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Wednesday 16 September 2026
LEOTEK completes real-world test of AI traffic system at US smart city lab

Leotek Electronics has completed a real-world deployment of its Interlux AI Traffic Signal System in Georgia, highlighting how cities...

Wednesday 16 September 2026
Samsung and Qualcomm jointly developing organic bridges for 2.1D packaging
Samsung Electro-Mechanics and Qualcomm are working together to develop an organic bridge for 2.1D packaging architectures. The partnership takes place as AI chips grow larger, denser,...
Wednesday 16 September 2026
EV batteries cannot simply power humanoid robots, with energy density and costs posing key hurdles
Power battery technology has reached maturity in the new energy vehicle (NEV) market, but transferring it to humanoid robots presents two major barriers: the need for significant technological...
Wednesday 16 September 2026
SK Hynix, Intel in talks on US production to ease memory crunch
SK Hynix is in talks with Intel about a potential deal that could give the South Korean company its first memory chip manufacturing operation in the US, as tight supply pushes customers...
Wednesday 16 September 2026
Glass substrates, TGV set to reshape 2027 advanced packaging race
As AI chip package sizes continue to expand, advanced packaging is moving up the technology ladder. Glass substrate and through-glass via (TGV) technologies have become a new competitive...
Wednesday 16 September 2026
MediaTek keeps Dimensity 9600 Pro on HBPoP as cost drives decisions

MediaTek officially unveiled the Dimensity 9600 Pro on September 15, 2026, drawing significant industry attention to its choice of packaging...

Wednesday 16 September 2026
Advanced processes have no ready-made answers, says TSMC's COO

Taiwan Semiconductor Manufacturing Company (TSMC) chairman C.C. Wei and co-chief operating officer Y.J. Mii participated in the "Cross-Generational...

Wednesday 16 September 2026
Interview: Forget transistors — speed is what's choking the chip supply chain, says Qnity exec
The global surge in AI demand is accelerating change across the semiconductor industry, and as Moore's Law scaling faces physical limits, chipmaking is no longer only about shrinking...
Wednesday 16 September 2026
ITRI showcases AI robots, drones to push commercialization in southern Taiwan

The Industrial Technology Research Institute (ITRI) held its ITRI Innovation Day on September 15 in Tainan, Taiwan, bringing together...

Wednesday 16 September 2026
As AI data centers hit a transmission wall, GlobalFoundries pushes into silicon photonics
At the China International Optoelectronics Expo (CIOE), a palm-sized metal transceiver represents the shift from copper to light in data center infrastructure, one of the biggest transformations...
Wednesday 16 September 2026
DIGITIMES Insight: NVHBM is not a memory revolution; Nvidia seeks to platformize cHBM, dominate custom AI architectures

DIGITIMES observed that Nvidia's newly announced NVHBM is not a brand-new memory technology, but rather an extension of existing custom...

Wednesday 16 September 2026
DIGITIMES Insight: Intel may lack a price edge over TSMC on SK Hynix HBM base dies

SK Hynix is reportedly considering Intel as an additional manufacturing source for high-bandwidth memory (HBM) base dies beginning with...

Tuesday 15 September 2026
Interview: Corning sees CPO, glass core as new semiconductor battlegrounds

As artificial intelligence applications accelerate, surging global semiconductor demand is pushing advanced packaging, co-packaged optics...

Tuesday 15 September 2026
BYD's 2027 triple play could rewrite the EV race

BYD is lining up solid-state batteries, faster charging, and higher-level automated driving around 2027, potentially removing several...

Tuesday 15 September 2026
Sivers Semiconductors positions laser arrays as solution to copper's limits

At this year's China International Optoelectronic Expo (CIOE), Sivers Semiconductor brought two products to its booth that trace the...