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Sunday 31 May 2026
AUO sees automotive orders setting up revenue gains from 2026
AUO said its automotive business has entered a high-growth phase, with annual orders for in-vehicle products now exceeding current-year revenue. The company expects revenue benefits...
Sunday 31 May 2026
Yageo eyes AI liquid-cooling dealmaking, targets protection components
Yageo chairman Pierre Chen, who has become Taiwan's richest man, reiterated at the company's recent shareholders meeting that the group will not sit out opportunities in the AI applications...
Sunday 31 May 2026
60% of smart factories underperform as South Korea expert eyes tacit knowledge for manufacturing AX
South Korea is treating AI transformation as a future test of manufacturing competitiveness. The challenge now is not only installing smart systems, but converting frontline workers'...
Sunday 31 May 2026
Winbond accelerates custom memory transition
Winbond Chairman Arthur Chiao said market sentiment in the second half of 2026 would carry the strong momentum seen in the first half, with the overall market remaining in a supply...
Sunday 31 May 2026
Taiwan Mobile sets sights on NT$1 trillion revenue as AI and enterprise services drive growth
Taiwan Mobile outlined plans to pursue a NT$1 trillion (US$31.88 billion) revenue target as it shifts emphasis to AI, enterprise services, and new technology businesses, executives...
Sunday 31 May 2026
LinkerBot deal brings AI bionic hands closer to mass market
LinkerBot, a leading Chinese developer of robotic dexterous hands, has acquired Jingling Zhikang in a strategic move that could push AI-powered bionic hands from high-cost rehabilitation...
Saturday 30 May 2026
AUO Micro LED CPO enters sampling stage
AUO's entry into Micro LED co-packaged optics sampling could give the display maker a new growth path as it seeks to expand beyond panels. Chairman Paul Peng said the company is preparing...
Saturday 30 May 2026
Intel makes first major move into India's semiconductor ecosystem with advanced glass substrate manufacturing MoU
India has signed a memorandum of understanding (MoU) with Intel and US-based 3DGS to establish an advanced packaging glass-core substrate manufacturing facility in the eastern state...
Saturday 30 May 2026
Innolux turns to packaging, smart cockpits in higher-margin push
Innolux plans to accelerate its transformation in 2026, with chairman and CEO Jim Hung pointing to three priorities: advanced semiconductor packaging, smart cockpits, and higher-margin...
Saturday 30 May 2026
Google-backed robot startup tests E Ink electronic paper for humanoid skin
The humanoid robotics industry is looking beyond mechanical structures for its next wave of innovation, with materials emerging as a potential focus for new market opportunities. A...
Friday 29 May 2026
Commentary: Five trends that stood out at Plug and Play's Silicon Valley May Summit
Three days at Plug and Play's Silicon Valley May summit left me with a clear takeaway: the technology industry is undergoing a structural shift, not just another hype cycle. Here are...
Friday 29 May 2026
Chinese power chipmaker China Resources Microelectronics targets AI servers with PLP packaging
Generative AI, HPC, and large data centers are raising demand for chips with higher power efficiency, stronger thermal control, and denser packaging, making advanced packaging a more...
Friday 29 May 2026
Arm deepens ties with Taiwan chip designer QBit around edge AI and cybersecurity
Arm EVP and Chief Commercial Officer Will Abbey visited QBit Semiconductor's Taiwan headquarters on May 27, signaling deeper cooperation that could shape future chip design for edge...
Friday 29 May 2026
BYD unveils 4nm autonomous driving chip, expanding 'God's Eye' intelligent driving strategy
On May 28, BYD held a major technology launch event to strengthen consumer trust in intelligent driving and accelerate adoption of its three-tier "God's Eye" assisted-driving system...
Friday 29 May 2026
IBM targets AI-era trust with open source security, quantum computing bets
IBM and Red Hat are committing US$5 billion to Project Lightwell, a new enterprise security initiative designed to protect open source software supply chains as AI accelerates both...