China's approach to battery exports is firmly grounded in two essential principles: preventing the escalation of economic conflicts and geopolitical tensions, and protecting core...
Memory intellectual property (IP) firm AP Memory Technology has seen AI drive an uptick in sales, even as its IoT business has yet to rebound. With quarterly gross margin back on...
Intel CEO Pat Gelsinger was recently in Taiwan for a brief visit to meet with TSMC chairman C. C. Wei at the Hsinchu Science Park (HSP), according to sources familiar with the matt...
Software-defined vehicles (SDVs) are at the forefront of automotive electronic innovation, and the surge in generative AI further amplifies software's transformative power. Yet, as...
Apple is strengthening its collaboration with China's display industry, aiming to lower production costs and reduce reliance on primary South Korean suppliers, Samsung Display (SDC)...
The memory technology market has experienced significant fluctuations in recent years, marked by production cuts and shifting prices. The beginning of 2024 saw a gradual recovery,...
AUO has said they are focusing on silicon photonics opportunities while holding onto its cautious approach panel-level fan-out packaging (FOPLP), a notable divergence from its rivals...
As AUO (AU Optronics) undergoes a strategic transformation, the company maintains a cautious stance on fan-out panel level packaging (FOPLP) but shows increased optimism about silicon...
Three months ago, Wall Street punished the world's largest technology firms for spending enormous amounts to develop artificial intelligence (AI), only to deliver results that failed...
Located near London, UK, Silverstone—home to the Formula 1 British Grand Prix since 1950—has evolved into much more than a racetrack. The venue now serves as a hub for...
SK Hynix plans to provide samples of its 48GB, 16-layer HBM product—the industry's largest capacity and highest layer count—in the first quarter of 2025. CEO Noh-Jung...
Samsung Electronics and SK Hynix are advancing next-generation memory technology with "ultra-low-temperature" etching, a technique initially applied to high-density, multi-layer NAND...
Samsung Electronics is reportedly set to launch high-capacity and high-heat-dissipation Bonding Vertical (BV) NAND Flash with more than 400 layers in 2026. This move aims to enhance...
After parting away with Japanese financial firm SBI Holdings, Powerchip Semiconductor Manufacturing Corporation (PSMC) announced that it has received the initial payment from Tata...
