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Saturday 1 August 2026
Obituary: Powerchip chairman Frank Huang dies after reshaping Taiwan's DRAM and foundry industry

Powerchip Semiconductor Manufacturing Corp. (PSMC) chairman Frank Huang died on July 31, 2026, at age 76, closing a career that spanned...

Saturday 1 August 2026
Tandem OLED clears key automotive qualification hurdle, wider adoption expected after 2030

LCD panels still account for more than 90% of automotive display shipments, but OLED has now crossed a critical qualification threshold...

Saturday 1 August 2026
Thintronics wins proposed US CHIPS incentives for advanced substrate technology
Thintronics, a semiconductor interconnect company, said in a press release on July 29 that it had signed a letter of intent with the US Department of Commerce and the CHIPS Research...
Saturday 1 August 2026
Lite-On expands InP optical push with US$34.3 million stake in Singapore's DenseLight
Lite-On Technology is extending its optical core competencies into system-level optical communications for AI data centers, announcing a US$34.3 million investment for a 21% stake...
Friday 31 July 2026
MJ Taiwan names Maverick Shih chair, prioritizes AI, cybersecurity and space technologies

The Monte Jade Science and Technology Association of Taiwan (MJ Taiwan) elected Maverick Shih, chairman of Acer Cyber Security (ACSI),...

Friday 31 July 2026
Elon Musk denies rumored Tesla China contingency plans; discussions on supply chain localization shifts persist
Tesla CEO Elon Musk has denied a Wall Street Journal report on an internal plan within Tesla to prepare for a possible separation of its China operations. Despite his rebuttal,...
Friday 31 July 2026
Research Insight: CXMT reaches 7.67% DRAM share with US$4.4B IPO, 2028 tech roadmap
CXMT's IPO marks a shift in China's DRAM strategy from capacity building towards mainstream products, process upgrades, and global competition, according to DIGITIMES Intelligence.
Friday 31 July 2026
Kioxia begins sampling 1TB 3D flash memory for AI devices
Kioxia has begun shipping samples of 1TB triple-level cell memory devices built with its 9th-generation BiCS FLASH 3D flash memory technology. The move signals faster, lower-cost storage...
Friday 31 July 2026
TSMC reportedly develops EMIB-like packaging to counter Intel

TSMC is reportedly developing a new advanced chip-packaging technology modeled on Intel's Embedded Multi-die Interconnect Bridge (EMIB),...

Friday 31 July 2026
India's first telecom manufacturing zone to land in Madhya Pradesh

India has moved to build a major telecom manufacturing hub in Gwalior, a step that could reshape supply chains, investment flows, and...

Friday 31 July 2026
AUO names current CFO president as Frank Ko steps down

AUO's board of directors on July 30 approved a change in senior management, appointing Chief Financial Officer Chang Po-Yi as the company's...

Friday 31 July 2026
Intel's rare Atom IP deal gives RosaicLabs a shortcut to custom x86 chips

Intel has granted stealth chip startup RosaicLabs access to parts of its Atom processor technology, potentially including register-transfer...

Friday 31 July 2026
WAIC 2026 unveils AIDV shift as physical AI gains ground
DIGITIMES Intelligence said its observations at the 2026 World Artificial Intelligence Conference (WAIC) show the automotive industry's transformation moving from software-defined...
Friday 31 July 2026
ams OSRAM's Micro LED links trade speed for scale in AI data centres

ams OSRAM is developing Micro LED-based optical data links for AI data centres, positioning the technology as a high-density, scalable...

Friday 31 July 2026
TAIONE foundation launches with NT$300 million to build Taiwan's open source AI push
The TAIONE Open Source Foundation was officially launched on the 30th and said it will deploy NT$300 million in private-sector resources over the next three years to advance open-source...