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Friday 3 July 2026
India and Japan deepen economic security ties at New Delhi summit
Japanese Prime Minister Sanae Takaichi held her first summit with Indian Prime Minister Narendra Modi in New Delhi on July 2, during a three-day visit that both governments framed...
Friday 3 July 2026
Tsinghua chip veteran’s US$1.8bn 3D AI chip startup targets China’s GPU gap

China's AI chip sector has a heavyweight new entrant: veteran semiconductor figure Shaojun Wei has formally unveiled Shanghai Orient...

Friday 3 July 2026
Competing Paths in Data Center Optics: XPO Could Beat CPO to Mass Production in 2027
DIGITIMES notes that Arista Networks unveiled XPO at The Optical Fiber Communication Conference and Exhibition 2026 (OFC 2026). Unlike CPO, which is associated with more disruptive...
Friday 3 July 2026
Kioxia begins sample shipments of 10th-generation flash memory
Kioxia has begun sample shipments of 1Tb triple-level-cell memory devices built with its 10th-generation BiCS FLASH 3D flash memory technology. The move underscores the race to supply...
Friday 3 July 2026
Taiwan, Japan deepen end-of-life vehicle recycling cooperation to unlock circular economy opportunities
As global efforts toward the circular economy and net-zero emissions accelerate, the European Union has continued revising its End-of-Life Vehicles (ELV) Directive to establish a vehicle...
Friday 3 July 2026
Huawei's Ascend AI chips target South Korea in new Nvidia challenge

Huawei is reportedly preparing to launch its AI chips in South Korea for the first time in the fourth quarter of 2026, as rising demand...

Thursday 2 July 2026
AUO pushes AI-era transformation with executive reshuffle, launch of innovation institute
Taiwanese optoelectronics specialist AUO announced organizational adjustments and senior executive appointments on July 1 as it continues to advance its business transformation. The...
Thursday 2 July 2026
Supermicro: We are cooperating with Taiwan, not under investigation

Supermicro has pushed back against media characterizations of this week's events in Taiwan, saying the company is a cooperating party...

Thursday 2 July 2026
Socionext to develop TSMC A14 chiplet for AI data center SoCs

Socionext announced that it would develop a high-performance compute chiplet using TSMC's A14 process technology, positioning the project...

Thursday 2 July 2026
BOE, Chinese panel makers' chip push tightens the squeeze on South Korea

China's display makers, led by BOE Technology (BOE), are pushing deeper into semiconductors, with BOE advancing glass substrates, and...

Thursday 2 July 2026
South Korea plans CIA-style fund to build its own Palantir

South Korea plans to set up a government-backed venture fund modeled on the CIA's In-Q-Tel, betting that direct state investment can...

Thursday 2 July 2026
Fujifilm India signs MoU to assess semiconductor materials manufacturing in Gujarat

Fujifilm India said it has signed a memorandum of understanding with the Gujarat State Electronics Mission, under the Department of...

Thursday 2 July 2026
LG Electronics creates robot business center to scale physical AI and robotics supply chain
LG Electronics announced the creation of a robot business center to accelerate its physical AI and robotics efforts, the company said. The new organization will consolidate development,...
Thursday 2 July 2026
Samsung showcases 3D stacked transistor breakthrough for next-gen chips

Samsung Electronics has unveiled new research on a three-dimensional transistor architecture that it says could help extend logic chip...

Thursday 2 July 2026
IBM's 0.7nm chip claim revives debate over semiconductor node naming

As semiconductor manufacturing enters the 2nm era, conventional transistor scaling is approaching its physical limits. On June 25,...