At CES 2026 in the US, Nvidia unveiled its open-source vision-language-action (VLA) model series, Alpamayo, signaling a new phase in the development of autonomous driving technologies...
Apple Inc., Qualcomm Inc., and MediaTek are all set to advance their smartphone system-on-chip (SoC) offerings to the 2nm process node in 2026. This coordinated move signals the three...
In a global first, US defense startup Epirus successfully disabled and crashed a fiber-optic guided drone using a lightweight version of its Leonidas high-power microwave (HPM) system...
Vivo has recently shown strong performance driven by robust sales of its X300 smartphone series. However, as the company looks to 2026, industry analysts warn that it will encounter...
NAND flash prices have increased dramatically. Supply and demand are unlikely to ease this year as AI technology giants and large cloud service providers (CSPs) aggressively purchase...
The US and Taiwan have reached a trade breakthrough that lowers reciprocal tariffs to 15% and applies most-favored-nation treatment without stacking, creating new momentum for Taiwanese...
Apple and Google have entered an AI technology partnership reportedly worth as much as US$5 billion, according to industry sources cited by the Financial Times. Meanwhile,...
Industry speculation about collaboration between optics manufacturers and semiconductor companies to bolster their silicon photonics (SiPh) capabilities is gaining ground. Following...
OpenAI said it would partner with the artificial intelligence chip maker Cerebras to build 750 megawatts of ultra-low-latency AI computing capacity, a project that will come online...
After securing a 15% tariff cap, the next step is to examine future directions of US-Taiwan bilateral cooperation. Aside from establishing models to help Taiwanese companies enter...
South Korea's Intellectual Property Office (KIPO) signed a new Memorandum of Understanding (MOU) on intellectual property cooperation with China's National Intellectual Property Administration...
SK Hynix plans to invest KRW19 trillion, about US$12.9 billion, to build an advanced semiconductor packaging plant in Cheongju, South Korea, as it moves to secure capacity for AI-driven...
As the global semiconductor industry enters the post-Moore's Law era amid surging demand for artificial intelligence (AI) and high-performance computing (HPC), advanced packaging has...
Samsung Electronics Vice Chairman Jun Young-hyun, since his appointment in May 2024, has spearheaded significant changes at the company's Device Solutions (DS) division, reversing...
