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Thursday 18 June 2026
Darwin organ chip joins Nvidia AI medical push
Backlight module maker Darwin held its shareholders' meeting on June 17, 2026, and said it remains cautiously optimistic about 2026 revenue as its new businesses continue to gain traction...
Thursday 18 June 2026
AI chip boom strains probe card supply, Taiwan test interface maker weighs prepayment deals
MPI Corporation, a major probe card supplier, said AI demand is tightening supply across the probe card market and extending order visibility, with the company considering a prepayment...
Thursday 18 June 2026
G7 AI talks reveal trust gap behind US model power
The world's most powerful AI companies entered the G7 summit in France this week with a message for democratic governments: frontier AI needs global rules, but those rules are increasingly...
Thursday 18 June 2026
FOPLP race heats up as Innolux reportedly teams with TSMC
As AI chip technology advances, larger chip sizes and heterogeneous integration packaging are driving bigger package dimensions, pushing semiconductor makers to adopt FOPLP over FOWLP...
Thursday 18 June 2026
AI glasses race turns into a battle of devices, LLMs, and user interfaces

AI glasses are gaining momentum as Meta, Rokid, RayNeo, Xreal, Viture, HTC, and other vendors step up their efforts, with Google and...

Thursday 18 June 2026
Analysis: Chinese firms tap Singapore-Malaysia model to shed 'Made in China' label — but hurdles remain

The global semiconductor and high-tech manufacturing landscape continues to undergo structural realignment. An increasing number of...

Thursday 18 June 2026
SK hynix Ships Samples of 12-Layer Next-Gen 'HBM4E'

SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has shipped samples of HBM4E, a next-generation DRAM for AI, to major customers.

Thursday 18 June 2026
Exclusive: Penang moves up value chain; Galatek flags deep-tech, IP hurdles
Penang has played a critical role in the global semiconductor back-end industry for decades, particularly in assembly, testing, and packaging (ATP). The region has built a highly competitive...
Thursday 18 June 2026
Interview: MicroLED and SiPh eye 3.2T AI data race
The AI wave is rapidly reshaping the global semiconductor supply chain, and that upheaval is opening a new growth chapter for Taiwan's LED industry. As Taiwan's LED makers move away...
Thursday 18 June 2026
Exclusive: Galatek sees Penang facility driving semiconductor, life sciences ecosystem growth
Beyond its established role in assembly, testing and packaging (ATP), Penang's next stage of development will depend on its ability to deepen capabilities in precision engineering,...
Wednesday 17 June 2026
Commentary: US delays DeepSeek blacklist, exposing AI export-control dilemma
The US has held back from adding Chinese AI startup DeepSeek, memory chipmaker CXMT, and more than 100 other entities to a key trade blacklist, underscoring Washington's struggle to...
Wednesday 17 June 2026
BOE starts production at China's first 8.6G AMOLED line
BOE Technology Group has begun mass production at its Chengdu high-tech zone facility, a move that could reshape the supply of OLED displays for notebooks and tablets, while intensifying...
Wednesday 17 June 2026
Bull and Foxconn to build Nvidia's latest AI servers in Europe

Bull, the French computing company, and Foxconn announced Tuesday that they will manufacture systems based on Nvidia's Vera Rubin NVL72...

Wednesday 17 June 2026
Taiwan's Astrogate taps South Korean wireless conferencing market, secures LG, SK Hynix
Taiwan-based wireless collaboration solutions provider Astrogate is establishing South Korea as its primary growth market. The company is leveraging cross-brand compatibility, secure...
Wednesday 17 June 2026
Exclusive: Largan taps Han's Laser equipment as optics makers target FAU growth

Taiwan optical leader Largan Precision has disclosed an equipment order worth about NT$650 million (US$20.6 million) from Chinese laser-processing...