Arm-based processors for notebooks. Among the chips, the new Snapdragon 7c series designed for entry-level devices reportedly adopts ASE Technology's system-in-package...