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    Exclusive: China 6-inch SiC substrate supply tightens, suppliers brace for another price hike
    1h 33min ago
    Intel’s EMIB-T emerges as a backup option as CoWoS capacity tightens
    1h 33min ago
    AUO unit plans to ride synergy gains momentum into entering TSMC ecosystem
    1h 33min ago
    AI buildout lifts demand for China high-speed optical module makers
    1h 34min ago
    SJSemi expands 2.5D packaging to 3.3-reticle size for AI and HPC chips
    1h 34min ago
    NEWS TAGGED TECHNOLOGY
    Wednesday 2 September 2026
    Sandisk says HBF can match HBM bandwidth with up to 16x the capacity
    Sandisk says its NAND-based High Bandwidth Flash (HBF) technology can match HBM bandwidth while providing eight to 16 times the capacity at a similar cost, positioning flash memory...
    Wednesday 2 September 2026
    EU EV battery recycling still lacks a profitable model
    The European Union is pushing to strengthen domestic second-life battery production and recycling loops, but EV battery recycling still faces a contradiction: the technology is maturing,...
    Wednesday 2 September 2026
    Indium CEO: packaging, cooling and power are next AI bottlenecks
    As AI and high-performance computing (HPC) continue to drive semiconductor advances, industry competition is shifting beyond chip performance toward packaging, cooling, assembly, and...
    Wednesday 2 September 2026
    TSMC moves into Baipu Industrial Park, boosts advanced packaging
    TSMC will set up operations in Kaohsiung's Baipu Industrial Park, helping create Taiwan's first advanced packaging materials and equipment supply-chain cluster. Closely watched by...
    Wednesday 2 September 2026
    TSMC reportedly asks suppliers to develop 5μm HBM microbumps
    TSMC has asked materials and equipment suppliers to develop 5-micrometer-class microbump bonding and underfill technology for advanced HBM packaging, according to ETNews,...
    Wednesday 2 September 2026
    Marvell sees silicon photonics scaling from late 2027, with Taiwan and TSMC at the center
    Marvell SVP and chief technology officer Radha Nagarajan offered a clearer timeline for the commercialisation of co-packaged optics, or CPO, during a media briefing at SEMICON Taiwan...
    Wednesday 2 September 2026
    Hardware isn't the problem — TSMC exec flags software, substrate gaps in 3D IC
    Speaking at the SEMI 3DIC Advanced Manufacturing Alliance (3DICAMA) Global Summit on September 1, Jun He, TSMC Vice President of Advanced Packaging Technology and Service, noted that...
    Wednesday 2 September 2026
    Semicon Taiwan 2026 signals a broader race for AI-era semiconductor leadership
    Semicon Taiwan 2026 will draw more than 1,300 companies and 4,300 booths to Taipei from September 2 to 4, setting new records as the industry show expands beyond chipmaking into packaging,...
    Wednesday 2 September 2026
    UMC targets 12-inch TFLN to break 400G SiPh bottleneck
    As interconnect traffic in AI hyperscale data centers climbs, optical modules are moving toward the 1.6T and 3.2T generations. United Microelectronics Corporation (UMC), Taiwan's second-largest...
    Wednesday 2 September 2026
    Micro LED maker PlayNitride targets Micro LED optical communications within two years
    Micro LED maker PlayNitride Inc. expects the technology to enter commercial optical communications applications within two years, expanding beyond displays into AI devices, data center...
    Wednesday 2 September 2026
    Innolux targets advanced packaging with debut of Chip Last tech
    Driven by the rapid growth of AI, high-performance computing (HPC), and automotive electronics, semiconductor architecture is shifting toward high-efficiency chiplets and heterogeneous...
    Wednesday 2 September 2026
    World Diamond Technology accelerates mass production of 300 mm diamond wafers

    As AI, high-performance computing (HPC), and advanced packaging continue to move toward higher levels of power integration, chip power consumption is rising rapidly....

    Wednesday 2 September 2026
    US solar module capacity to lead by 2027, but cell and wafer shortages pose major hurdles
    The US is rapidly reshaping the cost structure of its solar supply chain under Section 232 of the Trade Expansion Act of 1962. According to a recent webinar hosted by Intertek CEA,...
    Wednesday 2 September 2026
    Keywave Technology innovative radar sensors spark a smart sensing revolution

    Keywave Technology is a fabless semiconductor company founded in December 2022 that specializes in radio frequency (RF) integrated circuit (IC) design and advanced radar...

    Wednesday 2 September 2026
    Manz Asia Broadens ECD Platform for Mass Panel-Level Packaging

    Rapid evolution of High-Performance Computing (HPC) and artificial intelligence chips for Hyperscalers and tech giants continue pushing large sized silicon demands. As...

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    BIZ FOCUS
    Sep 2, 08:22
    World Diamond Technology accelerates mass production of 300 mm diamond wafers
    Wednesday 2 September 2026
    Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
    Wednesday 2 September 2026
    8 September Hsinchu seminar: Silicon photonics driving AI chains
    Wednesday 2 September 2026
    Take Control of Your Process: Onto Innovation at SEMICON Taiwan 2026
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