Network equipment maker Alpha Networks said it has teamed up with Taiwan's Industrial Technology Research Institute (ITRI) and Chen Lung Technology to jointly advance the "B5G/Pre-6G...
Micro LED is moving beyond displays into AI optical communications, with PlayNitride targeting commercial deployment within two years if industry standards and supply-chain integration...
Two of China's first listed foundation-model developers are showing that demand for their technology can translate into rapidly growing revenue. Turning that demand into profit remains...
TIME recently unveiled its 2026 list of the 100 most influential people in AI. Alongside leaders of major technology companies, the list includes a new generation of Chinese...
Sandisk says its NAND-based High Bandwidth Flash (HBF) technology can match HBM bandwidth while providing eight to 16 times the capacity at a similar cost, positioning flash memory...
The European Union is pushing to strengthen domestic second-life battery production and recycling loops, but EV battery recycling still faces a contradiction: the technology is maturing,...
As AI and high-performance computing (HPC) continue to drive semiconductor advances, industry competition is shifting beyond chip performance toward packaging, cooling, assembly, and...
TSMC will set up operations in Kaohsiung's Baipu Industrial Park, helping create Taiwan's first advanced packaging materials and equipment supply-chain cluster. Closely watched by...
TSMC has asked materials and equipment suppliers to develop 5-micrometer-class microbump bonding and underfill technology for advanced HBM packaging, according to ETNews,...
Marvell SVP and chief technology officer Radha Nagarajan offered a clearer timeline for the commercialisation of co-packaged optics, or CPO, during a media briefing at SEMICON Taiwan...
Speaking at the SEMI 3DIC Advanced Manufacturing Alliance (3DICAMA) Global Summit on September 1, Jun He, TSMC Vice President of Advanced Packaging Technology and Service, noted that...
Semicon Taiwan 2026 will draw more than 1,300 companies and 4,300 booths to Taipei from September 2 to 4, setting new records as the industry show expands beyond chipmaking into packaging,...
As interconnect traffic in AI hyperscale data centers climbs, optical modules are moving toward the 1.6T and 3.2T generations. United Microelectronics Corporation (UMC), Taiwan's second-largest...
Micro LED maker PlayNitride Inc. expects the technology to enter commercial optical communications applications within two years, expanding beyond displays into AI devices, data center...
Driven by the rapid growth of AI, high-performance computing (HPC), and automotive electronics, semiconductor architecture is shifting toward high-efficiency chiplets and heterogeneous...
