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Monday 13 July 2026
SK hynix shares plunge after blockbuster Nasdaq ADR debut

SK hynix shares suffered their steepest-ever decline on Monday, just one trading day after the memory chipmaker made a strong debut...

Monday 13 July 2026
Intel eyes dual-side power in 1.4nm push against TSMC

Intel is reportedly preparing a new technology roadmap for its next-generation 1.4nm process, 14A2, as it evaluates a hybrid architecture...

Monday 13 July 2026
TSMC June 2026 revenue surges 68% as AI demand continues to fuel growth
TSMC reported another month of strong revenue growth, underscoring continued demand for advanced chips used in AI applications. According to the company's June revenue report, consolidated...
Monday 13 July 2026
Tencent seeks control of Manus after China blocks Meta's US$2 billion AI deal

Tencent is in talks to become the largest shareholder in Manus, leading a proposed buyback of the AI agent startup after Chinese regulators...

Monday 13 July 2026
CPO mass production accelerates new four-stage test equipment market
AI-driven demand is accelerating the shift of co-packaged optics (CPO) from technology validation to mass production, triggering a new wave of equipment demand. Companies including...
Monday 13 July 2026
India opens first CMP pad technology hub in Hyderabad
India's first Chemical Mechanical Polishing pad technology hub could help reshape semiconductor supply chains far beyond the country. The new Hyderabad facility aims to build local...
Monday 13 July 2026
Taiwan's Jiin Ming joins Japan-Ukraine Drone Cluster talks on drone systems
Taiwanese drone manufacturer Jiin Ming Industry attended the launch press conference for the Japan-Ukraine Drone Cluster (JUDC) at the Foreign Correspondents' Club of Japan (FCCJ)...
Monday 13 July 2026
Europe, UK, and US financial sectors respond differently as advanced AI reshapes industry and regulation
Advanced artificial intelligence (AI) is becoming a growing focus for financial regulators and technology companies across Europe, the UK, and the US, with authorities placing increasing...
Monday 13 July 2026
SK Hynix hybrid bonding push signals next phase of HBM packaging race
SK Hynix is moving early to prepare hybrid bonding technology for next-generation high-bandwidth memory (HBM), as competition in AI memory shifts from stacking capacity toward packaging...
Monday 13 July 2026
Largan ramps variable aperture lens in 3Q as smartphone demand rebounds
Optical leader Largan Precision said on July 9 that customer demand for new smartphones is picking up in the second half, while Chairman En-Ping Lin highlighted that strong technology...
Monday 13 July 2026
Musk assembles Intel, SpaceX talent for Tesla wafer fab ambitions

Tesla and SpaceX are already converging around chips, talent and manufacturing under Terafab, even before any merger speculation turns...

Sunday 12 July 2026
Infinitix signs Sarawak AI pact to expand Southeast Asia cloud services
Taiwan-based AI infrastructure software provider Infinitix signed a memorandum of understanding with Sarawak Information Systems Sdn. Bhd. (SAINS) to jointly promote AI infrastructure,...
Sunday 12 July 2026
SmartSens targets 2027 commercialization of Micro LED optical interconnects for AI infrastructure
The rapid expansion of AI servers and large language models (LLMs) is driving unprecedented demand for data center computing, making high-speed interconnect technologies one of the...
Saturday 11 July 2026
Taiwan connector maker Bellwether turns high-current design into patent licensing moat

Bellwether Electronic has evolved from a connector and wire harness manufacturer into a technology developer shaping industry standards...

Saturday 11 July 2026
WITS posts record first-half revenue as AI and chip design drive growth
WITS reported consolidated revenue of NT$1.233 billion (US$38.41 million) in June, up 7.3% from May and 37.1% from a year earlier. The Taiwan-based IT services provider also said second-quarter...