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    NEWS TAGGED TECHNOLOGY
    Friday 21 August 2026
    DS Technology shifts from custom automation to modular systems, eyes Brazil and Mexico

    Taiwanese automation integrator DS Technology is shifting more of its highly customized robotic automation work toward standardized,...

    Friday 21 August 2026
    Broadcom reportedly eyes up to US$100B debt financing to expand AI chip push
    Broadcom is in talks with asset managers to raise more than US$60 billion in debt financing, with the potential package reaching as much as US$100 billion, as the chipmaker moves to...
    Friday 21 August 2026
    CoWoS boom lifts Taiwan semiconductor equipment makers, Bosch Rexroth targets 2027 volume growth
    Bosch Rexroth, the industrial technology subsidiary of Bosch, showcased advanced semiconductor and smart manufacturing solutions at the 2026 Taipei International Industrial Automation...
    Friday 21 August 2026
    Xiaomi's Xring O3 nears launch on TSMC N3P, testing its in-house chip strategy
    Xiaomi is preparing to take its in-house smartphone silicon further upmarket, with founder and chairman Lei Jun confirming that a new generation of its Xring chip is on the...
    Friday 21 August 2026
    Iris Optronics upgrades solar-powered ChLCD e-paper series, expands outdoor and indoor displays
    Iris Optronics, a manufacturer of cholesteric liquid crystal display (ChLCD) e-paper, announced upgrades to its Infinity solar-powered ChLCD e-paper series, including a mass-producible...
    Friday 21 August 2026
    FOPLP's race to scale: Taiwan leads while three technical hurdles test mass production

    Rising demand for AI computing power is increasing chip package sizes, bringing fan-out panel-level packaging (FOPLP) into sharper focus...

    Friday 21 August 2026
    Research Insight: CPO gains momentum as AI interconnect demands outpace chip gains
    The AI industry is watching the rise of co-packaged optics (CPO) as faster AI systems now depend on more efficient links between chips and data centers. At DIGITIMES Tech Forum 2026...
    Friday 21 August 2026
    Micron launches long-horizon research hub to push memory and AI development
    Micron's new US research hub could influence how future AI systems are built, stored, and scaled, with implications that extend well beyond America. The planned US$10 billion effort...
    Friday 21 August 2026
    US ban on robot dogs clears the way for Taiwan's Swancor
    To safeguard national security and the development of the AI supply chain, the US has banned imports of advanced humanoid robots. Against that backdrop, Taiwan-based Swancor unveiled...
    Friday 21 August 2026
    JCET hits 1.5μm TSV milestone for denser HBM and 2.5D/3D packaging
    JCET Group has completed trial production of a 1.5μm-diameter, 17μm-deep through-silicon via (TSV) with an aspect ratio of 11.3:1, extending its advanced packaging capabilities...
    Friday 21 August 2026
    Korean display makers step up OLED patent push as China narrows technology gap
    Korean display makers are stepping up patent licensing and cross-border enforcement as Chinese rivals have sharply narrowed the technology and market-share gap in OLED since 2020,...
    Friday 21 August 2026
    Samsung holds off on High-NA EUV until 1nm production
    Samsung Electronics does not expect to move High-NA EUV lithography into volume production until its 1nm-class generation, a timeline that points to around 2030, after it had earlier...
    Friday 21 August 2026
    Column: Is 800V really 'high voltage'? —AI data centers revive an old power debate
    High-voltage direct current (HVDC) is currently one of the hottest areas of technology and product development for AI data centers. It is not only the first layer of what Nvidia CEO...
    Thursday 20 August 2026
    Unitree post-IPO: Chairman Wang weighs profit, scale and 80% home-robot threshold

    Unitree Robotics' August 19 listing on China's STAR Market brought the humanoid robot maker into the public-market spotlight, but attention...

    Thursday 20 August 2026
    Nexcom brings together dozens of partners to build open AI robotics ecosystem
    Industrial computer (IPC) maker Nexcom International on August 19 officially unveiled its RoboWIZ AI Robotics Open Platform concept at the 2026 Automation Taipei exhibition, bringing...
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    BIZ FOCUS
    Aug 20, 11:00
    Corning-IRICO Trade Secret Case Enters New Phase
    Thursday 20 August 2026
    PGC Helps Startups Accelerate ASIC Development with Turnkey Services
    Thursday 20 August 2026
    Chroma's Proprietary ASIC Technology Reshapes the Semiconductor Test Landscape
    Thursday 20 August 2026
    Henkel Launches LOCTITE ABLESTIK CDF900 Series Conductive Die Attach Film
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