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Wednesday 27 May 2026
Taiwan optoelectronics materials maker Wah Hong targets high-end PCB and chip packaging demand

AI, low-carbon sustainability, smart cities, and advanced displays are set to drive the global optoelectronics industry in 2026, shifting...

Wednesday 27 May 2026
SK Hynix seeks to embed cooling inside HBM to beat the heat
SK Hynix has unveiled a new high-bandwidth memory technology designed to reduce heat buildup in next-generation AI systems, as rising computing density turns thermal management into...
Wednesday 27 May 2026
Taiwan's quiet fix for GPS-denied drones and satellites
At the Plug and Play May Summit in Sunnyvale, a Taiwanese startup called Aegiverse quietly made its case to US defense and aerospace investors — not with flashy slides or moonshot...
Wednesday 27 May 2026
Thunder Tiger, Elan eye defense and commercial drone markets

Thunder Tiger said on May 26 that it has signed a memorandum of understanding (MoU) with Elan Microelectronics to jointly develop AI...

Tuesday 26 May 2026
LED maker Ennostar pivots to optical interconnects after high-value shift agin traction
Ennostar Holdings' transformation has begun to show clear results, with chairman Paul Peng saying the company's "3+1" strategy is taking shape, as higher-value applications now account...
Tuesday 26 May 2026
Nvidia and Marvell CEOs to share Computex stage— How US$2 billion turned rivals into partners
When Nvidia quietly wrote a US$2 billion check to Marvell Technology earlier this year, it was less a financial bet than a strategic maneuver — one that converted a potential...
Tuesday 26 May 2026
The US$16.5 Billion Bet: How Co-Packaged Optics Will Rewire AI's Backbone by 2030
As AI clusters continue to scale, traditional interconnect architectures are facing new limits in bandwidth, power efficiency, and system integration. Co-Packaged Optics is emerging...
Tuesday 26 May 2026
Samsung's reported 900-layer V-NAND prototype puts NAND race with YMTC in focus
The race to dominate next-generation NAND flash memory has long been measured in layers — and Samsung Electronics appears to be pulling ahead. The South Korean chipmaker has...
Tuesday 26 May 2026
E Ink brings BMW-backed color-changing e-paper car tech to Computex 2026

E Ink will bring its BMW-backed color-changing e-paper vehicle technology to Computex 2026, showcasing the hood structure of the BMW iX3...

Tuesday 26 May 2026
Intel's Rio Rancho fab becomes test case for AI-era chip packaging
Intel is looking to broaden its foundry strategy beyond the race for advanced process nodes, placing greater emphasis on advanced packaging and glass substrate technologies as it positions...
Tuesday 26 May 2026
Huawei eyes AI storage breakthrough with DoB packaging, 245TB SSD roadmap
Huawei has released its Data Storage 2030 white paper, setting out a technology roadmap for the global storage industry over the next five to...
Tuesday 26 May 2026
Analysis: Huawei's Tau Law signals a new semiconductor framework — with implications beyond China
As the global semiconductor industry approaches the physical limits of transistor scaling, Huawei has proposed a new framework for the post-Moore era through its recently introduced...
Tuesday 26 May 2026
China pushes homegrown AI stack with local chips, LLMs

Following the conclusion of the Trump-Xi meeting and amid continued delays in China approving imports of Nvidia H20 GPUs, China's National...

Tuesday 26 May 2026
Micron expands US DDR4 output as AI keeps global supply tight
As Micron Technology's decision to restart large-scale DDR4 production in the US grabs global attention, memory-chip executives and analysts say the move is less a revival of aging...
Tuesday 26 May 2026
Lightmatter joins TSMC on COUPE for 3D optical engines
AI computing's massive demand for infrastructure is making interconnect and laser technologies key to overcoming power and bandwidth limits, prompting silicon photonics unicorn Lightmatter...