Amid ongoing shifts in panel market cycles and end-market demand, AUO continues to press forward with its strategic corporate transformation. Marking its 30th anniversary in 2026,...
China's Moonshot AI is seeking to settle a shareholder dispute involving claims potentially exceeding US$700 million ahead of a potential US$5 billion Hong Kong initial public offering...
South Korean wireless communications module maker Nucode has signed a memorandum of understanding (MOU) with US drone identification and airspace intelligence provider Zing Drone Solutions...
Global technology companies and South Korean system integrators are widening their artificial intelligence hiring beyond model researchers to frontline engineers who work inside customer...
LG Display has unveiled a new organic light-emitting diode (OLED) manufacturing technology designed to improve production efficiency and display performance, and reduce manufacturing...
Episil held an earnings call on October 7, saying silicon carbide (SiC) capacity utilization has rebounded quickly from 30% at a low point to nearly 90% now. If 6-inch order demand...
As defense technology and unmanned vehicles increasingly extend beyond traditional defense industries into the ICT and semiconductor sectors, Taiwan's manufacturers are being urged...
US President Donald Trump will award the National Medal of Science to Nvidia CEO Jensen Huang and several other tech leaders, with major figures from the industry set to gather again...
As explosive AI computing demand drives hardware architecture change, Taiwan Printed Circuit Association (TPCA) is set to open its annual flagship event, with the 21st International...
Samsung Electro-Mechanics (Semco) has reportedly completed initial reliability testing of its 100mm glass substrates and moved to package-level verification using customer chips, marking...
GF said on October 8, 2026, that it has signed a multi-year, US$2 billion manufacturing agreement with TSMC to produce silicon interposers for TSMC's CoWoS ecosystem at its Malta,...
AI chip manufacturing demands are accelerating development of advanced logic and packaging technologies, prompting Applied Materials and Intel to expand their collaboration on next-generation...
Lam Research is launching its first country-specific semiconductor venture fund in South Korea after shipping its 15,000th locally manufactured processing chamber, deepening its manufacturing...
