Samsung Electronics has secured key technology for a 5nm-class magnetoresistive random-access memory cell, according to Korean financial...

China has achieved mass production of ultra-pure silicon, according to the state-owned China National Nuclear Corporation (CNNC) —...

AI server liquid cooling is driving demand for pump makers, a shift that could boost supply-chain resilience and margins for Asia-based...

TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in...

A South Korean media report claiming TSMC is preparing to launch panel-level packaging at mass-production scale as early as 2027 has...

Nvidia's dominance in AI is extending beyond model training and deeper into inference—the fast-growing segment of the AI market responsible...

Japan's Rapidus has signed a memorandum of understanding with the UK Semiconductor Centre, a government-backed body established in 2025...

Equipment maker Manz recently announced the successful delivery of the world's first 310mm x 310mm panel-level packaging (PLP) electrochemical...

SpaceX has broken through the US$2 trillion market-cap mark after completing the largest initial public offering (IPO) in history,...

Taiwanese companies sharply increased enterprise AI investment and adoption in 2026, yet critical gaps in technology architecture and...

The Supreme People's Court in China rejected Infineon's reconsideration request on June 12, 2026, upholding a Suzhou Intermediate People's...