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Monday 20 July 2026
HBM4 battle shifts to cooling as hybrid bonding slips
Sixth-generation high-bandwidth memory (HBM4) shipments paired with Nvidia Vera Rubin will keep rising in the second half of 2026, setting up a head-to-head fight among the three major...
Monday 20 July 2026
Commentary: China's DRAM comes of age with CXMT's IPO — but a trio of hurdles remains

CXMT's STAR Market IPO marks a coming-of-age moment for China's DRAM industry, but the listing is only the beginning. Having proved...

Monday 20 July 2026
Rapidus taps Cadence AI agents to speed 2nm chip design
Japanese foundry Rapidus is integrating Cadence's AI-agent technology into its chip design platform as it seeks to shorten development cycles and attract customers for its planned...
Monday 20 July 2026
Smart glasses race enters new phase as AI ecosystems eclipse hardware specs
The global smart glasses market is entering a decisive new stage in the second half of 2026, with competition expanding well beyond Meta's early dominance. Industry attention is rapidly...
Monday 20 July 2026
Intel reassigns global fabs, eyes early 14A and EMIB-T AI wins

Intel has accelerated its global footprint reset for 2026 after receiving investments from the US government, SoftBank, and Nvidia...

Monday 20 July 2026
Taiwan-US 'co-make' white paper debuts amid investment boom

Taiwan Semiconductor Manufacturing Company's (TSMC) announcement of an additional US$100 billion investment into US manufacturing has...

Monday 20 July 2026
3GPP sets 6G Release 21 timeline as industry begins preparing for next-gen networks

The global race toward 6G has entered a new phase after the 3rd Generation Partnership Project (3GPP) finalized the development timeline...

Monday 20 July 2026
Merck ramps up AI semiconductor materials push as Level Up nears completion

AI is redrawing the rules of semiconductor competition, pushing materials suppliers beyond simple chemical inputs and toward integrated...

Monday 20 July 2026
CXMT's US$4B IPO fuels DRAM capacity race toward 350,000 wafers a month

Chinese DRAM maker ChangXin Memory Technologies (CXMT) is accelerating construction and technology upgrades across its manufacturing...

Monday 20 July 2026
India roundup: India deepens semiconductor and AI ambitions as local ecosystem expands beyond fabs and assembly
India is broadening its technology strategy from attracting chip factories to building semiconductor equipment, materials, AI capabilities, supply chains and trade partnerships as...
Monday 20 July 2026
MiTAC packs 96 AMD GPUs into 52U liquid-cooled rack
MiTAC Computing Technology, a subsidiary of MiTAC Holdings, showcased its server lineup and high-density liquid-cooled rack solutions at the 2026 World Artificial Intelligence Conference...
Sunday 19 July 2026
The AI investment race is building its own bust, BIS paper warns
The competitive race to dominate artificial intelligence is driving technology giants to over-build computing capacity by roughly half again more than is economically efficient —...
Sunday 19 July 2026
ASML supplier Trumpf says South Korea EUV demand is growing faster than Taiwan's
High-NA EUV lithography is becoming the semiconductor equipment industry's next major battleground as demand rises for more advanced chips used in artificial intelligence, high-performance...
Saturday 18 July 2026
Column: South Korea's semiconductor strategy faces foresight and structural gaps
South Korea's technology policies—including the two semiconductor strategies discussed previously and the broader K-Moonshot initiative introduced more recently—have been...
Saturday 18 July 2026
JNTC-TOPPAN glass substrate push signals AI packaging supply-chain shift
As AI accelerators and high-bandwidth memory (HBM) packages grow larger and more complex, substrate technology is becoming a new constraint in advanced packaging. Organic substrates...