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Thursday 6 August 2026
Samsung to pay Netlist up to US$897 million to settle memory patent dispute

Samsung Electronics will pay Netlist up to US$897 million in gross licensing fees over five years under a series of agreements that settle...

Thursday 6 August 2026
Unitree's impending IPO draws Meituan and Tencent as investors

Chinese robotics company Unitree is entering a critical stage in its initial public offering. The IPO is expected to raise about CNY4.2...

Thursday 6 August 2026
Taiwan unveils four semiconductor pillars for Smart Nation 2.0 plan

On August 5, Taiwan's National Science and Technology Council said it had completed the central government's 2027 budget plan, with...

Thursday 6 August 2026
Rashi Peripherals partners with Japan's Restar to build out India semiconductor business

Rashi Peripherals, a national distribution partner for global technology brands in India, has entered a joint venture with Japanese...

Thursday 6 August 2026
NEO Semiconductor unveils AI memory platform aimed at easing global bottlenecks
NEO Semiconductor has launched NEO.AI, a memory platform it says could help address one of the biggest constraints on artificial intelligence (AI) systems worldwide: limited memory...
Thursday 6 August 2026
US curbs on Chinese data-center optics open orders to non-China suppliers
The US Federal Communications Commission is reportedly considering restrictions on new models of Chinese-made optical transceivers used in data centers, potentially exposing suppliers...
Thursday 6 August 2026
US weighs Chinese optical transceiver ban, putting AI data center supply at risk

The Trump administration is preparing to extend US technology restrictions deeper into the artificial intelligence supply chain, with the...

Thursday 6 August 2026
Taiwan's KOYO-1 satellite validates homegrown FOG technology, opening doors to global space supply chains
Taiwan's aerospace industry has reached another milestone with the successful launch of the KOYO-1 CubeSat in July 2026, helping local suppliers advance further into the global space...
Thursday 6 August 2026
FOPLP leads production as CoPoS advances glass packaging
AI chip computing power is rising rapidly, pushing advanced packaging toward larger form factors, higher bandwidth, and greater integration. Traditional Ajinomoto build-up film (ABF)...
Thursday 6 August 2026
Traditional Chinese Medicine in the Era of Digital Health and Preventive Healthcare

As global healthcare systems evolve, preventive medicine and digital health technologies are becoming key drivers of medical innovation. Aging populations, rising healthcare...

Thursday 6 August 2026
Microdisplay advances push AR glasses closer to mainstream adoption
Taiwanese supply-chain players said new microdisplay designs and optical simulation tools are accelerating consumer augmented reality (AR) glasses adoption as the market shifts toward...
Wednesday 5 August 2026
China halts US-based factory audits for CCC certification amid raging tech feud

The US-China technology and supply chain conflict has spread to product certification, opening a new front beyond semiconductors and...

Wednesday 5 August 2026
Kioxia and Sandisk unveil faster, denser QLC flash memory for AI infrastructure
Kioxia and Sandisk have introduced a next-generation QLC 3D flash memory technology that boosts storage density, bandwidth, and power efficiency, a development that could help global...
Wednesday 5 August 2026
PSMC open to US, Singapore, Malaysia joint ventures as Intel packaging partnership enters mass production

Market interest in whether Taiwan's Powerchip Semiconductor Manufacturing (PSMC) would deepen cooperation with Intel or potentially...

Wednesday 5 August 2026
US reportedly expands AI infrastructure security push with planned restrictions on Chinese optical transceivers

The Trump administration is preparing new restrictions on Chinese-made optical transceivers used in AI data centers, broadening Washington's...