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    Huawei's AITO targets Europe as Maextro faces brake-component controversy
    2h 31min ago
    SmartSens raises CNY3.2 billion to target automotive CIS and robot vision
    2h 31min ago
    Chinese automakers face three hidden barriers in European expansion
    2h 31min ago
    Why high-tech power plant investment still remains conceptual
    2h 31min ago
    Ecosia drops Mistral AI models for Chinese open-weight alternatives
    2h 31min ago
    NEWS TAGGED TECHNOLOGY
    Monday 12 October 2026
    Moonshot AI's Hong Kong IPO faces a critical ownership dispute ahead of US$50 billion debut
    China's Moonshot AI is seeking to settle a shareholder dispute involving claims potentially exceeding US$700 million ahead of a potential US$5 billion Hong Kong initial public offering...
    Monday 12 October 2026
    South Korea's Nucode targets US drone identification market with Realtek-based module
    South Korean wireless communications module maker Nucode has signed a memorandum of understanding (MOU) with US drone identification and airspace intelligence provider Zing Drone Solutions...
    Monday 12 October 2026
    AI's next hiring wave is shifting from model makers to onsite problem solvers
    Global technology companies and South Korean system integrators are widening their artificial intelligence hiring beyond model researchers to frontline engineers who work inside customer...
    Monday 12 October 2026
    TSMC, ASML eye 12-inch photomasks to unlock High-NA EUV's full-field potential
    Advanced semiconductor manufacturing is progressing toward 2nm and angstrom-era nodes (Å; where 1 nm equals 10 Å), bringing high-numerical-aperture extreme ultraviolet...
    Monday 12 October 2026
    LG Display unveils maskless OLED technology, targeting more efficient IT displays
    LG Display has unveiled a new organic light-emitting diode (OLED) manufacturing technology designed to improve production efficiency and display performance, and reduce manufacturing...
    Monday 12 October 2026
    India roundup: AI data center buildout accelerates as semiconductor push continues to broaden

    India's technology buildout is deepening across semiconductors and AI infrastructure, with chip IP, packaging and equipment initiatives advancing...

    Monday 12 October 2026
    Episil chairman says SiC is not yet shifting from 6-inch to 8-inch
    Episil held an earnings call on October 7, saying silicon carbide (SiC) capacity utilization has rebounded quickly from 30% at a low point to nearly 90% now. If 6-inch order demand...
    Sunday 11 October 2026
    System integration emerges as Taiwan's next drone industry edge for defense scale-up
    As defense technology and unmanned vehicles increasingly extend beyond traditional defense industries into the ICT and semiconductor sectors, Taiwan's manufacturers are being urged...
    Saturday 10 October 2026
    Trump awards science medal to Elon Musk, Jensen Huang
    US President Donald Trump will award the National Medal of Science to Nvidia CEO Jensen Huang and several other tech leaders, with major figures from the industry set to gather again...
    Saturday 10 October 2026
    TPCA Show 2026 to spotlight AI computing, Unimicron chair keynote
    As explosive AI computing demand drives hardware architecture change, Taiwan Printed Circuit Association (TPCA) is set to open its annual flagship event, with the 21st International...
    Saturday 10 October 2026
    Semco moves glass substrates to package-level testing
    Samsung Electro-Mechanics (Semco) has reportedly completed initial reliability testing of its 100mm glass substrates and moved to package-level verification using customer chips, marking...
    Friday 9 October 2026
    GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap
    GF said on October 8, 2026, that it has signed a multi-year, US$2 billion manufacturing agreement with TSMC to produce silicon interposers for TSMC's CoWoS ecosystem at its Malta,...
    Friday 9 October 2026
    Applied Materials, Intel target AI chip bottlenecks with interconnect scaling and Foveros 3D
    AI chip manufacturing demands are accelerating development of advanced logic and packaging technologies, prompting Applied Materials and Intel to expand their collaboration on next-generation...
    Thursday 8 October 2026
    Lam Research launches South Korea chip fund after 15,000-chamber milestone
    Lam Research is launching its first country-specific semiconductor venture fund in South Korea after shipping its 15,000th locally manufactured processing chamber, deepening its manufacturing...
    Thursday 8 October 2026
    Bloom Energy SOFC system to support AOI's Taiwan expansion

    Taiwan-based energy solutions provider Leadray Energy has partnered with Bloom Energy to deploy a solid oxide fuel cell (SOFC) on-site power generation...

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    GlobalExhibition
    BIZ FOCUS
    Oct 8, 08:00
    Nuvoton, AMI Empower AI Factories Via Arbel NPCM8XX OpenBMC
    Thursday 8 October 2026
    Edge-Cloud Computing Blocks Scams Before the Click
    Thursday 8 October 2026
    Dietary Therapy in Traditional Chinese Medicine and Modern Nutritional Science
    Wednesday 7 October 2026
    Chunghwa Telecom's Simplified Modular Data Center delivers fast turnkey deployment