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    China's optical supply chain gains ground in smart glasses
    Sep 16, 18:39
    Exclusive: China's CAS microelectronics institute unveils DUV-based 3nm GAA development path
    Sep 16, 18:39
    Samsung expands SRAM and IP support as memory shortages reshape chip design
    Sep 16, 18:39
    AMD shifts China strategy from chips to developer ecosystems as Nvidia retreats
    Sep 16, 18:39
    SK Hynix passes new performance bonus plan with cash and stock split evenly
    Sep 16, 18:39
    NEWS TAGGED TECHNOLOGY
    Thursday 17 September 2026
    Samsung looks to outside suppliers as HBM boom shifts priorities
    Samsung Electronics has long benefited from a level of vertical integration few technology companies can match, spanning smartphones, memory, chip design, foundry manufacturing and...
    Thursday 17 September 2026
    Huawei aims to become 'China's Nvidia,' rules out building satellites or spacecraft

    Huawei's internal Heart Voice Community recently published minutes from a discussion between Guo Ping, chairman of Huawei's supervisory...

    Wednesday 16 September 2026
    Analysis: Jensen Huang is in Trump's ear; what it means for Taiwan's chip supply chain
    "The narrative is much more practical," Nvidia CEO Jensen Huang said of China's approach to artificial intelligence (AI) at the All-In Summit 2026, contrasting it with US warnings...
    Wednesday 16 September 2026
    LEOTEK completes real-world test of AI traffic system at US smart city lab

    Leotek Electronics has completed a real-world deployment of its Interlux AI Traffic Signal System in Georgia, highlighting how cities...

    Wednesday 16 September 2026
    Samsung and Qualcomm jointly developing organic bridges for 2.1D packaging
    Samsung Electro-Mechanics and Qualcomm are working together to develop an organic bridge for 2.1D packaging architectures. The partnership takes place as AI chips grow larger, denser,...
    Wednesday 16 September 2026
    EV batteries cannot simply power humanoid robots, with energy density and costs posing key hurdles
    Power battery technology has reached maturity in the new energy vehicle (NEV) market, but transferring it to humanoid robots presents two major barriers: the need for significant technological...
    Wednesday 16 September 2026
    SK Hynix, Intel in talks on US production to ease memory crunch
    SK Hynix is in talks with Intel about a potential deal that could give the South Korean company its first memory chip manufacturing operation in the US, as tight supply pushes customers...
    Wednesday 16 September 2026
    Glass substrates, TGV set to reshape 2027 advanced packaging race
    As AI chip package sizes continue to expand, advanced packaging is moving up the technology ladder. Glass substrate and through-glass via (TGV) technologies have become a new competitive...
    Wednesday 16 September 2026
    MediaTek keeps Dimensity 9600 Pro on HBPoP as cost drives decisions

    MediaTek officially unveiled the Dimensity 9600 Pro on September 15, 2026, drawing significant industry attention to its choice of packaging...

    Wednesday 16 September 2026
    Advanced processes have no ready-made answers, says TSMC's COO

    Taiwan Semiconductor Manufacturing Company (TSMC) chairman C.C. Wei and co-chief operating officer Y.J. Mii participated in the "Cross-Generational...

    Wednesday 16 September 2026
    Interview: Forget transistors — speed is what's choking the chip supply chain, says Qnity exec
    The global surge in AI demand is accelerating change across the semiconductor industry, and as Moore's Law scaling faces physical limits, chipmaking is no longer only about shrinking...
    Wednesday 16 September 2026
    ITRI showcases AI robots, drones to push commercialization in southern Taiwan

    The Industrial Technology Research Institute (ITRI) held its ITRI Innovation Day on September 15 in Tainan, Taiwan, bringing together...

    Wednesday 16 September 2026
    As AI data centers hit a transmission wall, GlobalFoundries pushes into silicon photonics
    At the China International Optoelectronics Expo (CIOE), a palm-sized metal transceiver represents the shift from copper to light in data center infrastructure, one of the biggest transformations...
    Wednesday 16 September 2026
    DIGITIMES Insight: NVHBM is not a memory revolution; Nvidia seeks to platformize cHBM, dominate custom AI architectures

    DIGITIMES observed that Nvidia's newly announced NVHBM is not a brand-new memory technology, but rather an extension of existing custom...

    Wednesday 16 September 2026
    DIGITIMES Insight: Intel may lack a price edge over TSMC on SK Hynix HBM base dies

    SK Hynix is reportedly considering Intel as an additional manufacturing source for high-bandwidth memory (HBM) base dies beginning with...

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    BIZ FOCUS
    Sep 14, 08:00
    Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
    Monday 14 September 2026
    Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
    Friday 11 September 2026
    Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
    Friday 11 September 2026
    DAS Expands in Taiwan and Unveils World First at SEMICON
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