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Wednesday 21 October 2026
Li Auto chip subsidiary Mahe Xin raises CNY1.6 billion in equity financing as automakers aim to become chipmakers
Li Auto's chip and domain controller subsidiary, Mahe Xin Technology, has entered a first-round equity financing agreement worth CNY 1.625 billion (approx. US$243.33 million). The...
Wednesday 21 October 2026
Infineon, Wolfspeed pivot to 8-inch SiC to cut costs and meet rising AI power demand
Infineon Technologies and US-based silicon carbide (SiC) leader Wolfspeed announced on October 15 a new multi-year supply agreement for 8-inch SiC wafers. This deal transitions their...
Wednesday 21 October 2026
Sony keeps chip unit as imaging sensors, TSMC partnership drive strategy
Sony Group will not spin off its semiconductor business, which focuses on image sensors, president and CEO Hiroki Totoki said recently. The group is retaining the unit because its...
Wednesday 21 October 2026
Samsung Display accelerates MPO and inkjet OLED development for laptops and monitors
Samsung Display (SDC) is reportedly advancing both micro-patterned OLED (MPO) and inkjet-printed OLED technologies in parallel, expanding its non-fine metal mask (non-FMM) RGB OLED...
Wednesday 21 October 2026
HD Hyundai Robotics unveils dual-arm robot as FIX 2026 opens
HD Hyundai Robotics unveiled a dual-arm robot under development at FIX 2026 in Daegu, South Korea, on October 21, marking its first public showing as the company seeks to expand beyond...
Wednesday 21 October 2026
China launches state-owned data group as market-facing arm of its AI infrastructure push
China has established a new state-owned enterprise, National Data Group, headquartered in Xiong'an, Hebei province. Ding Xuexiang, a vice-premier of the State Council, attended its...
Wednesday 21 October 2026
Taiwan PCB output set to top NT$1 trillion as VP touts AI opportunity
The 27th Taiwan Printed Circuit Industry International Exhibition (TPCA Show 2026) opened in Nangang on October 20, with Vice President Hsiao Bi-khim calling on the PCB industry to...
Wednesday 21 October 2026
US sanctions five Chinese entities over trade secret theft tied to ex-Google engineer
The US imposed sanctions on five Chinese entities tied to ex-Google engineer Linwei Ding for theft of trade secrets. The action follows his conviction for stealing confidential AI...
Wednesday 21 October 2026
Toppan, Keio University validate quantum AI image generation
Toppan Holdings and Japan's Keio University have completed a proof of concept for technology that combines quantum computers with generative AI to support manga and anime production,...
Wednesday 21 October 2026
Samsung reportedly shifts foundry focus to 4nm, 5nm as 2nm deals take longer
Samsung Electronics is increasingly relying on its 4nm and 5nm foundry processes to improve near-term profitability as negotiations with major customers for its next-generation 2nm...
Wednesday 21 October 2026
Advanced PCB drilling faces growing demand from AI and high-speed applications
Topoint Technology is positioning its precision PCB drilling business for rising demand from AI servers, high-performance computing, and high-speed transmission applications. At TPCA...
Wednesday 21 October 2026
Foxconn and Mitsubishi Electric target SDV with L4 autonomy and EV drive systems
Foxconn's planned JPY115 billion (US$726.83 million) investment in Mitsubishi Electric Mobility will create a joint venture to expand their electric-vehicle and autonomous-driving...
Wednesday 21 October 2026
AI customers seek 3-year partnerships as Unimicron calls for Taiwan PCB supply chain collab
TPCA Show Taipei 2026, organized by the Taiwan Printed Circuit Association (TPCA), opened on October 20. Unimicron Technology chairman S.C. Chien delivered a keynote at the opening...
Wednesday 21 October 2026
Taiwan's September export orders jump 62.4% on AI demand
Taiwan's export orders totaled US$114.21 billion in September 2026, up US$11.25 billion, or 10.9%, from the previous month, according to data released by Taiwan's Ministry of Economic...
Wednesday 21 October 2026
Packaging-to-board integration emerges as key gap as AI reshapes electronics supply chain
Packaging, substrate, printed circuit board (PCB), and assembly makers need closer coordination to meet the demands of AI and high-performance computing (HPC), as package-to-board...