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Tuesday 4 August 2026
SK Hynix, Sandisk release first HBF specs with up to 512GB and 3TB/s bandwidth
SK Hynix and Sandisk released the first standard specifications for High Bandwidth Flash (HBF) on August 4, defining a NAND-based memory technology with a capacity of up to 512GB and...
Tuesday 4 August 2026
China's chip output jumps nearly 350% in a decade as semiconductor supply chain expands
China's industrial enterprises above the designated size produced 484.28 billion integrated circuits in 2025, up nearly 350% from 108.72 billion in 2015, as the country expanded manufacturing...
Tuesday 4 August 2026
China claims 8 in 10 robots worldwide are made at home

China's National Development and Reform Commission (NDRC) said humanoid robots have become a key symbol of the country's emerging manufacturing...

Tuesday 4 August 2026
CXMT reportedly weighs second Beijing DRAM fab as Chinese cities compete for memory chip investment

China's leading DRAM maker ChangXin Memory Technologies (CXMT) is considering building a second 12-inch memory chip fabrication plant in...

Tuesday 4 August 2026
Taiwan-Japan semiconductor ties go beyond supply chain partnerships
Cooperation between Taiwan and Japan in semiconductors will go beyond supply-chain partnerships towards joint technological innovation and talent development, according to Taiwan's...
Tuesday 4 August 2026
Palantir raises outlook as US commercial AI demand accelerates, sharpening sovereignty strategy
Palantir Technologies raised its full-year revenue and profitability forecasts after reporting a sharp acceleration in commercial demand, particularly in the US, underscoring the growing...
Tuesday 4 August 2026
China's Momenta wins nationwide Level 4 testing permit in Germany, widening robotaxi race

China's Momenta has become the first Chinese autonomous-driving company to receive a nationwide Level 4 testing permit from Germany's...

Tuesday 4 August 2026
Sandisk and SK Hynix release HBF spec to advance AI memory standard
Sandisk and SK Hynix have published a technical specification for high-bandwidth flash through the Open Compute Project, a move that could shape future AI infrastructure worldwide...
Tuesday 4 August 2026
SK hynix Unveils First HBF Standard Specifications with Sandisk

SK hynix Inc. (or "the company", www.skhynix.com) announced today in collaboration with Sandisk that it has unveiled the first standard specifications for High Bandwidth...

Monday 3 August 2026
Memory makers lift capex as Kioxia holds spending to defend NAND lead
Major memory suppliers are increasing capital spending as AI-related demand from U.S. technology companies accelerates, but Kioxia is keeping investment comparatively tight. According...
Monday 3 August 2026
Asia Optical's 2Q26 operating profit hits record high on strong revenue and gross profit growth

Asia Optical reported record operating profit for the second quarter of 2026, as consolidated revenue, gross profit and operating profit...

Monday 3 August 2026
Intel offers bonuses to speed up Ohio fab construction and reaches EMIB-T yields of 90%
Intel is awarding bonuses for overtime work as it seeks to complete the construction of its Ohio fab complex by 2031. Meanwhile, the company has made progress on the development of...
Monday 3 August 2026
India advances semiconductor ambitions as Visakhapatnam OSAT plant anchors South India packaging push

India is moving deeper into semiconductor manufacturing with construction beginning on an INR23.87 billion (US$250 million) OSAT facility...

Monday 3 August 2026
FICG launches Singapore-Malaysia dual-core strategy
FICG's advanced manufacturing subsidiary PRO3C signed a memorandum of understanding (MOU) with AME Elite Consortium Berhad, a Malaysia-listed integrated industrial space solutions...
Monday 3 August 2026
Elevated Materials names Jay Wang as chief revenue officer
Elevated Materials has appointed Jay Wang as chief revenue officer as the battery materials company seeks to speed commercialization and widen its global reach. The move could matter...