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Thursday 10 September 2026
Taiwan quantum leap expands scope to drug and finance
Taiwan's five-year National Quantum Team program is set to conclude in December 2026, and the government's second-stage quantum research initiative will begin in January 2027. The...
Thursday 10 September 2026
Nanoprinting lithography shifts from round to square, increasing waveguide output
Nanoimprint technology is shifting from round to square substrates. Qingdao GermanLitho noted that this transition has become vital for volume manufacturing as the industry demands...
Thursday 10 September 2026
Huachuang Xinguang sees MicroLED optical interconnects entering data centers in 3 to 5 years

Shenzhen Huachuang Xinguang says MicroLED optical interconnect technology is feasible and expects to target data center applications...

Thursday 10 September 2026
US Justice Department probes Nvidia-Groq deal over antitrust concerns
The US Department of Justice has opened a probe into Nvidia's deal with AI chip startup Groq, according to reports from The New York Times and Reuters. Regulators are examining...
Thursday 10 September 2026
TSMC August 2026 revenue jumps 53.3% as AI chip demand drives record growth

TSMC reported strong revenue growth in August, underscoring continued momentum in AI-related semiconductor demand. TSMC said consolidated...

Thursday 10 September 2026
DeepSeek reportedly advances Shanghai IPO plans as it cuts Flash model API prices
Chinese AI startup DeepSeek has taken a concrete step toward a domestic stock-market debut while continuing to adjust its commercial strategy, including another reduction in API prices...
Thursday 10 September 2026
Spirox TGV inspection capable of scanning entire substrate in 20 minutes
As advanced packaging moves toward higher-density stacking, demand is rising for glass through-glass via (TGV) and through-silicon via (TSV) inspection, while glass core substrates...
Thursday 10 September 2026
Elmos locks in SK keyfoundry wafer supply through 2037 as 8-inch capacity tightens

Germany's Elmos Semiconductor has secured wafer capacity from South Korea's SK keyfoundry through 2037, expanding an 18-year manufacturing...

Thursday 10 September 2026
SK Hynix says 3D DRAM will borrow from logic foundry playbook
SK Hynix is signaling a shift in memory design that could matter far beyond South Korea. By adopting logic foundry techniques for 3D DRAM, the company is moving toward a future where...
Thursday 10 September 2026
China gets an early shot at the next SiC power-chip cycle

Alkaidsemi (Shanghai) Technologies Corporation has introduced a 1,200 V silicon carbide superjunction MOSFET that it describes as the...

Thursday 10 September 2026
Samsung Electro-Mechanics' glass-substrate rollout slows as TSMC evaluation drags on

Samsung Electro-Mechanics (Semco) is facing a slower glass-substrate rollout as a reliability evaluation of through-glass via (TGV) modules...

Thursday 10 September 2026
Loongson raises funds to expand CPU and GPU development as AI inference boosts domestic chip plans
Chinese CPU maker Loongson recently announced a CNY2.3 billion (approx. US$342.7 million) capital increase, with the funds mainly going into information technology chips and core CPU...
Thursday 10 September 2026
Apple's A20 Pro pushes mobile chips into the 2nm era — but AI may be the bigger disruption

For years, smartphone processors have competed through a familiar formula: faster CPUs, stronger graphics, and increasingly smaller...

Thursday 10 September 2026
Panasonic Energy unveils high-temperature solid-state battery, targets industrial uses, robotics

Panasonic Energy has developed a new solid-state battery capable of operating at temperatures up to 150 degrees Celsius (302 degrees...

Thursday 10 September 2026
Analysis: China chases EUV as chipmakers move to High-NA
The extreme ultraviolet (EUV) lithography race is splitting into two tracks. Intel has moved High-NA EUV into production, Samsung Electronics and SK Hynix are targeting DRAM production...